BFP405FH6327XTSA1 [INFINEON]

RF Small Signal Bipolar Transistor, 0.012A I(C), 1-Element, L Band, Silicon, NPN, 1.40 X 0.80 MM, 0.59 MM HEIGHT, ROHS COMPLIANT, TSFP-4;
BFP405FH6327XTSA1
型号: BFP405FH6327XTSA1
厂家: Infineon    Infineon
描述:

RF Small Signal Bipolar Transistor, 0.012A I(C), 1-Element, L Band, Silicon, NPN, 1.40 X 0.80 MM, 0.59 MM HEIGHT, ROHS COMPLIANT, TSFP-4

放大器 光电二极管 晶体管
文件: 总6页 (文件大小:530K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BFP405F  
Low Noise Silicon Bipolar RF Transistor  
For low current applications  
3
2
1
Minimum noise figure NF  
= 1.25 dB at 1.8 GHz  
4
min  
Outstanding G = 22.5 dB at 1.8 GHz  
ms  
Transition frequency f = 25 GHz  
T
Pb-free (RoHS compliant) and halogen-free thin small  
flat package (1.4 x 0.8 x 0.59 mm) with visible leads  
Qualification report according to AEC-Q101 available  
ESD (Electrostatic discharge) sensitive device, observe handling precaution!  
Type  
BFP405F  
Marking  
ALs  
Pin Configuration  
1=B 2=E 3=C 4=E  
Package  
TSFP-4  
-
-
Maximum Ratings at T = 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Value  
Unit  
V
Collector-emitter voltage  
V
CEO  
T = 25 °C  
4.5  
4.1  
15  
15  
1.5  
25  
3
A
T = -55 °C  
A
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
Base current  
Total power dissipation  
V
V
V
CES  
CBO  
EBO  
mA  
mW  
°C  
I
C
I
B
1)  
75  
P
tot  
T 112 °C  
Junction temperature  
S
150  
T
J
Storage temperature  
T
-55 ... 150  
Stg  
1
T is measured on the emitter lead at the soldering point to the pcb  
S
Thermal Resistance  
Parameter  
Junction - soldering point  
Symbol  
Value  
500  
Unit  
K/W  
1)  
R
thJS  
1
2013-09-19  
BFP405F  
Electrical Characteristics at T = 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
DC Characteristics  
4
-
5
-
-
V
Collector-emitter breakdown voltage  
V
(BR)CEO  
I = 1 mA, I = 0  
C
B
10  
µA  
Collector-emitter cutoff current  
= 15 V, V = 0  
I
CES  
V
CE  
BE  
-
-
100 nA  
Collector-base cutoff current  
= 5 V, I = 0  
I
CBO  
V
CB  
E
-
-
1
µA  
-
Emitter-base cutoff current  
= 0.5 V, I = 0  
I
EBO  
V
EB  
C
60  
95  
130  
DC current gain  
I = 5 mA, V = 4 V, pulse measured  
h
FE  
C
CE  
1
For the definition of R  
please refer to Application Note AN077 (Thermal Resistance Calculation)  
thJS  
2
2013-09-19  
BFP405F  
Electrical Characteristics at T = 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
AC Characteristics (verified by random sampling)  
18  
25  
-
GHz  
Transition frequency  
f
T
I = 10 mA, V = 3 V, f = 2 GHz  
C
CE  
-
-
-
0.05  
0.1 pF  
Collector-base capacitance  
= 2 V, f = 1 MHz, V = 0 ,  
emitter grounded  
C
C
C
cb  
ce  
eb  
V
CB  
BE  
0.2  
-
-
Collector emitter capacitance  
V
= 2 V, f = 1 MHz, V = 0 ,  
CE  
BE  
base grounded  
0.25  
Emitter-base capacitance  
V
= 0.5 V, f = 1 MHz, V = 0 ,  
EB  
CB  
collector grounded  
-
-
1.25  
22.5  
-
-
dB  
dB  
Minimum noise figure  
NF  
min  
I = 2 mA, V = 2 V, f = 1.8 GHz, Z = Z  
C
CE  
S
Sopt  
1)  
Power gain, maximum stable  
G
ms  
I = 5 mA, V = 2 V, Z = Z ,  
C
CE  
S
Sopt  
Z = Z  
, f = 1.8 GHz  
L
Lopt  
2
Insertion power gain  
= 2 V, I = 5 mA, f = 1.8 GHz,  
|S |  
-
-
-
18  
14  
0
-
-
-
21  
V
CE  
C
Z = Z = 50 Ω  
S
L
2)  
Third order intercept point at output  
= 2 V, I = 5 mA, f = 1.8 GHz,  
IP3  
dBm  
V
CE  
C
Z = Z = 50 Ω  
S
L
1dB compression point at output  
P
-1dB  
I = 5 mA, V = 2 V, Z = Z = 50 ,  
C
CE  
S
L
f = 1.8 GHz  
1
G
= |S / S |  
21 12  
ms  
2
IP3 value depends on termination of all intermodulation frequency components.  
Termination used for this measurement is 50from 0.1 MHz to 6 GHz  
3
2013-09-19  
BFP405F  
Total power dissipation P = ƒ(T )  
tot  
S
90  
mW  
70  
60  
50  
40  
30  
20  
10  
0
°C  
0
30  
60  
90  
150  
T
S
4
2013-09-19  
Package TSFP-4  
BFP405F  
5
2013-09-19  
BFP405F  
Edition 2009-11-16  
Published by  
Infineon Technologies AG  
81726 Munich, Germany  
2009 Infineon Technologies AG  
All Rights Reserved.  
Legal Disclaimer  
The information given in this document shall in no event be regarded as a guarantee  
of conditions or characteristics. With respect to any examples or hints given herein,  
any typical values stated herein and/or any information regarding the application of  
the device, Infineon Technologies hereby disclaims any and all warranties and  
liabilities of any kind, including without limitation, warranties of non-infringement of  
intellectual property rights of any third party.  
Information  
For further information on technology, delivery terms and conditions and prices,  
please contact the nearest Infineon Technologies Office (<www.infineon.com>).  
Warnings  
Due to technical requirements, components may contain dangerous substances.  
For information on the types in question, please contact the nearest Infineon  
Technologies Office.  
Infineon Technologies components may be used in life-support devices or systems  
only with the express written approval of Infineon Technologies, if a failure of such  
components can reasonably be expected to cause the failure of that life-support  
device or system or to affect the safety or effectiveness of that device or system.  
Life support devices or systems are intended to be implanted in the human body or  
to support and/or maintain and sustain and/or protect human life. If they fail, it is  
reasonable to assume that the health of the user or other persons may be  
endangered.  
6
2013-09-19  

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