BFP405H6740 [INFINEON]

RF Small Signal Bipolar Transistor, 0.025A I(C), 1-Element, L Band, Silicon, NPN, ROHS COMPLIANT PACKAGE-4;
BFP405H6740
型号: BFP405H6740
厂家: Infineon    Infineon
描述:

RF Small Signal Bipolar Transistor, 0.025A I(C), 1-Element, L Band, Silicon, NPN, ROHS COMPLIANT PACKAGE-4

放大器 光电二极管 晶体管
文件: 总9页 (文件大小:553K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BFP405  
Low Noise Silicon Bipolar RF Transistor  
For low current applications  
For oscillators up to 12 GHz  
3
2
1
4
Minimum noise figure NF  
= 1.25 dB at 1.8 GHz  
min  
Outstanding G = 23 dB at 1.8 GHz  
ms  
Pb-free (RoHS compliant) and halogen-free package  
with visible leads  
Qualification report according to AEC-Q101 available  
ESD (Electrostatic discharge) sensitive device, observe handling precaution!  
Type  
BFP405  
Marking  
ALs  
Pin Configuration  
1=B 2=E 3=C 4=E  
Package  
SOT343  
-
-
Maximum Ratings at T = 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Value  
Unit  
V
Collector-emitter voltage  
V
CEO  
T = 25 °C  
4.5  
4.1  
15  
15  
1.5  
25  
3
A
T = -55 °C  
A
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
Base current  
Total power dissipation  
V
V
V
CES  
CBO  
EBO  
mA  
mW  
°C  
I
C
I
B
1)  
75  
P
tot  
T 110 °C  
Junction temperature  
Ambient temperature  
S
150  
-65 ... 150  
-65 ... 150  
T
J
T
A
Storage temperature  
T
Stg  
1
T is measured on the emitter lead at the soldering point to the pcb  
S
1
2013-09-19  
BFP405  
Thermal Resistance  
Parameter  
Junction - soldering point  
Symbol  
Value  
530  
Unit  
K/W  
1)  
R
thJS  
Electrical Characteristics at T = 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
Unit  
min.  
typ. max.  
DC Characteristics  
4.5  
5
-
-
V
Collector-emitter breakdown voltage  
V
(BR)CEO  
I = 1 mA, I = 0  
C
B
-
-
10  
µA  
Collector-emitter cutoff current  
= 15 V, V = 0  
I
CES  
V
CE  
BE  
-
100 nA  
Collector-base cutoff current  
= 5 V, I = 0  
I
CBO  
V
CB  
E
-
-
1
µA  
-
Emitter-base cutoff current  
= 0.5 V, I = 0  
I
EBO  
V
EB  
C
60  
95  
130  
DC current gain  
I = 5 mA, V = 4 V, pulse measured  
h
FE  
C
CE  
1
For the definition of R  
please refer to Application Note AN077 (Thermal Resistance Calculation)  
thJS  
2
2013-09-19  
BFP405  
Electrical Characteristics at T = 25 °C, unless otherwise specified  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
AC Characteristics (verified by random sampling)  
18  
25  
-
GHz  
Transition frequency  
f
T
I = 10 mA, V = 3 V, f = 2 GHz  
C
CE  
-
-
-
0.05  
0.1 pF  
Collector-base capacitance  
= 2 V, f = 1 MHz, V = 0 ,  
emitter grounded  
C
C
C
cb  
ce  
eb  
V
CB  
BE  
0.24  
0.29  
-
-
Collector emitter capacitance  
V
= 2 V, f = 1 MHz, V = 0 ,  
CE  
BE  
base grounded  
Emitter-base capacitance  
V
= 0.5 V, f = 1 MHz, V = 0 ,  
EB  
CB  
collector grounded  
-
-
1.25  
23  
-
-
dB  
dB  
Minimum noise figure  
NF  
min  
I = 2 mA, V = 2 V, f = 1.8 GHz, Z = Z  
C
CE  
S
Sopt  
1)  
Power gain, maximum stable  
G
ms  
I = 5 mA, V = 2 V, Z = Z ,  
C
CE  
S
Sopt  
Z = Z  
, f = 1.8 GHz  
L
Lopt  
2
Insertion power gain  
= 2 V, I = 5 mA, f = 1.8 GHz,  
|S |  
14  
-
18.5  
15  
5
-
-
-
21  
V
CE  
C
Z = Z = 50 Ω  
S
L
2)  
Third order intercept point at output  
= 2 V, I = 5 mA, f = 1.8 GHz,  
IP3  
dBm  
V
CE  
C
Z = Z = 50 Ω  
S
L
1dB compression point at output  
P
-
-1dB  
I = 5 mA, V = 2 V, Z = Z = 50 ,  
C
CE  
S
L
f = 1.8 GHz  
1
G
= |S / S |  
21 12  
ms  
2
IP3 value depends on termination of all intermodulation frequency components.  
Termination used for this measurement is 50from 0.1 MHz to 6 GHz  
3
2013-09-19  
BFP405  
Total power dissipation P = ƒ(T )  
Permissible Pulse Load R  
= ƒ(t )  
thJS p  
tot  
S
10 3  
90  
mW  
70  
60  
50  
40  
30  
20  
10  
0
K/W  
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.005  
D = 0  
10 2  
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
°C  
s
0
30  
60  
90  
150  
T
t
p
S
Permissible Pulse Load  
Collector-base capacitance C = ƒ(V )  
cb  
CB  
P
/P  
= ƒ(t )  
f = 1MHz  
totmax totDC  
p
10 1  
0.3  
pF  
0.2  
0.15  
0.1  
D = 0  
0.005  
0.01  
0.02  
0.05  
0.1  
-
0.2  
0.5  
0.05  
10 0  
0
0
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2  
10 0  
0.5  
1
1.5  
2
2.5  
3
4
s
V
t
V
CB  
p
4
2013-09-19  
BFP405  
2
Transition frequency f = ƒ(I )  
Power gain G , G , |S | = ƒ (f)  
ma ms 21  
T
C
f = 2 GHz  
V
= 3 V, I = 5 mA  
CE  
C
V
= parameter in V  
CE  
26  
44  
GHz  
dB  
4V  
3V  
22  
20  
18  
16  
14  
12  
10  
8
36  
32  
28  
24  
20  
16  
12  
8
2V  
1.5V  
Gms  
1V  
|S21|²  
Gma  
0.5V  
6
4
4
0
mA  
GHz  
0
4
8
12  
16  
22  
0
1
2
3
4
5
6
7
8
10  
I
f
C
Power gain G , G = ƒ (I )  
Power gain G , G = ƒ (V )  
ma ms CE  
ma  
ms  
C
V
= 3V  
I = 5 mA  
CE  
C
f = parameter in GHz  
f = parameter in GHz  
40  
40  
0.15GHz  
dB  
dB  
0.15GHz  
0.45GHz  
0.45GHz  
0.9GHz  
32  
28  
24  
20  
16  
12  
8
32  
28  
24  
20  
16  
12  
8
0.9GHz  
1.5GHz  
2.4GHz  
1.5GHz  
1.9GHz  
2.4GHz  
3.5GHz  
5.5GHz  
3.5GHz  
5.5GHz  
10GHz  
10GHz  
4
4
0
0
mA  
V
0
4
8
12  
16  
20  
26  
0
1
2
3
4
6
I
V
CE  
C
5
2013-09-19  
BFP405  
Noise figure F = ƒ(I )  
Noise figure F = ƒ(I )  
C
C
V
= 2 V, Z = Z  
V = 2 V, f = 1.8 GHz  
CE  
S
Sopt  
CE  
4
4
dB  
dB  
3
2.5  
2
3
2.5  
2
1.5  
1
1.5  
1
f = 6 GHz  
f = 5 GHz  
f = 4 GHz  
f = 3 GHz  
f = 2.4 GHz  
f = 1.8 GHz  
f = 0.9 GHz  
ZS = 50 Ohm  
ZS = ZSopt  
0.5  
0
0.5  
0
mA  
mA  
0
2
4
6
8
12  
0
2
4
6
8
12  
I
I
C
C
Noise figure F = ƒ(f)  
Source impedance for min.  
V
= 1 V, Z = Z  
noise figure vs. frequency  
CE  
S
Sopt  
V
= 3 V, I = 2 mA / 5 mA  
CE  
C
3
+j50  
dB  
+j25  
+j100  
+j10  
2
1.5  
1
3GHz  
4GHz  
1.8GHz  
5GHz  
0.9GHz  
6GHz  
25  
0
10  
50  
100  
2mA  
5mA  
IC = 5 mA  
IC = 2 mA  
-j10  
0.5  
0
-j25  
-j100  
-j50  
GHz  
0
1
2
3
4
6
f
6
2013-09-19  
BFP405  
SPICE GP Model  
For the SPICE Gummel Poon (GP) model as well as for the S-parameters  
(including noise parameters) please refer to our internet website  
www.infineon.com/rf.models.  
Please consult our website and download the latest versions before actually  
starting your design. You find the BFP405 SPICE GP model in the internet  
in MWO- and ADS-format, which you can import into these circuit simulation tools  
very quickly and conveniently. The model already contains the package parasitics  
and is ready to use for DC and high frequency simulations. The terminals of the  
model circuit correspond to the pin configuration of the device. The model  
parameters have been extracted and verified up to 6 GHz using typical devices.  
The BFP405 SPICE GP model reflects the typical DC- and RF-performance  
within the limitations which are given by the SPICE GP model itself. Besides the DC  
characteristics all S-parameters in magnitude and phase, as well as noise figure  
(including optimum source impedance, equivalent noise resistance and flicker noise)  
and intermodulation have been extracted.  
7
2013-09-19  
Package SOT343  
BFP405  
8
2013-09-19  
BFP405  
Edition 2009-11-05  
Published by Infineon Technologies AG,  
85579 Neubiberg, Germany  
© Infineon Technologies AG 2009.  
All Rights Reserved.  
Attention please!  
The information herein is given to describe certain components and shall not be  
considered as a guarantee of characteristics.  
Terms of delivery and rights to technical change reserved.  
We hereby disclaim any and all warranties, including but not limited to warranties of  
non-infringement, regarding cicuits, descriptions and charts stated herein.  
Information  
For further information on technology, delivery terms and conditions and prices  
please contact your nearest Infineon Technologies Office (www.infineon.com).  
Warnings  
Due to technical requirements components may contain dangerous substances.  
For information on the types in question please contact your nearest Infineon  
Technologies Office.  
Infineon Technologies Components may only be used in life-support devices or  
systems with the express written approval of Infineon Technologies, if a failure of  
such components can reasonably be expected to cause the failure of that  
life-support device or system, or to affect the safety or effectiveness of that device  
or system.  
Life support devices or systems are intended to be implanted in the human body,  
or to support and/or maintain and sustain and/or protect human life. If they fail,  
it is reasonable to assume that the health of the user or other persons may be  
endangered.  
9
2013-09-19  

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