BFP420F [INFINEON]

NPN Silicon RF Transistor; NPN硅晶体管RF
BFP420F
型号: BFP420F
厂家: Infineon    Infineon
描述:

NPN Silicon RF Transistor
NPN硅晶体管RF

晶体 小信号双极晶体管 射频小信号双极晶体管 光电二极管 放大器
文件: 总4页 (文件大小:51K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BFP420F  
SIEGET 25  
NPN Silicon RF Transistor  
Preliminary data  
For high gain low noise amplifiers  
Smallest Package 1.4 x 0.8 x 0.59mm  
Noise figure F = 1.1 dB at 1.8 GHz  
XYs  
3
4
2
1
outstanding G = 20 dB at 1.8 GHz  
ma  
Transition frequency f = 25 GHz  
T
TSFP-4  
Gold metallization for high reliability  
t
o
p
v
i
e
w
SIEGET 25 GHz f - Line  
T
4
3
A
M
s
1
2
d
i
r
e
c
t
i
o
n
o
f
u
n
r
e
e
l
i
n
g
ESD: Electrostatic discharge sensitive device, observe handling precaution!  
Type  
Marking  
Pin Configuration  
2 = E 3 = C 4 = E  
Package  
BFP420F  
AMs  
1 = B  
TSFP-4  
Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
Collector-emitter voltage  
Collector-base voltage  
Emitter-base voltage  
Collector current  
V
V
V
4.5  
15  
V
CEO  
CBO  
EBO  
1.5  
35  
I
mA  
mW  
°C  
C
Base current  
I
3
B
P
160  
Total power dissipation  
tot  
1)  
T
111°C  
S
Junction temperature  
Ambient temperature  
Storage temperature  
T
150  
j
T
-65 ... 150  
-65 ... 150  
A
T
stg  
Thermal Resistance  
2)  
R
K/W  
Junction - soldering point  
240  
thJS  
1
T is measured on the emitter lead at the soldering point to the pcb  
S
2
For calculation of R  
thJA  
please refer to Application Note Thermal Resistance  
1
Dec-07-2001  
BFP420F  
SIEGET 25  
Electrical Characteristics at T = 25°C, unless otherwise specified.  
A
Parameter  
Symbol  
Values  
typ. max.  
Unit  
min.  
DC characteristics  
4.5  
-
5
-
-
V
V
Collector-emitter breakdown voltage  
I = 1 mA, I = 0  
(BR)CEO  
C
B
200 nA  
I
Collector-base cutoff current  
= 5 V, I = 0  
CBO  
V
CB  
E
-
-
35  
µA  
-
I
Emitter-base cutoff current  
= 1.5 V, I = 0  
EBO  
V
EB  
C
50  
80  
150  
h
DC current gain  
I = 20 mA, V = 4 V  
FE  
C
CE  
AC characteristics (verified by random sampling)  
18  
-
25  
0.15  
0.33  
0.5  
-
0.3  
-
GHz  
pF  
f
Transition frequency  
T
I = 30 mA, V = 3 V, f = 2 GHz  
C
CE  
C
Collector-base capacitance  
= 2 V, f = 1 MHz  
cb  
V
CB  
-
C
Collector-emitter capacitance  
= 2 V, f = 1 MHz  
ce  
V
CE  
-
-
C
Emitter-base capacitance  
= 0.5 V, f = 1 MHz  
eb  
V
EB  
-
1.1  
-
dB  
F
Noise figure  
I = 5 mA, V = 2 V, Z = Z  
,
C
CE  
S
Sopt  
f = 1.8 GHz  
1)  
-
-
-
-
20  
17  
-
-
-
-
Power gain, maximum available  
G
ma  
I = 20 mA, V = 2 V, Z = Z  
, Z = Z  
,
C
CE  
S
Sopt  
L
Lopt  
f = 1.8 GHz  
2
|S |  
Insertion power gain  
I = 20 mA, V = 2 V, f = 1.8 GHz,  
21  
C
CE  
Z = Z = 50  
S
L
2)  
24  
dBm  
IP  
Third order intercept point at output  
3
I = 20 mA, V = 2 V, Z =Z =50 ,  
C
CE  
S
L
f = 1.8 GHz  
3)  
10.5  
P
1dB Compression point at output  
I = 20 mA, V = 2 V, f = 1.8 GHz,  
-1dB  
C
CE  
Z =Z =50  
S
L
1
2
1/2  
= |S / S | (k-(k -1)  
21 12  
G
)
ma  
2
IP3 value depends on termination of all intermodulation frequency components. Termination used for this  
measurement is 50 from 0.1MHz to 6GHz.  
3
DC current no input power  
2
Dec-07-2001  
BFP420F  
SIEGET 25  
SPICE Parameters (Gummel-Poon Model, Berkley-SPICE 2G.6 Syntax) :  
Transistor Chip Data  
IS =  
BF =  
72.534  
0.48731  
7.8287  
0.69141  
8.5757  
0.31111  
0.8051  
0.42199  
0
NF =  
1.2432  
0.20045  
28.383  
fA  
V
-
-
VAF =  
NE =  
IKF =  
BR =  
IKR =  
RB =  
A
ISE =  
NR =  
ISC =  
IRB =  
RC =  
19.049  
1.3325  
fA  
2.0518  
19.705  
1.1724  
3.4849  
1.8063  
6.7661  
1
-
-
-
VAR =  
NC =  
RBM =  
CJE =  
TF =  
V
A
0.019237 fA  
0.72983  
0.10105  
0.46576  
0.23794  
234.53  
mA  
-
RE =  
fF  
VJE =  
XTF =  
PTF =  
MJC =  
CJS =  
XTB =  
FC =  
V
MJE =  
VTF =  
CJC =  
-
ps  
mA  
V
V
-
ITF =  
VJC =  
TR =  
deg  
fF  
0.81969  
2.3249  
0
0.30232  
0
XCJC = 0.3  
-
-
ns  
F
VJS =  
EG =  
TNOM  
0.75  
V
eV  
K
MJS =  
XTI =  
0
1.11  
300  
-
-
-
-
3
0.73234  
C'-E'-Diode Data (Berkley-SPICE 2G.6 Syntax) :  
IS = 3.5 fA N =  
RS =  
10  
1.02  
-
All parameters are ready to use, no scaling is necessary  
Package Equivalent Circuit:  
L =  
0.42  
nH  
nH  
nH  
L
=
0.22  
nH  
nH  
nH  
-
BI  
BO  
CCB  
R
=
0.15  
0.26  
0.11  
0.35  
0.13  
L
=
=
0.28  
0.22  
LBI  
EO  
L =  
L
EI  
CO  
L BO  
L BI  
L CI  
L CO  
B’  
Transistor  
Chip  
C’  
B
C
R
=
KBO-EO = 0.10  
KBO-CO = 0.01  
KEO-CO = 0.11  
LEI  
C’-E’-  
Diode  
E’  
L =  
-
CI  
CBE  
CCE  
R
=
-
LCI  
L EI  
KCI-EI = -0.05  
KBI-CI = -0.08  
KBI-EI = 0.20  
-
-
-
C
C
C
=
=
=
34  
2
fF  
fF  
fF  
BE  
BC  
CE  
L EO  
EHA07389  
E
33  
Valid up to 6GHz  
The TSFP-4 package has two emitter leads. To avoid high complexity of the package equivalent circuit,  
both leads are combined in one electrical connection.  
R
are series resistors for the inductances L and K  
xI xa-yb  
are the coupling coefficients between  
LxI  
the inductances L and L . The referencepins for the coupled ports are B, E, C, B`, E`, C`.  
xa yb  
For examples and ready to use parameters please contact your local Infineon Technologies  
distributor or sales office to obtain a Infineon Technologies CD-ROM or see Internet:  
http://www.infineon.com/silicondiscretes  
3
Dec-07-2001  
BFP420F  
SIEGET 25  
For non-linear simulation:  
Use transistor chip parameters in Berkeley SPICE 2G.6 syntax for all simulators.  
If you need simulation of the reverse characteristics, add the diode with the  
C'-E'- diode data between collector and emitter.  
Simulation of package is not necessary for frequencies < 100MHz.  
For higher frequencies add the wiring of package equivalent circuit around the  
non-linear transistor and diode model.  
Note:  
This transistor is constructed in a common emitter configuration. This feature causes  
an additional reverse biased diode between emitter and collector, which does not  
effect normal operation.  
C
B
E
E
EHA07307  
Transistor Schematic Diagram  
The common emitter configuration shows the following advantages:  
Higher gain because of lower emitter inductance.  
Power is dissipated via the grounded emitter leads, because the chip is mounted  
on copper emitter leadframe.  
Please note, that the broadest lead is the emitter lead.  
4
Dec-07-2001  

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