AO4800B [FREESCALE]
30V Dual N-Channel MOSFET; 30V双N沟道MOSFET型号: | AO4800B |
厂家: | Freescale |
描述: | 30V Dual N-Channel MOSFET |
文件: | 总6页 (文件大小:389K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AO4800B
30V Dual N-Channel MOSFET
General Description
provide excellent R
The AO4800B uses advanced trench technology to
MOSFETs make a compact and efficient switch and
converters.
DS(ON) and low gate charge. The two
synchronous rectifier combination for use in buck
Features
VDS
30V
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
6.9A
< 27mΩ
< 32mΩ
< 50mΩ
RDS(ON) (at VGS = 4.5V)
RDS(ON) (at VGS = 2.5V)
D1
D1
Top View
S2
G2
S1
G1
D2
D2
D1
D1
1
2
3
4
8
7
6
5
G2
G1
S1
S2
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Maximum
30
Units
Drain-Source Voltage
Gate-Source Voltage
V
V
VGS
±12
TA=25°C
TA=70°C
6.9
Continuous Drain
Current
ID
5.8
A
Pulsed Drain Current C
IDM
30
Avalanche Current C
IAS, IAR
EAS, EAR
14
A
Avalanche energy L=0.1mH C
TA=25°C
Power Dissipation B
10
2
mJ
PD
W
°C
TA=70°C
1.3
Junction and Storage Temperature Range
TJ, TSTG
-55 to 150
Thermal Characteristics
Parameter
Symbol
Typ
48
Max
Units
°C/W
°C/W
°C/W
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A D
Maximum Junction-to-Lead
t
≤ 10s
62.5
90
RθJA
Steady-State
Steady-State
74
RθJL
32
40
1/6
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AO4800B
30V Dual N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max Units
STATIC PARAMETERS
ID=250µA, VGS=0V
BVDSS
Drain-Source Breakdown Voltage
30
V
VDS=30V, VGS=0V
1
IDSS
Zero Gate Voltage Drain Current
µA
5
TJ=55°C
VDS=0V, VGS= ±12V
VDS=VGS ID=250µA
VGS=4.5V, VDS=5V
VGS=10V, ID=6.9A
IGSS
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
100
1.5
nA
V
VGS(th)
ID(ON)
0.7
30
1.1
A
17.8
28
27
40
32
50
mΩ
TJ=125°C
RDS(ON)
Static Drain-Source On-Resistance
VGS=4.5V, ID=6A
VGS=2.5V, ID=5A
VDS=5V, ID=5A
IS=1A,VGS=0V
19
mΩ
mΩ
S
24
gFS
VSD
IS
Forward Transconductance
Diode Forward Voltage
33
0.7
1
V
Maximum Body-Diode Continuous Current
2.5
A
DYNAMIC PARAMETERS
Ciss
Coss
Crss
Rg
Input Capacitance
630
75
50
3
pF
pF
pF
Ω
VGS=0V, VDS=15V, f=1MHz
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
VGS=0V, VDS=0V, f=1MHz
1.5
4.5
7
SWITCHING PARAMETERS
Qg
Qgs
Qgd
tD(on)
tr
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
6
1.3
1.8
3
nC
nC
nC
ns
ns
ns
ns
VGS=4.5V, VDS=15V, ID=6.9A
VGS=10V, VDS=15V, RL=2.2Ω,
RGEN=3Ω
2.5
25
4
tD(off)
tf
trr
IF=6.9A, dI/dt=100A/µs
IF=6.9A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
8.5
2.6
ns
Qrr
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
2/6
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AO4800B
30V Dual N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
40
35
30
25
20
15
10
5
15
12
9
10V
3V
VDS=5V
4.5V
2.5V
6
25°C
3
125°C
VGS=2V
0
0
0
0.5
1
1.5
2
2.5
3
0
1
2
3
4
5
VGS(Volts)
VDS (Volts)
Fig 1: On-Region Characteristics (Note E)
Figure 2: Transfer Characteristics (Note E)
30
1.8
1.6
1.4
1.2
1
VGS=4.5V
ID=6A
25
20
15
10
VGS=4.5V
VGS=10V
ID=6.9A
VGS=10V
0.8
0
25
50
75
100
125
150
175
0
5
10
ID (A)
15
20
Temperature (°C)
Figure 3: On-Resistance vs. Drain Current and Gate
Voltage (Note E)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
50
40
30
20
10
1.0E+01
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
1.0E-05
ID=6.9A
125°C
125°C
25°C
25°C
0.0
0.2
0.4
0.6
0.8
1.0
0
2
4
6
8
10
VGS (Volts)
VSD (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
Figure 6: Body-Diode Characteristics (Note E)
3/6
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AO4800B
30V Dual N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
5
4
3
2
1
0
1000
800
600
400
200
0
VDS=15V
ID=6.9A
Ciss
Coss
Crss
0
5
10
15
20
25
30
0
2
4
6
8
VDS (Volts)
Qg (nC)
Figure 8: Capacitance Characteristics
Figure 7: Gate-Charge Characteristics
100.0
100.0
TA=25°C
TA=100°C
TA=150°C
10µs
10.0
1.0
RDS(ON)
limited
100µs
1ms
10.0
10ms
TA=125°C
DC
0.1
10s
TJ(Max)=150°C
TA=25°C
0.0
1.0
0.01
0.1
1
10
100
1
10
Time in avalanche, tA (µs)
Figure 9: Single Pulse Avalanche capability (Note C)
100
1000
VDS (Volts)
Figure 10: Maximum Forward Biased Safe
Operating Area (Note F)
10000
1000
100
10
TA=25°C
1
0.00001
0.001
0.1
Pulse Width (s)
Figure 11: Single Pulse Power Rating Junction-to-Ambient (Note F)
10
1000
4/6
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AO4800B
30V Dual N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
In descending order
D=Ton/T
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
TJ,PK=TA+PDM.ZθJA.RθJA
1
RθJA=90°C/W
0.1
PD
0.01
Single Pulse
0.001
Ton
T
0.001
0.00001
0.0001
0.01
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance (Note F)
0.1
1
10
100
1000
5/6
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AO4800B
30V Dual N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
VDC
+
Qgs
Qgd
Vds
VDC
-
-
DUT
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
10%
+
DUT
Vdd
Vgs
VDC
Rg
-
Vgs
Vgs
td(on)
t
r
td(off)
t
f
ton
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
EAR= 1/2 LIA2R
BVDSS
Vds
Id
Vgs
Vds
+
Vgs
Vdd
I AR
VDC
Id
Rg
-
DUT
Vgs
Vgs
Diode Recovery Test Circuit & Waveforms
Q rr = - Idt
Vds +
Vds -
Ig
DUT
Vgs
trr
L
Isd
I F
Isd
Vgs
dI/dt
I RM
+
Vdd
VDC
Vdd
-
Vds
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