STS4DNFS30 [STMICROELECTRONICS]

N-channel - 30V - 0.044ohm - 4.5A SO-8 STripFET tm Power MOSFET plus schottky rectifier; N沟道 - 30V - 0.044ohm - 4.5A SO- 8的STripFET TM功率MOSFET加上肖特基整流器
STS4DNFS30
型号: STS4DNFS30
厂家: ST    ST
描述:

N-channel - 30V - 0.044ohm - 4.5A SO-8 STripFET tm Power MOSFET plus schottky rectifier
N沟道 - 30V - 0.044ohm - 4.5A SO- 8的STripFET TM功率MOSFET加上肖特基整流器

晶体 晶体管 功率场效应晶体管 开关 脉冲 光电二极管
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中文:  中文翻译
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STS4DNFS30  
N-channel - 30V - 0.044- 4.5A SO-8  
STripFET™ Power MOSFET plus schottky rectifier  
General features  
Type  
VDSS  
30V  
RDS(on)  
<0.055  
VRRM  
ID  
STS4DNFS30  
Schottky  
4.5A  
IF(AV)  
VF(MAX)  
4.5A  
30V  
0.53V  
SO-8  
Description  
This product associates the latest low voltage  
STripFET™ in n-channel version to a low drop  
Schottky diode. Such configuration is extremely  
versatile in implementing a large variety of DC-DC  
converters for printers, portable equipment.  
Internal schematic diagram  
Applications  
Switching application  
Order codes  
Part number  
Marking  
Package  
Packaging  
STS4DNFS30  
S4DNFS30  
SO-8  
Tape & reel  
July 2006  
Rev 1  
1/12  
www.st.com  
12  
Contents  
STS4DNFS30  
Contents  
1
2
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2.1  
Electrical characteristics (curves)  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3
4
5
Test circuits  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2/12  
STS4DNFS30  
Electrical ratings  
1
Electrical ratings  
Table 1.  
Symbol  
Mosfet absolute maximum ratings  
Parameter  
Value  
Unit  
VDS  
VGS  
ID  
Drain-source voltage (VGS = 0)  
Gate- source voltage  
30  
20  
4.5  
3.2  
13  
2
V
V
Drain current (continuous) at TC = 25°C  
Drain current (continuous) at TC = 100°C  
Drain current (pulsed)  
A
ID  
A
(1)  
IDM  
A
PTOT Total dissipation at TC = 25°C  
1. Pulse width limited by safe operating area  
W
Table 2.  
Symbol  
Schottky absolute maximum ratings  
Parameter  
Value  
Unit  
VRRM Repetitive peak reverse voltage  
IF(RMS) RMS forward current  
30  
10  
V
A
TL=125°C  
IF(AV) Average forward current  
4
75  
1
A
A
A
δ=0.5  
tp=10ms  
IFSM  
Surge non repetitive forward current  
Repetitive peak reverse current  
Sinusoidal  
tp=2µs  
IRRM  
F=1kHz  
IRSM  
dv/dt  
Non repetitive peak reverse current  
Critical rate of rise of reverse voltage  
tp=100µs  
1
A
10000  
v/µs  
Table 3.  
Symbol  
Thermal data  
Parameter  
Value  
Unit  
Rthj-amb Thermal resistance junction-amb Mosfet (1)  
62.5  
°C/W  
Tstg  
Tj  
Storage temperature range Max  
Junction temperature  
-55 to 150  
-55 to 150  
°C  
°C  
1. Mounted on FR-4 board (steady state)  
3/12  
Electrical characteristics  
STS4DNFS30  
2
Electrical characteristics  
(Tcase =25°C unless otherwise specified)  
Table 4.  
Symbol  
On /off states  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
Drain-source  
breakdown voltage  
V(BR)DSS  
ID = 250µA, VGS = 0  
30  
V
Zero gate voltage  
V
DS = Max rating  
1
µA  
µA  
IDSS  
drain current (VGS = 0) VDS = Max rating, TC=125°C  
10  
Gate-body leakage  
IGSS  
VGS  
=
20V  
100 nA  
V
current (VDS = 0)  
Gate threshold voltage VDS = VGS, ID = 250µA  
VGS(th)  
RDS(on)  
1
VGS = 10V, ID = 2A  
VGS = 5V, ID = 2A  
0.044 0.055  
0.085  
Static drain-source on  
resistance  
Table 5.  
Symbol  
Static  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
Tj = 25°C  
200  
15  
µA  
Reverse leakage  
current  
(1)  
IR  
VR = VRRM  
IF = 2A  
Tj = 100°C  
6
mA  
Tj = 25°C  
0.45  
V
V
Tj = 125°C  
0.325 0.375  
Zero gate voltage  
(1)  
VF  
drain current (VGS = 0)  
Tj = 25°C  
0.53  
V
V
IF = 4A  
Tj = 125°C  
0.43  
0.51  
1. Pulse test: tp=380µs, δ < 2%. To evaluate the conduction losses use the following equation:  
P = 0.24 × IF(AV) + 0.068IF2(RMS)  
Table 6.  
Symbol  
Dynamic  
Parameter  
Test conditions  
DS =10V, ID =2A  
Min.  
Typ.  
Max. Unit  
Forward  
transconductance  
gfs  
V
5
S
Input capacitance  
Ciss  
Coss  
Crss  
330  
115  
28  
pF  
pF  
pF  
Output capacitance  
VDS = 25 V, f = 1 MHz, VGS = 0  
Reverse transfer  
capacitance  
Qg  
Qgs  
Qgd  
Total gate charge  
Gate-source charge  
Gate-drain charge  
VDD = 15V, ID = 4.5A,  
VGS = 5V  
4.7  
1.2  
2.1  
nC  
nC  
nC  
(see Figure 13)  
4/12  
STS4DNFS30  
Electrical characteristics  
Min. Typ. Max Unit  
Table 7.  
Switching times  
Parameter  
Symbol  
Test Conditions  
VDD = 15V, ID = 2A,  
RG = 4.7, VGS = 5V  
(see Figure 12)  
td(on)  
tr  
Turn-on delay time  
Rise time  
9
ns  
ns  
17  
VDD = 15V, ID = 2A,  
RG = 4.7, VGS = 5V  
(see Figure 12)  
td(off)  
tf  
Turn-off delay time  
Fall time  
15  
6
ns  
ns  
Table 8.  
Symbol  
Source drain diode  
Parameter  
Test Conditions  
Min. Typ. Max. Unit  
ISD  
Source-drain current  
4.5  
13  
A
A
(1)  
ISDM  
Source-drain current (pulsed)  
(2)  
VSD  
Forward on voltage  
ISD = 4.5A, VGS = 0  
1.2  
V
trr  
Reverse recovery time  
Reverse recovery charge  
Reverse recovery current  
ISD = 4.5A, di/dt = 100A/µs  
VDD = 15V, Tj = 150°C  
(see Figure 17)  
22  
14.3  
1.3  
ns  
nC  
A
Qrr  
IRRM  
1. Pulse width limited by safe operating area  
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %  
5/12  
Electrical characteristics  
STS4DNFS30  
2.1  
Electrical characteristics (curves)  
Figure 1. Safe operating area  
Figure 2. Thermal impedance  
Figure 3.  
Output characterisics  
Figure 4.  
Transfer characteristics  
Figure 5. Source-drain diode forward  
characteristics  
Figure 6. Static drain-source on resistance  
6/12  
STS4DNFS30  
Electrical characteristics  
Figure 7. Gate charge vs gate-source voltage Figure 8. Capacitance variations  
Figure 9. Normalized gate threshold voltage Figure 10. Normalized on resistance vs  
vs temperature temperature  
Figure 11. Normalized BV  
temperature  
voltage vs  
DSS  
7/12  
Test circuits  
STS4DNFS30  
3
Test circuits  
Figure 12. Switching times test circuit for  
resistive load  
Figure 13. Gate charge test circuit  
Figure 14. Test circuit for inductive load  
switching and diode recovery times  
Figure 15. Unclamped inductive load test  
circuit  
Figure 16. Unclamped inductive waveform  
Figure 17. Switching time waveform  
8/12  
STS4DNFS30  
Package mechanical data  
4
Package mechanical data  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a Lead-free second level interconnect . The category of  
second level interconnect is marked on the package and on the inner box label, in  
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering  
conditions are also marked on the inner box label. ECOPACK is an ST trademark.  
ECOPACK specifications are available at: www.st.com  
9/12  
Package mechanical data  
STS4DNFS30  
SO-8 MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
TYP  
MAX.  
1.75  
0.25  
1.65  
0.85  
0.48  
0.25  
0.5  
MIN.  
MAX.  
0.068  
0.009  
0.064  
0.033  
0.018  
0.010  
0.019  
A
a1  
a2  
a3  
b
0.1  
0.003  
0.65  
0.35  
0.19  
0.25  
0.025  
0.013  
0.007  
0.010  
b1  
C
c1  
D
45 (typ.)  
4.8  
5.8  
5.0  
6.2  
0.188  
0.228  
0.196  
0.244  
E
1.27  
3.81  
e
0.050  
0.150  
e3  
F
3.8  
0.4  
4.0  
1.27  
0.6  
0.14  
0.157  
0.050  
0.023  
L
0.015  
M
S
8 (max.)  
10/12  
STS4DNFS30  
Revision history  
5
Revision history  
Table 9.  
Date  
19-Jul-2005  
Revision history  
Revision  
Changes  
1
First release  
11/12  
STS4DNFS30  
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12/12  

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