STS4DNFS30L [STMICROELECTRONICS]

N-CHANNEL 30V - 0.044ohm - 4A SO-8 STripFET⑩ II MOSFET PLUS SCHOTTKY RECTIFIER; N沟道30V - 0.044ohm - 4A SO- 8 STripFET⑩ II MOSFET PLUS肖特基整流器
STS4DNFS30L
型号: STS4DNFS30L
厂家: ST    ST
描述:

N-CHANNEL 30V - 0.044ohm - 4A SO-8 STripFET⑩ II MOSFET PLUS SCHOTTKY RECTIFIER
N沟道30V - 0.044ohm - 4A SO- 8 STripFET⑩ II MOSFET PLUS肖特基整流器

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STS4DNFS30L  
N-CHANNEL 30V - 0.044- 4A SO-8  
STripFET™ II MOSFET PLUS SCHOTTKY RECTIFIER  
MAIN PRODUCT CHARACTERISTICS  
V
DSS  
R
I
D
MOSFET  
DS(on)  
30 V  
< 0.055 Ω  
4 A  
I
V
RRM  
V
F(MAX)  
SCHOTTKY  
F(AV)  
3 A  
30 V  
0.51 V  
SO-8  
DESCRIPTION  
This product associates the latest low voltage  
STripFET™ in n-channel version to a low drop  
Schottky diode. Such configuration is extremely ver-  
satile in implementing, a large variety of DC-DC  
converters for printers, portable equipment, and cel-  
lular phones.  
INTERNAL SCHEMATIC DIAGRAM  
MOSFET ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
30  
Unit  
V
V
Drain-source Voltage (V = 0)  
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
30  
V
DGR  
GS  
V
Gate- source Voltage  
± 16  
4
V
GS  
I
Drain Current (continuous) at T = 25°C  
A
D
C
I
Drain Current (continuous) at T = 100°C  
2.5  
16  
A
D
C
I
()  
Drain Current (pulsed)  
A
DM  
P
TOT  
Total Dissipation at T = 25°C  
2
W
C
SCHOTTKY ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Repetitive Peak Reverse Voltage  
RMS Forward Current  
Value  
30  
Unit  
V
V
RRM  
I
20  
A
F(RMS)  
I
Average Forward Current  
TL = 125°C  
δ = 0.5  
3
75  
1
A
F(AV)  
I
Surge Non Repetitive Forward Current  
Repetitive Peak Reverse Current  
tp = 10 ms  
Sinusoidal  
A
A
FSM  
I
tp = 2 µs  
RRM  
F=1 kHz  
I
Non Repetitive Peak Reverse Current  
Critical Rate Of Rise Of Reverse Voltage  
tp = 100 µs  
1
A
RSM  
dv/dt  
10000  
V/µs  
(•)Pulse width limited by safe operating area  
July 2002  
1/8  
STS4DNFS30L  
THERMAL DATA  
Rthj-amb  
(*)Thermal Resistance Junction-ambient MOSFET  
62.5  
°C/W  
°C  
T
stg  
Storage Temperature Range  
Junction Temperature  
-55 to 150  
-55 to 150  
T
°C  
l
(*) Mounted on FR-4 board (Steady State)  
MOSFET ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)  
OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
I
D
= 250 µA, V = 0  
30  
V
(BR)DSS  
GS  
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
V
= Max Rating  
1
µA  
µA  
nA  
DSS  
DS  
Drain Current (V = 0)  
GS  
= Max Rating, T = 125 °C  
10  
DS  
GS  
C
I
Gate-body Leakage  
= ± 16 V  
±100  
GSS  
Current (V = 0)  
DS  
ON (1)  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
V
V
GS(th)  
V
DS  
V
GS  
V
GS  
= V , I = 250µA  
Gate Threshold Voltage  
1
GS  
D
R
Static Drain-source On  
Resistance  
= 10V, I = 2 A  
0.044  
0.051  
0.055  
0.065  
DS(on)  
D
= 5V, I = 2 A  
D
DYNAMIC  
Symbol  
Parameter  
Forward Transconductance  
Input Capacitance  
Test Conditions  
Min.  
Typ.  
5
Max.  
Unit  
S
g
fs  
(1)  
V
= 15 V I = 2 A  
DS  
, D  
C
C
V
= 25V, f = 1 MHz, V = 0  
330  
90  
pF  
pF  
pF  
iss  
DS  
GS  
Output Capacitance  
oss  
C
rss  
Reverse Transfer  
Capacitance  
40  
2/8  
STS4DNFS30L  
E1.LECTRICAL CHARACTERISTICS (CONTINUED)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
V
R
= 15 V, I = 2 A  
Turn-on Delay Time  
11  
ns  
d(on)  
DD  
D
= 4.7 V = 5 V  
G
GS  
t
Rise Time  
100  
ns  
r
(see test circuit, Figure 1)  
Q
V
V
= 24 V, I = 4 A,  
= 5 V  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
6.5  
3.6  
2
9
nC  
nC  
nC  
g
DD  
D
GS  
Q
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Min.  
Typ.  
Max.  
Unit  
t
Turn-off Delay Time  
Fall Time  
V
DD  
= 15 V, I = 2 A,  
25  
22  
ns  
ns  
d(off)  
D
t
f
R = 4.7Ω, V = 5 V  
G GS  
(see test circuit, Figure 1)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
4
Unit  
A
I
Source-drain Current  
SD  
I
(2)  
(1)  
Source-drain Current (pulsed)  
Forward On Voltage  
16  
A
SDM  
V
I
I
= 4 A, V = 0  
1.2  
V
SD  
SD  
GS  
t
rr  
= 4 A, di/dt = 100A/µs,  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
35  
25  
ns  
nC  
A
SD  
V
= 15 V, T = 150°C  
j
DD  
Q
rr  
(see test circuit, Figure 3)  
I
1.4  
RRM  
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
2. Pulse width limited by safe operating area.  
Safe Operating Area  
Thermal Impedance  
3/8  
STS4DNFS30L  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
4/8  
STS4DNFS30L  
Normalized Gate Thereshold Voltage vs Temp. Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
5/8  
STS4DNFS30L  
Fig. 1: Switching Times Test Circuit For  
Fig. 2: Gate Charge test Circuit  
Resistive Load  
Fig. 3: Test Circuit For Diode Recovery Behaviour  
6/8  
STS4DNFS30L  
SO-8 MECHANICAL DATA  
mm  
inch  
TYP.  
DIM.  
MIN.  
TYP.  
MAX.  
1.75  
0.25  
1.65  
0.85  
0.48  
0.25  
0.5  
MIN.  
MAX.  
0.068  
0.009  
0.064  
0.033  
0.018  
0.010  
0.019  
A
a1  
a2  
a3  
b
0.1  
0.003  
0.65  
0.35  
0.19  
0.25  
0.025  
0.013  
0.007  
0.010  
b1  
C
c1  
D
45 (typ.)  
4.8  
5.8  
5.0  
6.2  
0.188  
0.228  
0.196  
0.244  
E
e
1.27  
3.81  
0.050  
0.150  
e3  
F
3.8  
0.4  
4.0  
1.27  
0.6  
0.14  
0.157  
0.050  
0.023  
L
0.015  
M
S
8 (max.)  
0016023  
7/8  
STS4DNFS30L  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the  
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information  
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or  
systems without express written approval of STMicroelectronics.  
© The ST logo is a registered trademark of STMicroelectronics  
© 2002 STMicroelectronics - Printed in Italy - All Rights Reserved  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco  
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.  
© http://www.st.com  
8/8  

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