AOB410L [FREESCALE]

100V N-Channel MOSFET; 100V N沟道MOSFET
AOB410L
型号: AOB410L
厂家: Freescale    Freescale
描述:

100V N-Channel MOSFET
100V N沟道MOSFET

文件: 总7页 (文件大小:561K)
中文:  中文翻译
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AOT410L/AOB410L  
100V N-Channel MOSFET  
General Description  
The AOT410L/AOB410L is fabricated with SDMOSTM  
trench technology that combines excellent RDS(ON) with  
low gate charge & low Q .The result is outstanding  
efficiency with controlled switching behavior. This  
rr  
universal technology is well suited for PWM, load  
switching and general purpose applications.  
Features  
VDS  
100V  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
RDS(ON) (at VGS= 7V)  
150A  
< 6.5m  
< 7.5mΩ  
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
100  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
VGS  
±25  
TC=25°C  
150  
Continuous Drain  
Current G  
ID  
TC=100°C  
108  
A
Pulsed Drain Current C  
IDM  
405  
12  
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
Avalanche Current C  
Avalanche energy L=0.1mH C  
IDSM  
A
10  
IAS,IAR  
50  
A
EAS,EAR  
125  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
333  
PD  
W
167  
TA=25°C  
1.9  
PDSM  
W
°C  
Power Dissipation A  
1.2  
TA=70°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 175  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
12  
Max  
15  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
t
10s  
RθJA  
Steady-State  
Steady-State  
54  
65  
RθJC  
0.35  
0.45  
1/7  
www.freescale.net.cn  
AOT410L/AOB410L  
100V N-Channel MOSFET  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
100  
V
VDS=100V, VGS=0V  
10  
µA  
50  
IDSS  
Zero Gate Voltage Drain Current  
TJ=55°C  
VDS=0V, VGS= ±25V  
VDS=5V ,ID=250µA  
VGS=10V, VDS=5V  
VGS=10V, ID=20A  
T0220  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
100  
4
nA  
V
VGS(th)  
ID(ON)  
2
3
405  
5.1  
8.8  
A
6.5  
11  
mΩ  
TJ=125°C  
VGS=7V, ID=20A  
T0220  
5.8  
4.8  
7.5  
6.2  
7.2  
mΩ  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
VGS=10V, ID=20A  
TO263  
VGS=7V, ID=20A  
TO263  
5.5  
70  
mΩ  
VDS=5V, ID=20A  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
S
IS=1A,VGS=0V  
0.63  
1
V
A
Maximum Body-Diode Continuous Current  
150  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
5290 6622 7950  
pF  
pF  
pF  
VGS=0V, VDS=50V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
415  
130  
0.3  
594  
215  
0.64  
770  
300  
1
VGS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
85  
23  
24  
107  
28.5  
40  
129  
34  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
VGS=10V, VDS=50V, ID=20A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
56  
28  
VGS=10V, VDS=50V, RL=2.5,  
RGEN=3Ω  
22  
tD(off)  
tf  
43.5  
14.5  
trr  
IF=20A, dI/dt=500A/µs  
IF=20A, dI/dt=500A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
19  
27  
35  
ns  
Qrr  
nC  
124  
177  
230  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends  
on the user's specific board design, and the maximum temperature of 175°C may be used if the PCB allow s it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep  
initial TJ =25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink,  
assuming a maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse ratin g.  
G. The maximum current limited by package is 120A.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
2/7  
www.freescale.net.cn  
AOT410L/AOB410L  
100V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
150  
120  
90  
60  
30  
0
180  
150  
120  
90  
10V  
VDS=5V  
6.5V  
7V  
6V  
5.5V  
60  
125°C  
30  
25°C  
6
VGS=5V  
0
0
1
2
3
4
5
3
4
5
7
VGS(Volts)  
VDS (Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
8
2.4  
2.2  
2
VGS=10V  
ID=20A  
7
6
5
4
3
1.8  
1.6  
1.4  
1.2  
1
VGS=7V  
VGS=7V  
ID=20A  
VGS=10V  
0.8  
0
5
10  
15  
D (A)  
20  
25  
30  
0
25  
50  
75  
100 125 150 175 200  
I
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
12  
10  
8
1.0E+02  
ID=20A  
125°C  
1.0E+01  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
25°C  
25°C  
6
4
5
6
7
8
9
10  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
VGS (Volts)  
VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
3/7  
www.freescale.net.cn  
AOT410L/AOB410L  
100V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10000  
8000  
6000  
4000  
2000  
0
10  
VDS=50V  
ID=20A  
8
Ciss  
6
4
Coss  
2
Crss  
0
0
20  
40  
60  
g (nC)  
80  
100  
120  
0
10  
20  
30  
VDS (Volts)  
40  
50  
60  
Q
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
1000.0  
100.0  
10.0  
1.0  
5000  
4000  
3000  
2000  
1000  
0
10µs  
RDS(ON)  
TJ(Max)=175°C  
TC=25°C  
limited  
100µs  
1ms  
DC  
10ms  
TJ(Max)=175°C  
TC=25°C  
0.1  
0.0  
0.01  
0.1  
1
10  
100  
1000  
1E-05 0.0001 0.001  
0.01  
0.1  
10  
1  
VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
Case (Note F)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TC+PDM.ZθJC.RθJC  
R
θJC=0.45°C/W  
0.1  
PD  
Single Pulse  
0.01  
0.001  
Ton  
T
0.00001  
0.0001  
0.001  
0.01  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
0.1  
1
10  
4/7  
www.freescale.net.cn  
AOT410L/AOB410L  
100V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1000.0  
100.0  
10.0  
350  
300  
250  
200  
150  
100  
50  
TA=25°C  
TA=100°C  
TA=150°C  
TA=125°C  
0
1.0  
0
25  
50  
75  
100  
125  
150  
175  
1
10  
100  
1000  
TCASE (°C)  
Time in avalanche, tA (µs)  
Figure 13: Power De-rating (Note F)  
Figure 12: Single Pulse Avalanche capability (Note  
C)  
1000  
100  
10  
160  
120  
80  
TA=25°C  
40  
1
0
0.0001  
0.01  
1
100  
10000  
0
25  
50  
75  
100  
125  
150  
175  
Pulse Width (s)  
TCASE (°C)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
Figure 14: Current De-rating (Note F)  
10  
1
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
θJA=65°C/W  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
R
0.1  
PD  
0.01  
0.001  
Single Pulse  
1
Ton  
T
0.01  
0.1  
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
5/7  
www.freescale.net.cn  
AOT410L/AOB410L  
100V N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
320  
280  
240  
200  
160  
120  
80  
40  
35  
30  
25  
20  
15  
10  
40  
5
4
3
2
1
0
-1  
125ºC  
di/dt=800A/µs  
di/dt=800A/µs  
35  
25ºC  
30  
trr  
Qrr  
25  
25ºC  
125ºC  
125ºC  
20  
15  
10  
25ºC  
S
Irm  
125ºC  
25ºC  
20  
0
5
10  
15  
25  
30  
0
5
10  
15  
20  
25  
30  
IS (A)  
IS (A)  
Figure 17: Diode Reverse Recovery Charge and Peak  
Current vs. Conduction Current  
Figure 18: Diode Reverse Recovery Time and  
Softness Factor vs. Conduction Current  
280  
40  
30  
20  
10  
0
50  
2
Is=20A  
125ºC  
Is=20A  
240  
200  
160  
120  
80  
40  
30  
20  
10  
0
125ºC  
1.5  
1
trr  
25ºC  
25ºC  
Qrr  
125ºC  
25ºC  
25ºC  
0.5  
0
S
Irm  
40  
125º  
0
0
200  
400  
600  
800  
1000  
0
200  
400  
600  
800  
1000  
di/dt (A/µs)  
di/dt (A/µs)  
Figure 20: Diode Reverse Recovery Time and  
Softness Factor vs. di/dt  
Figure 19: Diode Reverse Recovery Charge and  
Peak Current vs. di/dt  
6/7  
www.freescale.net.cn  
AOT410L/AOB410L  
100V N-Channel MOSFET  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Q rr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
7/7  
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