HAT1041T [RENESAS]

Silicon P Channel Power MOS FET High Speed Power Switching; 硅P沟道功率MOS FET高速电源开关
HAT1041T
型号: HAT1041T
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Silicon P Channel Power MOS FET High Speed Power Switching
硅P沟道功率MOS FET高速电源开关

晶体 开关 晶体管 功率场效应晶体管 脉冲 电源开关 光电二极管
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To all our customers  
Regarding the change of names mentioned in the document, such as Hitachi  
Electric and Hitachi XX, to Renesas Technology Corp.  
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas  
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog  
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)  
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names are mentioned in the document, these names have in fact all been changed to Renesas  
Technology Corp. Thank yyour understanding. Except for our corporate trademark, logo and  
corporate statement, no tsoever have been made to the contents of the document, and  
these changes do ntion to the contents of the document itself.  
RePage: http://www.renesas.com  
Renesas Technology Corp.  
ustomer Support Dept.  
1, 2003  
Cautions  
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contained therein.  
HAT1041T  
Silicon P Channel Power MOS FET  
High Speed Power Switching  
ADE-208-1238F (Z)  
7th. Edition  
Jan. 2001  
Features  
Low on-resist
Capable of
Low drive cur
High density mou
Outline  
TSSOP-
1
5
8
D
D
D
4
G
1, 5, 8  
2, 3, 6, 7 S
Gat
4
S
2
S
3
S
6
S
7
HAT1041T  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VDSS  
Ratings  
-20  
Unit  
V
Drain to source voltage  
Gate to source voltage  
Drain current  
VGSS  
ID  
±12  
V
-6.0  
A
Note1  
Drain peak current  
ID(pulse)  
-48  
A
Body-drain diode reverse drain current IDR  
-6.0  
A
Channel dissipation  
Pch Note2  
1.3  
W
°C  
°C  
Channel temperature  
Tch  
150  
Storage temperature  
Tstg  
–55 to +150  
Note: 1. PW 10µ%  
2. When board (FR4 40 x 40 x 1.6 mm), PW10s  
Electrical Char
Item  
Max  
Unit  
Test Conditions  
Drain to source breakdown  
voltage  
V
ID = -10mA, VGS = 0  
Gate to source leak current  
IGSS  
-
6.5  
µA  
µA  
VGS = ±12V, VDS = 0  
VDS = -20 V, VGS = 0  
VDS = -10V, I D = -1mA  
ID =- 3A, VGS =- 4.5VNote3  
= -3A, VGS = -2.5VNote3  
-3A, VDS = -10VNote3  
0V  
Zero gate voltege drain current IDSS  
Gate to source cutoff voltage  
VGS(off)  
Static drain to source on state RDS(on)  
11  
resistance  
RDS(on)  
|yfs|  
Forward transfer admittance  
Input capacitance  
Output capacitance  
Ciss  
Coss  
1850  
590  
380  
30  
ns  
ns  
ns  
V
Reverse transfer capacitance Crss  
MHz  
Turn-on delay time  
Rise time  
td(on)  
tr  
td(off)  
tf  
GS =- 4V, ID = -3A  
VDD -10V  
145  
210  
170  
-0.85  
Turn-off delay time  
Fall time  
Body–drain diode forward  
voltage  
VDF  
-1.10  
IF =-6.0A, VGS = 0Note3  
Body–drain diode reverse  
recovery time  
trr  
70  
ns  
IF = -6.0A, VGS = 0  
diF/ dt =20A/µs  
Note: 3. Pulse test  
2
HAT1041T  
Main Characteristics  
Typical Output Characteristics  
Typical Transfer Characteristics  
= -10 V  
-20  
-16  
-12  
-8  
-20  
-16  
-12  
-8  
Pulse Test  
-2V  
V
DS  
Pulse Test  
-10 V  
-4 V  
-3 V  
= -1.5 V  
Tc = -25°C  
25°C  
75°C  
-4  
-4  
0
0
-1  
Gate to Source Voltage  
-2  
-3  
-4  
GS  
-5  
-10  
V
(V)  
Drain
Static Drain to Source on Sta
vs. Drain Current  
Drain to Source on State Resistance  
vs. Temperature  
0.2  
est  
Pulse Test  
0.1  
0.04  
0.02  
0.05  
-2.5 V  
-5 A  
0.02  
0.01  
V
= -4.5 V  
GS  
-2 A, -1 A  
-5 A  
0.005  
-2 A, -1 A  
V
= -4V  
GS  
0
0.002  
-40  
0
40  
80  
120  
160  
-0.2  
-0.5 -1  
-2  
-5 -10 -20  
(A)  
Case Temperature Tc (°C)  
Drain Current  
I
D
3
HAT1041T  
Normalized Transient Thermal Impedance vs. Pulse Width  
10  
D = 1  
0.5  
1
0.1  
0.1  
θ
θ
γ
• θ  
ch - f(t) = s (t) ch - f  
ch - f = 139 °C/W, Ta = 25 °C  
0.01  
When using the glass epoxy board  
(FR4 40x40x1.6 mm)  
PW  
T
P
DM  
D =  
0.001  
PW  
T
0.0001  
m  
1
10  
100  
1000  
10000  
10 µ  
th PW (s)  
4
HAT1041T  
Package Dimensions  
As of January, 2001  
Unit: mm  
3.00  
3.30 Max  
8
5
1
4
65  
1.0  
+0.08  
–0.
*0.22  
M  
0.20 ± 0
6.40 ± 0.20  
0° – 8°  
0.50 ± 0.10  
tachi Code  
EC  
TTP-8D  
*Dimension including the plating thickn
Base material dimension  
rence value)  
5
HAT1041T  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such aspace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipical equipment for life support.  
4. Design your approduct is used within the ranges guaranteed by Hitachi particularly  
for maximum oltage range, heat radiation characteristics, installation  
conditions hi bears no responsibility for failure or damage when used  
beyond the gue guaranteed ranges, consider normally foreseeable  
failure rates or faivices and employ systemic measures such as fail-  
safes, so that the equoduct does not cause bodily injury, fire or other  
consequential damage droduct.  
5. This product is not designed
6. No one is permitted to reproducwhole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any qnt or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
Asia  
: http://semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
: http://sicapac.hitachi-asia.com  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
179 East Tasman Drive, Dornacher Straβe 3  
Hitachi Europe GmbH  
Electronic Components Group  
Hitachi Asia Ltd.  
Hitachi Tower  
16 Collyer Quay #20-00,  
Singapore 049318  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower,  
San Jose,CA 95134  
D-85622 Feldkirchen, Munich  
World Finance Centre,  
Tel: <1> (408) 433-1990 Germany  
Fax: <1>(408) 433-0223 Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
Tel : <65>-538-6533/538-8577  
Fax : <65>-538-6933/538-3877  
URL : http://www.hitachi.com.sg  
Harbour City, Canton Road  
Tsim Sha Tsui, Kowloon,  
Hong Kong  
Tel : <852>-(2)-735-9218  
Fax : <852>-(2)-730-0281  
URL : http://www.hitachi.com.hk  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Hitachi Asia Ltd.  
(Taipei Branch Office)  
4/F, No. 167, Tun Hwa North Road,  
Hung-Kuo Building,  
Taipei (105), Taiwan  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 585160  
Tel : <886>-(2)-2718-3666  
Fax : <886>-(2)-2718-8180  
Telex : 23222 HAS-TP  
URL : http://www.hitachi.com.tw  
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.  
Colophon 2.0  
6

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