HAT1044M-EL-E [RENESAS]

Silicon P Channel Power MOS FET Power Switching; 硅P沟道功率MOS FET电源开关
HAT1044M-EL-E
型号: HAT1044M-EL-E
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Silicon P Channel Power MOS FET Power Switching
硅P沟道功率MOS FET电源开关

开关 电源开关
文件: 总4页 (文件大小:64K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HAT1044M  
Silicon P Channel Power MOS FET  
Power Switching  
REJ03G1152-0600  
(Previous: ADE-208-753D)  
Rev.6.00  
Sep 07, 2005  
Features  
Low on-resistance  
Low drive current  
High density mounting  
4.5 V gate drive device can be driven from 5 V source  
Outline  
RENESAS Package code: PTSP0006FA-A  
(Package name: TSOP-6)  
1 2 5 6  
D D  
D D  
4
5
6
4
Source  
Gate  
Drain  
3
G
3
1, 2, 5, 6  
3
2
1
S
4
Rev.6.00 Sep 07, 2005 page 1 of 3  
HAT1044M  
Absolute Maximum Ratings  
(Ta = 25°C)  
Item  
Drain to source voltage  
Gate to source voltage  
Drain current  
Symbol  
VDSS  
Value  
–30  
Unit  
V
VGSS  
±20  
V
Note 2  
ID  
–4.5  
A
Note 1  
Drain peak current  
ID (pulse)  
–18  
A
Note 2  
Body-drain diode reverse drain current  
Channel dissipation  
IDR  
Pch (pulse)  
–4.5  
A
Note 2  
Note 3  
2.0  
W
W
°C  
°C  
Channel dissipation  
Pch (continuous)  
Tch  
1.05  
Channel temperature  
150  
Storage temperature  
Tstg  
–55 to +150  
Notes: 1. PW 10 µs, duty cycle 1%  
2. When using the alumina ceramic board (50 × 50 × 0.7 mm), PW 5 s, Ta = 25°C  
3. When using the alumina ceramic board (50 × 50 × 0.7 mm), Ta = 25°C  
Electrical Characteristics  
(Ta = 25°C)  
Item  
Symbol  
V (BR) DSS  
IGSS  
Min  
–30  
Typ  
Max  
Unit  
V
Test Conditions  
Drain to source breakdown voltage  
Gate to source leak current  
ID = –10 mA, VGS = 0  
VGS = ±20 V, VDS = 0  
VDS = –30 V, VGS = 0  
VDS = –10 V, ID = –1 mA  
ID = –3 A, VGS = –10 V Note 4  
ID = –3 A, VGS = –4.5 V Note 4  
ID = –3 A, VDS = –10 V Note 4  
VDS = –10 V  
±0.1  
–1  
–2.5  
60  
105  
µA  
µA  
V
Zero gate voltage drain current  
Gate to source cutoff voltage  
Static drain to source on state resistance  
IDSS  
VGS (off)  
RDS (on)  
RDS (on)  
|yfs|  
–1.0  
50  
mΩ  
mΩ  
S
80  
Forward transfer admittance  
Input capacitance  
3
5.5  
600  
220  
150  
13  
Ciss  
Coss  
Crss  
Qg  
pF  
pF  
pF  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V
V
GS = 0  
Output capacitance  
f = 1 MHz  
Reverse transfer capacitance  
Total gate charge  
VDS = 10 V  
V
GS = 0  
Gate to source charge  
Gate to drain charge  
Turn-on delay time  
Qgs  
Qgd  
td (on)  
tr  
2
f = 1 MHz  
3
12  
VGS = –10 V, ID = –3 A,  
RL = 3.3 Ω  
Rise time  
85  
Turn-off delay time  
td (off)  
tf  
55  
Fall time  
55  
Body-drain diode forward voltage  
Body-drain diode reverse recovery time  
VDF  
–0.95  
50  
IF = –4.5 A, VGS = 0 Note 4  
IF = –4.5 A, VGS = 0  
diF/dt = –20 A/µs  
trr  
ns  
Note: 4. Pulse test  
Rev.6.00 Sep 07, 2005 page 2 of 3  
HAT1044M  
Package Dimensions  
JEITA Package Code  
SC-95 Modified  
RENESAS Code  
Package Name  
MASS[Typ.]  
0.012g  
PTSP0006FA-A  
TSOP-6 / TSOP-6V  
D
A
e
Q
c
E
HE  
L
L
P
L
1
Dimension in Millimeters  
Reference  
Symbol  
Min  
0.8  
0
Nom  
Max  
1.1  
0.1  
1.0  
A3  
A
A
A
b
A1  
A2  
A3  
x
S
A
M
e
0.8  
0.9  
0.25  
0.32  
0.3  
b
0.25  
0.1  
0.4  
b
1
A
A
2
1
A
c
0.13  
0.11  
2.95  
1.6  
0.15  
c1  
D
E
e
2.8  
3.1  
1.45  
1.75  
e
1
1.0  
y
S
H
E
2.6  
0.3  
0.1  
0.2  
2.8  
3.0  
0.7  
S
L
b
L
1
0.5  
L
P
0.6  
b
1
I1  
x
0.05  
0.05  
0.45  
c1  
y
b
2
c
b
2
e
1
2.2  
0.2  
I1  
0.8  
A-A Section  
Pattern of terminal position areas  
Q
Ordering Information  
Part Name  
Quantity  
Shipping Container  
HAT1044M-EL-E  
3000 pcs  
Taping  
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of  
production before ordering the product.  
Rev.6.00 Sep 07, 2005 page 3 of 3  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
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http://www.renesas.com  
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.  
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© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.  
Colophon .3.0  

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