Q62702-A1270 [INFINEON]
Silicon RF Switching Diode Preliminary data (Design for use in shunt configuration High shunt signal isolation Low shunt insertion loss); 硅射频开关二极管的初步数据(用于分流配置高分流信号隔离分流低插入损耗的使用设计)型号: | Q62702-A1270 |
厂家: | Infineon |
描述: | Silicon RF Switching Diode Preliminary data (Design for use in shunt configuration High shunt signal isolation Low shunt insertion loss) |
文件: | 总4页 (文件大小:33K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BAR 81W
Silicon RF Switching Diode
Preliminary data
3
• Design for use in shunt configuration
• High shunt signal isolation
• Low shunt insertion loss
4
2
VPS05605
1
Type
Marking Ordering Code Pin Configuration
BBs
Package
BAR 81W
Q62702-A1270 1 = A1 2 = C2 3 = A2 4 = C1 SOT-343
Maximum Ratings
Parameter
Symbol
Value
30
Unit
V
Diode reverse voltage
Forward current
V
R
100
mA
mW
°C
I
F
100
Total power dissipation, T = 138 °C
P
tot
S
Junction temperature
150
T
j
Operating temperature range
Storage temperature
-55 ...+125
-55 ...+150
°C
T
T
op
stg
Thermal Resistance
1)
Junction - ambient
K/W
R
R
≤ 200
≤ 120
thJA
thJS
Junction - soldering point
1) Package mounted on alumina 15mm x 16.7mm x 0.7mm
Semiconductor Group
1
Sep-04-1998
1998-11-01
Semiconductor Group
1
BAR 81W
Electrical Characteristics at T = 25 °C, unless otherwise specified.
A
Parameter
Symbol
Values
typ.
Unit
min.
max.
Characteristics
Reverse current
-
-
-
20
1
nA
V
I
R
V = 20 V
R
Forward voltage
0.93
V
F
I = 100 mA
F
AC characteristics
Diode capacitance
pF
C
T
V = 1 V, f = 1 MHz
-
-
0.6
-
-
R
V = 3 V, f = 1 MHz
R
0.57
Forward resistance
-
0.7
-
r
Ω
f
I = 5 mA, f = 100 MHz
F
Series inductance
-
0.15
-
nH
L
s
Configuration of the shunt-diode
- A perfect ground is essential for optimum isolation
- The anode pins should be used as passage for RF
Semiconductor Group
Semiconductor Group
2
Sep-04-1998
1998-11-01
2
BAR 81W
Forward current I = f (T *;T )
F
A
S
*): mounted on alumina 15mm x 16.7mm x 0.7mm
120
mA
100
T
S
90
80
70
60
50
40
30
20
10
0
I
T
A
°C
0
20
40
60
80
100 120
150
T ,T
A
S
Permissible Pulse Load
Permissible Pulse Load R
= f(t )
thJS
p
I
/ I
= f(t )
Fmax FDC
p
10 2
10 3
K/W
-
I
D = 0
0.005
0.01
0.02
0.05
0.1
10 2
R
I
10 1
0.2
0.5
0.5
0.2
0.1
10 1
0.05
0.02
0.01
0.005
D = 0
10 0
10 -6
10 0
10 -5
10 -4
10 -3
10 -2
10 0
10 -6
10 -5
10 -4
10 -3
10 -2
10 0
s
s
t
t
p
p
Semiconductor Group
Semiconductor Group
3
Sep-04-1998
1998-11-01
3
BAR 81W
Forward current I = f (V )
Forward resistance r = f(I )
f F
F
F
T = 25°C
f = 100MHz
A
10 3
mA
3.0
Ohm
2.4
2.2
2.0
10 2
I
R
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
10 1
10 0
10 -1
400
0.0
10 -1
10 0
10 1
mA
mV
500
600
700
800
1000
V
I
F
F
Diode capacitance C = f (V )
Diode capacitance C = f (V )
T R
T
R
f = 1MHz
f = 100MHz
1.0
pF
1.0
pF
0.8
0.8
0.7
0.7
C
C
0.6
0.5
0.4
0.3
0.6
0.5
0.4
0.3
0.2
0.2
0
V
V
1
2
3
4
5
6
7
8
10
0
1
2
3
4
5
6
7
8
10
V
V
R
R
Semiconductor Group
Semiconductor Group
4
Sep-04-1998
1998-11-01
4
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