FDD3N50NZTM [FAIRCHILD]

N-Channel MOSFET 500V, 2.5A, 2.5; N沟道MOSFET 500V , 2.5A ,虎2.5i ????
FDD3N50NZTM
型号: FDD3N50NZTM
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

N-Channel MOSFET 500V, 2.5A, 2.5
N沟道MOSFET 500V , 2.5A ,虎2.5i ????

晶体 晶体管 开关 脉冲
文件: 总8页 (文件大小:550K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
November 2011  
TM  
UniFET-II  
FDD3N50NZ  
N-Channel MOSFET  
500V, 2.5A, 2.5  
Features  
Description  
R
= 2.1( Typ.)@ V = 10V, I = 1.25A  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
DS(on)  
GS  
D
Low Gate Charge ( Typ. 6.2nC)  
Low C ( Typ. 2.5pF)  
rss  
This advance technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switching mode power supplies and active power factor  
correction.  
Fast Switching  
100% Avalanche Tested  
Improved dv/dt Capability  
ESD Imoroved Capability  
RoHS Compliant  
D
G
S
D-PAK  
o
MOSFET Maximum Ratings T = 25 C unless otherwise noted*  
C
Symbol  
Parameter  
FDD3N50NZ  
Units  
V
V
Drain to Source Voltage  
Gate to Source Voltage  
500  
V
V
DSS  
GSS  
±25  
o
-Continuous (T = 25 C)  
2.5  
C
I
I
Drain Current  
A
D
o
-Continuous (T = 100 C)  
1.5  
C
Drain Current  
- Pulsed  
ꢀꢀꢀ (Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
10  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy  
Avalanche Current  
114  
AS  
I
2.5  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4
mJ  
V/ns  
W
AR  
dv/dt  
10  
40  
o
(T = 25 C)  
C
P
Power Dissipation  
D
o
o
- Derate above 25 C  
0.3  
W/ C  
o
T , T  
Operating and Storage Temperature Range  
-55 to +150  
C
J
STG  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
o
T
300  
C
L
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Units  
Ratings  
3.1  
R
R
JC  
o
C/W  
90  
JA  
©2011 Fairchild Semiconductor Corporation  
FDD3N50NZ Rev. C0  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FDD3N50NZ  
FDD3N50NZTM  
D-PAK  
380mm  
16mm  
2500  
o
Electrical Characteristics T = 25 C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
o
BV  
Drain to Source Breakdown Voltage  
I
I
= 250A, V = 0V, T = 25 C  
500  
-
-
-
-
V
DSS  
D
D
GS  
C
BV  
T  
Breakdown Voltage Temperature  
Coefficient  
o
o
DSS  
= 250A, Referenced to 25 C  
0.5  
V/ C  
J
V
V
V
= 500V, V = 0V  
-
-
-
-
1
DS  
DS  
GS  
GS  
I
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
A  
A  
DSS  
GSS  
o
= 400V, V = 0V,T = 125 C  
-
10  
GS  
C
I
= ±25V, V = 0V  
-ꢀ  
±10  
DS  
On Characteristics  
V
Gate Threshold Voltage  
V
V
V
= V , I = 250A  
3.0  
-ꢀ  
-
-
5.0  
2.5  
-
V
S
GS(th)  
GS  
GS  
DS  
DS  
D
R
g
Static Drain to Source On Resistance  
Forward Transconductance  
= 10V, I = 1.25A  
2.1  
1.9  
DS(on)  
D
= 20V, I = 1.25A  
(Note 4)  
D
FS  
Dynamic Characteristics  
C
C
C
Input Capacitance  
-
-
-
-
-
210  
30  
280  
45  
5
pF  
pF  
pF  
nC  
nC  
iss  
V
= 25V, V = 0V  
GS  
DS  
Output Capacitance  
oss  
rss  
f = 1MHz  
Reverse Transfer Capacitance  
Total Gate Charge at 10V  
Gate to Source Gate Charge  
2.5  
6.2  
1.4  
Q
Q
8
g(tot)  
gs  
V
V
= 400V I = 2.5A  
DS  
GS  
D
-
= 10V  
Q
Gate to Drain “Miller” Charge  
-
3.1  
-
nC  
gd  
(Note 4, 5)  
Switching Characteristics  
t
t
t
t
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
-
-
-
-
10  
15  
26  
17  
30  
40  
60  
45  
ns  
ns  
ns  
ns  
d(on)  
V
V
= 250V, I = 2.5A  
DD  
GS  
D
r
= 10V, R  
= 25  
GEN  
d(off)  
f
(Note 4, 5)  
Drain-Source Diode Characteristics  
I
I
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
-
-
-
-
-
-
-
2.5  
10  
1.4  
-
A
A
S
SM  
V
t
Drain to Source Diode Forward Voltage  
Reverse Recovery Time  
V
= 0V, I = 2.5A  
-
V
SD  
GS  
SD  
190  
0.52  
ns  
C  
V
= 0V, I = 2.5A  
rr  
GS  
SD  
dI /dt = 100A/s  
(Note 4)  
Q
Reverse Recovery Charge  
-
F
rr  
Notes:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature  
2. L = 36.6mH, I = 2.5A, V = 50V, R = 25, Starting T = 25C  
AS  
DD  
G
J
3. I 2.5A, di/dt 200A/s, V BV  
, Starting T = 25C  
SD  
DD  
DSS  
J
4. Pulse Test: Pulse width 300s, Dual Cycle 2%  
5. Essentially Independent of Operating Temperature Typical Characteristics  
www.fairchildsemi.com  
FDD3N50NZ Rev. C0  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperature  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
www.fairchildsemi.com  
FDD3N50NZ Rev. C0  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
Figure 9. Maximum Safe Operating Area  
vs. Case Temperature  
Figure 10. Maximum Drain Current  
Figure 11. Transient Thermal Response Curve  
PDM  
t1  
t2  
www.fairchildsemi.com  
FDD3N50NZ Rev. C0  
4
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
www.fairchildsemi.com  
FDD3N50NZ Rev. C0  
5
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
www.fairchildsemi.com  
FDD3N50NZ Rev. C0  
6
Mechanical Dimensions  
D-PAK  
Dimensions in Millimeters  
www.fairchildsemi.com  
FDD3N50NZ Rev. C0  
7
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is  
not intended to be an exhaustive list of all such trademarks.  
2Cool™  
FlashWriter®  
FPS™  
*
PDP SPM™  
Power-SPM™  
PowerTrench®  
PowerXS™  
The Power Franchise®  
AccuPower™  
Auto-SPM™  
AX-CAP™*  
The Right Technology for Your Success™  
®
F-PFS™  
FRFET®  
BitSiC®  
Global Power ResourceSM  
Green FPS™  
Green FPS™ e-Series™  
Gmax™  
Programmable Active Droop™  
TinyBoost™  
TinyBuck™  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
QFET®  
QS™  
TinyCalc™  
Quiet Series™  
RapidConfigure™  
TinyLogic®  
GTO™  
IntelliMAX™  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
Current Transfer Logic™  
DEUXPEED®  
Dual Cool™  
EcoSPARK®  
EfficentMax™  
ESBC™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MicroPak2™  
Saving our world, 1mW/W/kW at a time™  
SignalWise™  
SmartMax™  
TranSiC®  
TriFault Detect™  
TRUECURRENT®*  
SerDes™  
SMART START™  
SPM®  
MillerDrive™  
STEALTH™  
MotionMax™  
Motion-SPM™  
mWSaver™  
SuperFET®  
Fairchild®  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SupreMOS®  
SyncFET™  
Sync-Lock™  
UHC®  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
XS™  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
OptiHiT™  
OPTOLOGIC®  
OPTOPLANAR®  
®
FAST®  
FastvCore™  
FETBench™  
®*  
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY  
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THEREIN, WHICH COVERS THESE PRODUCTS.  
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As used here in:  
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and (c) whose failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or  
effectiveness.  
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Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,  
www.Fairchildsemi.com, under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of  
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PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I55  
FDD3N50NZ Rev. C0  
8
www.fairchildsemi.com  

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