FDD4243_F085 [FAIRCHILD]

Power Field-Effect Transistor, 14A I(D), 40V, 0.044ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252, ROHS COMPLIANT, DPAK-3;
FDD4243_F085
型号: FDD4243_F085
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Power Field-Effect Transistor, 14A I(D), 40V, 0.044ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252, ROHS COMPLIANT, DPAK-3

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November 2007  
FDD4243  
40V P-Channel PowerTrench® MOSFET  
-40V, -14A, 44mΩ  
Features  
General Description  
„ Max rDS(on) = 44mat VGS = -10V, ID = -6.7A  
„ Max rDS(on) = 64mat VGS = -4.5V, ID = -5.5A  
„ High performance trench technology for extremely low rDS(on)  
„ RoHS Compliant  
This P-Channel MOSFET has been produced using Fairchild  
Semiconductor’s proprietary PowerTrench® technology to  
deliver low rDS(on) and optimized Bvdss capability to offer  
superior performance benefit in the applications.  
Application  
„ Inverter  
„ Power Supplies  
S
D
G
G
S
D-PAK  
(TO-252)  
D
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
-40  
V
V
±20  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC= 25°C  
TC= 25°C  
TA= 25°C  
-14  
(Note 1)  
-24  
ID  
A
(Note 1a)  
-6.7  
-Pulsed  
-60  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
(Note 3)  
84  
mJ  
W
TC= 25°C  
42  
3
PD  
Power Dissipation  
(Note 1a)  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
3.0  
40  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13’’  
Tape Width  
12mm  
Quantity  
FDD4243  
FDD4243  
D-PAK(TO-252)  
2500 units  
1
©2007 Fairchild Semiconductor Corporation  
FDD4243 Rev.C1  
www.fairchildsemi.com  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = -250µA, VGS = 0V  
ID = -250µA, referenced to 25°C  
VDS = -32V,  
-40  
V
BVDSS  
TJ  
Breakdown Voltage Temperature  
Coefficient  
-32  
mVC  
-1  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
µA  
VGS = 0V  
TJ = 125°C  
-100  
±100  
VGS = ±20V, VGS = 0V  
nA  
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VGS = VDS, ID = -250µA  
-1.4  
-1.6  
-3.0  
V
VGS(th)  
TJ  
Gate to Source Threshold Voltage  
Temperature Coefficient  
ID = -250µA, referenced to 25°C  
4.7  
mV/°C  
VGS = -10V, ID = -6.7A  
36  
48  
53  
16  
44  
64  
69  
rDS(on)  
gFS  
Drain to Source On Resistance  
Forward Transconductance  
VGS = -4.5V, ID = -5.5A  
mΩ  
VGS = -10V, ID = -6.7A, TJ = 125°C  
VDS = -5V, ID = -6.7A  
S
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1165  
165  
90  
1550  
220  
pF  
pF  
pF  
VDS = -20V, VGS = 0V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
135  
f = 1MHz  
4
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
6
15  
22  
7
12  
26  
35  
14  
29  
ns  
ns  
VDD = -20V, ID = -6.7A  
VGS = -10V, RGEN = 6Ω  
Turn-Off Delay Time  
Fall Time  
ns  
ns  
Qg(TOT)  
Qgs  
Qgd  
Total Gate Charge at 10V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
21  
3.4  
4
nC  
nC  
nC  
VDD = -20V, ID = -6.7A  
VGS = -10V  
Drain-Source Diode Characteristics  
VSD  
trr  
Source to Drain Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0V, IS = -6.7A (Note 2)  
IF = -6.7A, di/dt = 100A/µs  
0.86  
29  
1.2  
43  
44  
V
ns  
nC  
Qrr  
Reverse Recovery Charge  
30  
Notes:  
1:  
R
is sum of junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R  
is  
θJA  
θJC  
guaranteed by design while R  
is determined by the user’s board design.  
θJC  
2
a.40°C/Wwhenmounted on a1in pad of 2 oz copper  
b. 96°C/W when mounted on a minimum pad.  
2: Pulse Test: Pulse Width < 300µs, Duty cycle < 2.0%.  
3: Starting T = 25°C, L = 3mH, I = 7.5A, V = 40V, V = 10V.  
J
AS  
DD  
GS  
www.fairchildsemi.com  
2
FDD4243 Rev.C1  
Typical Characteristics TJ = 25°C unless otherwise noted  
60  
50  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
VGS = -3.0V  
VGS = -4V  
V
= -10V  
= - 6V  
= -5V  
GS  
V
= -4.5V  
= -4V  
GS  
VGS = -4.5V  
V
40  
30  
20  
10  
0
GS  
VGS = -5V  
VGS = -6V  
V
GS  
V
GS  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5%MAX  
V
= -3.0V  
GS  
VGS = -10V  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5%MAX  
0
1
2
3
4
5
0
10  
20  
30  
40  
50  
60  
-V , DRAIN TO SOURCE VOLTAGE (V)  
-ID, DRAIN CURRENT(A)  
DS  
Figure 1. On Region Characteristics  
Figure2. N o r m a l i z e d O n - R e s i s ta n c e  
vs Drain Current and Gate Voltage  
120  
1.8  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5%MAX  
ID = -6.7A  
GS = -10V  
I
D
= -6.7A  
V
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
100  
80  
60  
40  
20  
T
= 125oC  
= 25oC  
J
T
J
2
3
4
5
6
7
8
9
10  
-50 -25  
0
25  
50  
75  
100 125 150  
TJ, JUNCTION TEMPERATURE (oC)  
-VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. Normalized On Resistance  
vs Junction Temperature  
Figure4. On-Resistance vs Gate to  
Source Voltage  
60  
30  
10  
V
GS  
= 0V  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5%MAX  
50  
T = 150oC  
J
40  
30  
20  
10  
0
T = 150oC  
J
T
J
= 25oC  
T
= 25oC  
J
1
T
J
= -55oC  
T
J
= -55oC  
1.0  
0.1  
0.4  
0.6  
0.8  
1.2  
1
2
3
4
5
6
-V , BODY DIODE FORWARD VOLTAGE (V)  
SD  
-VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure6. Source to Drain Diode  
Forward Voltage vs Source Current  
www.fairchildsemi.com  
3
FDD4243 Rev.C1  
Typical Characteristics TJ = 25°C unless otherwise noted  
10  
3000  
1000  
I
D
= -6.7A  
V
DD  
= -10V  
8
6
4
2
0
C
iss  
V
= -20V  
DD  
V
DD  
= -30V  
C
oss  
f = 1MHz  
= 0V  
100  
50  
C
rss  
V
GS  
30  
0.1  
1
10  
0
4
8
12  
16  
20  
24  
-VDS, DRAIN TO SOURCE VOLTAGE (V)  
Q , GATE CHARGE(nC)  
g
Figure 7. Gate Charge Characteristics  
Figure8. C a p a c i t a n c e v s D r a i n  
to Source Voltage  
25  
20  
15  
10  
5
10  
8
V
= -10V  
GS  
6
TJ = 25oC  
4
Limited by Package  
= 3.0oC/W  
2
TJ = 125oC  
V
GS  
= -4.5V  
R
θJC  
0
25  
1
0.01  
50  
75  
100  
125  
150  
0.1  
1
10  
30  
TC, CASE TEMPERATURE (oC)  
tAV, TIME IN AVALANCHE(ms)  
Figure9. U n c l a m p e d I n d u c t i v e  
Switching Capability  
Figure10. Maximum Continuous Drain  
Current vs Case Temperature  
10000  
100  
10  
1
FOR TEMPERATURES  
o
VGS = -10V  
ABOVE 25 C DERATE PEAK  
CURRENT AS FOLLOWS:  
100us  
150 T  
C
1000  
---------------------  
I = I  
25  
125  
o
T
= 25 C  
C
1ms  
10ms  
100  
30  
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY rDS(on)  
SINGLE PULSE  
100ms  
T
= MAX RATED  
= 25OC  
J
SINGLE PULSE  
T
C
0.1  
0.5  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
1
10  
100  
t, PULSE WIDTH (s)  
-VDS, DRAIN to SOURCE VOLTAGE (V)  
Figure 11. Forward Bias Safe  
Operating Area  
Figure12. Single Pulse Maximum  
Power Dissipation  
www.fairchildsemi.com  
4
FDD4243 Rev.C1  
Typical Characteristics TJ = 25°C unless otherwise noted  
2
DUTY CYCLE-DESCENDING ORDER  
1
D = 0.5  
0.2  
0.1  
0.05  
P
0.02  
0.01  
0.1  
DM  
t
1
t
2
NOTES:  
DUTY FACTOR: D = t /t  
0.01  
1
2
PEAK T = P  
x Z  
x R  
+ T  
J
DM  
θJC  
θJC C  
SINGLE PULSE  
10-4  
0.003  
10-5  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION (s)  
Figure 13. Transient Thermal Response Curve  
www.fairchildsemi.com  
5
FDD4243 Rev.C1  
TRADEMARKS  
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and  
is not intended to be an exhaustive list of all such trademarks.  
ACEx®  
Green FPS™  
Green FPS™ e-Series™  
GTO™  
i-Lo™  
IntelliMAX™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
Power247®  
SuperSOT™-8  
SyncFET™  
Build it Now™  
CorePLUS™  
CROSSVOLT™  
CTL™  
POWEREDGE®  
Power-SPM™  
PowerTrench®  
Programmable Active Droop™  
QFET®  
The Power Franchise®  
Current Transfer Logic™  
TinyBoost™  
TinyBuck™  
TinyLogic®  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
µSerDes™  
UHC®  
EcoSPARK®  
QS™  
®
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
SMART START™  
SPM®  
STEALTH™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
Fairchild®  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
MicroPak™  
MillerDrive™  
Motion-SPM™  
OPTOLOGIC®  
FAST®  
FastvCore™  
FPS™  
OPTOPLANAR®  
®
UniFET™  
VCX™  
FRFET®  
PDP-SPM™  
Power220®  
Global Power ResourceSM  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS  
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF  
THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE  
UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF  
FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE  
PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR  
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in a significant injury to the user.  
2. A critical component in any component of a life support,  
device, or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
tm  
This datasheet contains the design specifications for product  
development. Specifications may change in any manner without notice.  
Advance Information  
Formative or In Design  
This datasheet contains preliminary data; supplementary data will be pub-  
lished at a later date. Fairchild Semiconductor reserves the right to make  
changes at any time without notice to improve design.  
Preliminary  
First Production  
Full Production  
Not In Production  
This datasheet contains final specifications. Fairchild Semiconductor reserves  
the right to make changes at any time without notice to improve design.  
No Identification Needed  
Obsolete  
This datasheet contains specifications on a product that has been discontin-  
ued by Fairchild Semiconductor. The datasheet is printed for reference infor-  
mation only.  
Rev. I31  
6
www.fairchildsemi.com  
FDD4243 Rev.C1  

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