AP909_技术文档

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

Datasheet

Revision 0.0

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

Table of Contents

1. OVERVIEW................................................................................................................................................................1

2. APPLICATIONS ........................................................................................................................................................1

2.1. TARGET APPLICATIONS ...................................................................................................................................................... 1

2.2. APPLICATION FEATURES..................................................................................................................................................... 1

2.2.1

2.2.2

2.2.3

2.2.4

DOCKING CONTROL FEATURES...................................................................................................................................... 1

CLOCK AND ALARM FEATURES....................................................................................................................................... 1

RADIO FEATURES ........................................................................................................................................................... 1

OTHER SYSTEM FEATURES............................................................................................................................................ 1

3. ORDERING INFORMATION .....................................................................................................................................1

4. PIN CONFIGURATION..............................................................................................................................................1

5. BLOCK DIAGRAM....................................................................................................................................................2

6. BUILT IN PERIPHERALS .........................................................................................................................................2

7. PIN DESCRIPTION ...................................................................................................................................................3

8. ELECTRICAL SPECIFICATION ...............................................................................................................................5

8.1. ABSOLUTE MAXIMUM RATING............................................................................................................................................. 5

8.2. RECOMMENDED OPERATING CONDITION........................................................................................................................... 5

8.3. LEAKAGE CURRENT AND CAPACITANCE ............................................................................................................................ 5

8.4. DC ELECTRICAL CHARACTERISTICS .................................................................................................................................. 5

9. PACKAGE INFORMATION.......................................................................................................................................6

10. SOLDERING INDICATION........................................................................................................................................7

1.

2.

3.

4.

REFLOW SOLDERING .......................................................................................................................................................... 7

WAVE SOLDERING .............................................................................................................................................................. 7

MANUAL SOLDERING .......................................................................................................................................................... 7

SUITABILITY OF SURFACE MOUNT IC PACKAGES FOR WAVE AND REFLOW SOLDERING METHODS ............................... 9

Revision 0.0

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

1. OVERVIEW

2.2.3 Radio Features

The AP909 is a controller IC for docking application with

remote control function and LCD driver. It has a built-in

PLL controller for controlling external radio tuner IC to

form a complete digital tuning system (DTS). AP909

also supports real time clock with 12/24 hour display

format and dual alarm clock timer. Built-in with LCD

driver and support for docking system of prevalent music

players and mobile phones, AP909 is suitable for a wide

range of audio applications that have build-in clock

alarm, radio and docking features.

• Auto/Manual radio station scanning

• Programmable radio station memory ( independent

memory slots for FM and AM )

2.2.4 Other System Features

• Support 24 segment x 4 common or 6 common, 1/3

bias LCD display

• Automatic detection of AC power

• Low standby current

2. APPLICATIONS

3. ORDERING INFORMATION

2.1. Target Applications

ORDERING NUMBER

PINS

PACKAGE

AP909-LQ-L

100

LQFP

• Docking system

• Clock radio

• Bluetooth application

4. PIN CONFIGURATION

2.2. Application Features

2.2.1 Docking Control Features

P72 76

P73 77

50

49

P11

P10

• Docking control through front panel buttons or remote

controller

• PLAY, PAUSE, STOP, FAST FORWARD, FAST

BACKWARD, RANDOM, REPEAT functions

• Device charging through docking system

• Support Apple Authentication Coprocessor

P80

P81

48 P113

78

79

P82 80

P83 81

47 P112

46 ADCIO5

ADCIO4

ADCIO3

ADCIO2

ADCIO1

ADCIO0

W2

45

44

43

42

41

40

39

38

VLCD2

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

VLCD1

VLCD

ACIN

P120

P121

P122

P123

W3

PGM

ATONE

VDD

XOSCO

XOSCI

GND

P142

P143

P140 99

P141 100

P133

P132

37 TESTB3

36 TESTB2

DTSPLLFLT

35

34 GND

33 IFIN

AMIN

32

31 FMIN

30

VDD

29 P103

28

P102

27 P101

P100

2.2.2 Clock and Alarm Features

26

• 12/24 hour clock display mode selectable by user

• Dual alarm clocks

• User selectable alarm mode – wake-to-buzzer, wake-

to-radio or wake-to-docked_device

• Fixed snooze feature

Figure 1 100-Pin LQFP Package of AP909

• Programmable sleep timer

Revision 0.0

Page 1 of 10

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

5. BLOCK DIAGRAM

The following diagram shows the system blocks embedded in AP909.

CLOCK

SYNTHESIZER

XOSC

DTS PLL

RCOSC

ADC

CLKGEN

TIMER

INTCON

SPI

PROG PROM

32kx8x2

AC_DET

UART

DATA RAM

2kx8

I2C MS

REMOTE

ROTARY SW

BUZZER

MCU EIRQ

MCU

EMU

Figure 2 Internal Block Diagram of AP909

6. BUILT-IN PERIPHERALS

• High performance 8 bit CPU

• 6-bit ADC

o

Support C language programming

o

6 channels

• 64 kbyte one time program ROM

• 2 kbyte data RAM

• Interrupt controller

• AC line frequency detection unit

• External interrupt

o

4 channels

o

13 interrupt sources

• IR remote transmit and receive control unit

• Buzzer unit

• Watchdog reset

• Real time clock

o

output level control available

• Rotary type switch counter unit

• UART interface

• Embedded RC oscillator

• Programmable timer

o

2 units

o

3 units

• I2C interface

• Pulse width modulation

o

• SPI interface

o

3 channels

1 channel

o

• LCD driver

o

3 units

24 segment x 4 common or 6

common, 1/3 bias LCD display

• Selectable oscillator option

o

XOSC : low speed 32.768kHz / 75kHz crystal

RCOSC: 3.7MHz internal RC oscillator

• DTS PLL unit

Revision 0.0

Page 2 of 10

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

7. PIN DESCRIPTION

Name

Alternative

Function

Type

Pullup Descriptions

/down

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

P90

P91

P92

SPIDIO

SPICLK

SPIDI

IO,S

I,S

PU

U

General purpose IO port / SPI data IO

General purpose IO port / SPI clock IO

General purpose IO port / SPI data input

General purpose IO port

Active low chip reset input

Low-voltage detect

Analog supply voltage

PLL filter

Analog ground

Ground

General purpose IO port

Power supply

General purpose IO port pin

Watchdog enable ( active high)

General purpose IO port pin / external interrupt.

General purpose IO port / I2C0 clock output

General purpose IO port / I2C0 data IO port

General purpose IO port / PWM Output 2

General purpose IO port / Remote receiver input

General purpose IO port or rotary switch counter

input

P93

RSTB

PWRDET

AVDD

PLLFLT

AGND

GND

P150

P151

VDD

IA

OA

IO,S

VPP

P130

P131

WDTEN

W0

W1

P00

P01

P02

P03

IO,S

I,S

IO,S

PU

U

PU

RDSCLK

I2CCLK0

I2CDAT0

PWMO2

REMO

24

25

P110

P111

RCK

RCD

IO,S

PU

General purpose IO port or rotary switch counter

input

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

P100

P101

P102

P103

VDD

FMIN

AMIN

IFIN

GND

TX0

RX0

BOUT0

PWMO1

IO,S

PU

General purpose IO port or UART0 TX output

General purpose IO port or UART0 RX input

General purpose IO port or UART0 clock output

General purpose IO port pin / PWM output 1

Power supply

FM input clock

AM input clock

IF input clock

ground

DTS PLL control voltage output

Active low chip test enable

General purpose IO port pin / buzzer

General purpose IO port pin

General purpose IO port pin / external interrupt.

ADC input channel 0 / General purpose IO port

ADC input channel 1 / General purpose IO port

ADC input channel 2 / General purpose IO port

ADC input channel 3 / General purpose IO port

ADC input channel 4 / General purpose IO port

ADC input channel 5 / General purpose IO port

General purpose IO port pin / I2C1 clock output

General purpose IO port pin / I2C1 data IO

General purpose IO port pin / buzzer output

General purpose IO port pin / UART1 clock _*Note

General purpose IO port / LCD common 6 / UART1

TX _*Note

IA

DTSPLLFLT

TESTB2

TESTB3

P132

OA

I,S

U

PU

TONE

IO,S

P133

W2

ADCIO0

ADCIO1

ADCIO2

ADCIO3

ADCIO4

ADCIO5

P112

P113

P10

P11

I2CCLK1

I2CDAT1

TONE

PU

BOUT1

51

52

P12

P13

COM6 / TX1

COM5 / RX1

IO,S,L

PU

General purpose IO port / LCD common 5 / UART1

RX _*Note

53

54

55

56

57

58

P20

P21

P22

P23

P30

P31

COM4

COM3

COM2

COM1

SEG1

SEG2

IO,S,L

PU

General purpose IO port / LCD common 4

General purpose IO port / LCD common 3

General purpose IO port / LCD common 2

General purpose IO port / LCD common 1

General purpose IO port / LCD segment 1

General purpose IO port / LCD segment 2

Revision 0.0

Page 3 of 10

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

Name

Alternative

Function

Type

Pullup Descriptions

/down

59

60

61

62

63

64

65

P32

P33

P40

P41

P42

P43

GND

SEG3

SEG4

SEG5

SEG6

SEG7

SEG8

IO,S,L

PU

General purpose IO port / LCD segment 3

General purpose IO port / LCD segment 4

General purpose IO port / LCD segment 5

General purpose IO port / LCD segment 6

General purpose IO port / LCD segment 7

General purpose IO port / LCD segment 8

Ground

General purpose IO port / LCD segment 9/ 8-bit MPU

interface

General purpose IO port / LCD segment 10 / 8-bit

MPU interface

General purpose IO port / LCD segment 11 / 8-bit

MPU interface

General purpose IO port / LCD segment 12 / 8-bit

MPU interface

General purpose IO port / LCD segment 13 / 8-bit

MPU interface

General purpose IO port / LCD segment 14 / 8-bit

MPU interface

General purpose IO port / LCD segment 15 / 8-bit

MPU interface

General purpose IO port / LCD segment 16 / 8-bit

MPU interface

General purpose IO port / LCD segment 17 / 8-bit

MPU interface

General purpose IO port / LCD segment 18 / 8-bit

MPU interface

General purpose IO port / LCD segment 19 / 8-bit

MPU interface

General purpose IO port / LCD segment 20 / 8-bit

MPU interface

66

67

68

69

70

71

72

73

74

75

76

77

P50

P51

P52

P53

P60

P61

P62

P63

P70

P71

P72

P73

SEG9 / LCDD0

SEG10 / LCDD1

SEG11 / LCDD2

SEG12 / LCDD3

SEG13 / LCDD4

SEG14 / LCDD5

SEG15 / LCDD6

SEG16 / LCDD7

IO,S,L

PU

SEG17 /

LCDWRB

SEG18 / LCDRDB

SEG19 / LCDA0

SEG20 / LCDCSB

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

P80

P81

P82

SEG21

SEG22

SEG23

SEG24

IO,S,L

PU

General purpose IO port / LCD segment 21

General purpose IO port / LCD segment 22

General purpose IO port / LCD segment 23

General purpose IO port / LCD segment 24

1/3 x VLCD voltage

2/3 x VLCD voltage

LCD driver supply voltage

AC detection input

P83

VLCD2

VLCD1

VLCD

ACIN

P120

P121

P122

P123

W3

TEST4

ATONE

VDD

XOSCO

XOSCI

GND

I,S

U

TX1

RX1

BOUT1

IR_TX

IO,S,L

IO,S

PU

D

General purpose IO port / UART1 TX

*Note

General purpose IO port / UART1 RX

*Note

General purpose IO port / UART1 clock output

*Note

General purpose IO port / IR TX output

General purpose IO port pin / external interrupt.

Active high chip test enable

Buzzer output with level control

Power supply

32.768kHz / 75kHz oscillator output

32.768kHz / 75kHz oscillator input

Ground

I,S

OA

O

I

General purpose IO port / PWM3 complementary

output 1

General purpose IO port / PWM3 complementary

output 2

97

98

P142

P143

PWMO3P

PWMO3N

IO,S

PU

99

100

P140

P141

I2CCLK2

I2CDAT2

IO,S

PU

General purpose IO port pin / I2C2 clock output

General purpose IO port / I2C2 data IO

I

O

IO

IA

OA

- Input pin

- Output pin

- Bidirectional pin

- Analog input pin

- Analog output pin

S

(P)U

(P)D

L

- CMOS Schmitt Trigger

- (Programmable) Pull-up

- (Programmable) Pull-down

- LCD Pad

0,1,Z - Logic state 0, Logic state 1,High impedance

*Note:

Depending on the UART1 control register’s content, either P12[2:0] or P1[3:1] can be used as the UART1 ports.

Revision 0.0 Page 4 of 10 August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

8. ELECTRICAL SPECIFICATION

8.1. Absolute Maximum Rating

Item

Symbol

VDD

AVDD

VLCD/VLCD1/VLCD2

Rating

-0.5 to 6.0

-0.5 to VDD+0.5

TBD

Unit

V

mW

°C

Power Supply Voltage (logic)

Power Supply Voltage (analog)

Power Supply Voltage (LCD)

Input Voltage

Power Dissipation (Ta = 70°C)

Storage Temperature

Operating Temperature

V_IN

Pd

T_STG

Topr

-20 to 125

0 to 70

8.2. Recommended Operating Condition

Item

Symbol

Min.

Typ.

Max.

Unit

Power Supply Voltage (logic)

Power Supply Voltage (analog)

Power Supply Voltage (LCD)

VDD

AVDD

VLCD

VLCD1

VLCD2

V_IN

2.7

-

3.6

V

VDD

VLCD

VLCD1

VDD

70

VLCD2

0

Input Voltage (digital)

Input Voltage (analog)

Operating Temperature

V

°C

V_IN

T_OPR

8.3. Leakage Current and Capacitance

Symbol Parameter

Condition

No pull-up or pull-down

Min.

-10

-

Typ. Max.

Unit

μA

pF

I_IN

I_OZ

Input current

-

10

5

Tri-state leakage current

Input capacitance _*Note1

Output capacitance _*Note1

Bidirectional buffer capacitance _*Note1

C_IN

C_BID

*Note1:

capacitance value are specified without the package

8.4. DC Electrical Characteristics

(VDD=3.3V±10%, AVDD=3.3V±10%, operating temperature = 0°C - 70°C unless specified otherwise)

Symbol Parameter

Condition

Min.

Typ.

Max.

Unit

V_DD

Supply Voltage (logic)

Core operating mode

Clock mode

Core operating mode

Clock mode

2.7

2.4

2.7

2.4

0.7*VDD

-

3.6

V

AV_DD

Supply Voltage (analog)

-

V

V_IH

V_IL

Input high voltage

Input low voltage

-

V

0.3*VDD

R_PU

R_PD

V_INA

I_OL

I_OH

Idd_opr

Idd_idle

Pull-up resistance

V_IN= 0V

V_IN= VDD

30k

150

2.1

1.4

-

45k

-

3.3

2.3

7

75k

-

Ω

mVpp

mA

μA

Pull-down resistance

FMIN,AMIN,IFIN input voltage

Output low current

Output high current

Core operating current

Clock Mode current

VOL = 0.4V _*Note4

VOH = VDD-0.4V _*Note4

*Note2

10

100

-

80

VDD=3.3V, T=25°C _*Note3

*Note2: LCD is ON. The CPU clock source is from the internal PLL clock. No active load is being driven. All

inputs = 0V or VDD.

*Note3: LCD is ON. The CPU clock source is from the 32kHz oscillator pads. No active load is being driven.

All inputs = 0V or VDD.

*Note4: Excluding PLLFLT, ATONE, XOSC.

Revision 0.0

Page 5 of 10

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

9. PACKAGE INFORMATION

Revision 0.0

Page 6 of 10

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

10.SOLDERING INDICATION

This section gives a very brief insight to a complex technology. There is no soldering method that is ideal for all

surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for

fine pitch SMDs. In these situations reflow soldering is recommended.

1. Reflow Soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should

preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages.

2. Wave Soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

If wave soldering is used, the following conditions must be observed for optimal results:

z

Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth

laminar wave.

For packages with leads on two sides and a pitch:

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction

of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-

circuit board.

The footprint must incorporate solder thieves at the downstream end.

z

For packages with leads on four sides, the footprint must be placed at a 45ꢀangle to the transport direction of the

printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250°C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

3. Manual Soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron

applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and

320 °C.

Revision 0.0

Page 7 of 10

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

4. Suitability of Surface Mount IC Packages for Wave and Reflow Soldering Methods

Soldering Method

Wave

Not suitable ⁽²⁾

Package

Reflow ⁽¹⁾

Suitable

BGA, HBGA, LFBGA, SQFP, TFBGA

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS

PLCC (3), SO, SOJ

Not suitable

Suitable

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

Not recommended ⁽³⁾⁽⁴⁾

Not recommended ⁽⁵⁾

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks

may occur due to vaporization of the moisture in them (the so called popcorn effect).

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at

bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, the package must be placed at a 45ꢀangle to the solder wave direction. The package

footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch equal to or larger than 0.8 mm; it is

definitely not suitable for packages with a pitch equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch equal to or smaller than 0.5 mm.

Revision 0.0

Page 9 of 10

August 25, 2008

AP909

OTP Microcontroller with LCD Driver for

Wireless Audio Docking Application

Valence Semiconductor Design Limited

Unit 2001, 20/F, APEC Plaza,

49 Hoi Yuen Road, Kwun Tong, Hong Kong

Tel: (852) 2797 3288

Fax: (852) 2776 7770

Email: inquiry@valencetech.com

Website: http://www.valencetech.com

IMPORTANT NOTICE

“Preliminary” product information describes products that are in production, but for which full characterization data is not yet available. ValenceTech Ltd. and its affiliates (“Valence”) believe that the

information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of any kind (express or implied).

Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the

terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. No responsibility is assumed by

Valence for the use of this information, including use of this information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. This document

is the property of Valence and by furnishing this information, Valence grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other

intellectual property rights. Valence owns the copyrights associated with the information contained herein and gives consent for copies to be made of the information only for use within your

organization with respect to Valence integrated circuits or other products of Valence. This consent does not extend to other copying such as copying for general distribution, advertising or

promotional purposes, or for creating any work for resale. An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies

described in this material and controlled under the “Foreign Exchange and Foreign Trade Law” is to be exported or taken out of Japan. An export license and /or quota needs to be obtained from the

competent authorities of the Chinese Government if any of the products or technologies described in this material is subject to the PRC Foreign Trade Law and is to be exported or taken out of the

PRC. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR

ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). VALENCE PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN AIRCRAFT SYSTEMS, MILITARY

APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, LIFE SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS (INCLUDING MEDICAL DEVICES, AIRCRAFT

SYSTEMS OR COMPONENTS AND PERSONAL OR AUTOMOTIVE SAFETY OR SECURITY DEVICES). INCLUSION OF VALENCE PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD

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MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY VALENCE PRODUCT THAT IS USED IN SUCH

A MANNER. IF THE CUSTOMER OR

CUSTOMER’S CUSTOMER USES OR PERMITS THE USE OF VALENCE PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY SUCH USE, TO FULLY INDEMNIFY VALENCE,

ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY, INCLUDING ATTORNEYS’ FEES AND COSTS, THAT MAY RESULT

FROM OR ARISE IN CONNECTION WITH THESE USES.

Revision 0.0

Page 10 of 10

August 25, 2008


型号：	AP909
厂家：	ETC
描述：	Iphone 音箱方案：AP909是业界成功解决TDMA;OTA;ATS 的方案，香港威龙科技半导体与苹果认证公司，紧密配合，用威龙的成熟方案可以顺利通过苹果认证，缩短开发周期。 iPhone音箱方案： AP909是业界成功解决TDMA ; OTA ; ATS的方案，香港威龙科技半导体与苹果认证公司，紧密配合，用威龙的成熟方案可以顺利通过苹果认证，缩短开发周期。半导体
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中文：	中文翻译
下载：	下载PDF数据表文档文件

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