AP90T03P-HF [A-POWER]
TRANSISTOR POWER, FET, FET General Purpose Power;型号: | AP90T03P-HF |
厂家: | ADVANCED POWER ELECTRONICS CORP. |
描述: | TRANSISTOR POWER, FET, FET General Purpose Power 晶体 晶体管 功率场效应晶体管 开关 脉冲 驱动 |
文件: | 总6页 (文件大小:212K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AP90T03GH/J
RoHS-compliant Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Lower On- resistance
BVDSS
RDS(ON)
ID
30V
4mΩ
75A
D
S
▼ Simple Drive Requirement
▼ Fast Switching Characteristic
G
Description
G
The TO-252 package is widely preferred for commercial-industrial
surface mount applications and suited for low voltage applications
such as DC/DC converters. The through-hole version (AP90T03GJ)
is available for low-profile applications.
D
S
TO-252(H)
G
D
S
TO-251(J)
Absolute Maximum Ratings
Symbol
Parameter
Rating
30
Units
V
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
±20
V
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current1
ID@TC=25℃
ID@TC=100℃
IDM
75
A
63
A
350
A
PD@TC=25℃
Total Power Dissipation
96
W
Linear Derating Factor
0.7
W/℃
℃
℃
TSTG
TJ
Storage Temperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
Thermal Data
Symbol
Parameter
Value
1.3
Unit
℃/W
℃/W
Rthj-c
Rthj-a
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient
110
Data & specifications subject to change without notice
1
200802182
AP90T03GH/J
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
RDS(ON)
Parameter
Test Conditions
Min. Typ. Max. Units
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance2 VGS=10V, ID=45A
VGS=0V, ID=250uA
30
-
-
-
-
-
V
4
6
mΩ
mΩ
VGS=4.5V, ID=30A
-
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
VDS=10V, ID=30A
VDS=30V, VGS=0V
VDS=24V, VGS=0V
VGS= ±20V
0.8
-
55
-
3
-
V
gfs
Forward Transconductance
Drain-Source Leakage Current
Drain-Source Leakage Current (T=150oC)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
S
IDSS
uA
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
1
-
25
±100
96
j
IGSS
Qg
Gate-Source Leakage
Total Gate Charge2
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time2
Rise Time
-
ID=40A
60
8.5
38
14
83
66
120
Qgs
Qgd
td(on)
tr
VDS=24V
VGS=4.5V
VDS=15V
-
-
-
-
ID=30A
td(off)
tf
Turn-off Delay Time
Fall Time
RG=3.3Ω,VGS=10V
RD=0.5Ω
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
VGS=0V
4090 6540
VDS=25V
1010
890
-
-
f=1.0MHz
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min. Typ. Max. Units
VSD
trr
Forward On Voltage2
Reverse Recovery Time2
IS=45A, VGS=0V
IS=30A, VGS=0V,
dI/dt=100A/µs
-
-
-
-
1.3
V
51
63
-
-
ns
nC
Qrr
Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
THIS PRODUCT IS AN ELECTROSTATIC SENSITIVE, PLEASE HANDLE WITH CAUTION.
THIS PRODUCT HAS BEEN QUALIFIED FOR CONSUMER MARKET. APPLICATIONS OR USES AS CRITERIAL COMPONENT IN LIFE SUPPORT
DEVICE OR SYSTEM ARE NOT AUTHORIZED.
2
AP90T03GH/J
200
160
120
80
160
140
120
100
80
T C =25 o C
T C = 1 50 o
C
10V
7.0V
5.0V
10V
7.0V
5.0V
4.5V
4.5V
V G =3.0V
V G =3.0V
60
40
40
20
0
0
0
1
2
3
0
1
2
3
4
5
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
2.0
1.8
1.5
1.3
1.0
0.8
0.5
0.3
0.0
5.0
4.5
4.0
3.5
I D = 45 A
I D =20A
V
G =10V
T
C =25 o C
2
4
6
8
10
-50
0
50
100
150
T j , Junction Temperature ( o C)
V GS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
20
15
10
5
2
1.5
1
T j =150 o C
T j =25 o C
0.5
0
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-50
0
50
100
150
T j , Junction Temperature ( o C)
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP90T03GH/J
f=1.0MHz
10000
1000
100
14
I D = 40 A
12
Ciss
V DS =15V
10
8
V
V
DS =20V
DS =24V
Coss
Crss
6
4
2
0
0
20
40
60
80
100
120
1
5
9
13
17
21
25
29
V DS ,Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1000
100
10
1
Duty factor=0.5
0.2
0.1
100us
0.1
1ms
0.05
PDM
t
10ms
100ms
0.02
T
0.01
Duty factor = t/T
Single Pulse
T c =25 o C
Peak Tj = PDM x Rthjc + TC
DC
Single Pulse
0.01
1
0.00001
0.0001
0.001
0.01
0.1
1
10
0.1
1
10
100
V DS ,Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VDS
VG
90%
QG
4.5V
QGD
QGS
10%
VGS
t
tr
td(on)
d(off) tf
Q
Charge
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
4
ADVANCED POWER ELECTRONICS CORP.
Package Outline : TO-252
Millimeters
D
SYMBOLS
MIN
NOM MAX
D1
A2
A3
B1
D
1.80
0.40
0.40
6.00
4.80
3.50
2.20
0.5
2.30
0.50
0.70
6.50
5.35
4.00
2.63
0.85
5.70
1.10
2.30
0.50
2.80
0.60
1.00
7.00
5.90
4.50
3.05
1.20
6.30
1.80
--
E2
D1
E3
F
E3
F1
E1
E2
e
E1
5.10
0.50
--
C
0.35
0.65
B1
F1
F
1.All Dimensions Are in Millimeters.
e
e
2.Dimension Does Not Include Mold Protrusions.
R : 0.127~0.381
A2
(0.1mm
C
A3
Part Marking Information & Packing : TO-252
Part Number
Package Code
meet Rohs requirement
90T03GH
LOGO
Date Code (YWWSSS)
YWWSSS
Y:Last Digit Of The Year
WW:Week
SSS:Sequence
5
ADVANCED POWER ELECTRONICS CORP.
D
Millimeters
A
SYMBOLS
MIN
NOM
MAX
c1
D1
Original Original Original
A
A1
B1
B2
c
2.10
0.60
0.40
0.60
0.40
0.40
6.00
4.80
5.00
1.20
----
2.30
1.20
0.60
0.95
0.50
0.55
6.50
5.40
5.50
1.70
2.30
---
2.50
1.80
0.80
1.25
0.65
0.70
7.00
5.90
6.00
2.20
----
E2
E
E1
c1
D
A1
D1
E1
E2
e
B2
B1
F
F
7.00
16.70
1.All Dimensions Are in Millimeters.
c
2.Dimension Does Not Include Mold Protrusions.
e
e
Part Marking Information & Packing : TO-251
Part Number
meet Rohs requirement
Package Code
90T03GJ
LOGO
YWWSSS
Date Code (YWWSSS)
Y :Last Digit Of The Year
WW:Week
SSS :Sequence
6
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