APT10090BLL_03 [ADPOW]
Power MOS 7TM is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS.; 功率MOS 7TM是新一代低损耗,高电压,N沟道增强型功率MOSFET 。![APT10090BLL_03](http://pdffile.icpdf.com/pdf1/p00107/img/icpdf/APT10090BLL_582718_icpdf.jpg)
型号: | APT10090BLL_03 |
厂家: | ![]() |
描述: | Power MOS 7TM is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. |
文件: | 总5页 (文件大小:97K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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APT10090BLL
APT10090SLL
1000V 12A 0.900Ω
R
BLL
POWER MOS 7 MOSFET
D3PAK
Power MOS 7® is a new generation of low loss, high voltage, N-Channel
enhancement mode power MOSFETS. Both conduction and switching
losses are addressed with Power MOS 7® by significantly lowering RDS(ON)
and Qg. Power MOS 7® combines lower conduction and switching losses
along with exceptionally fast switching speeds inherent with APT's
patented metal gate structure.
TO-247
SLL
D
S
• Lower Input Capacitance
• Lower Miller Capacitance
• Lower Gate Charge, Qg
• IncreasedPowerDissipation
• Easier To Drive
• TO-247 or Surface Mount D3PAK Package
G
MAXIMUM RATINGS
Symbol Parameter
All Ratings: T = 25°C unless otherwise specified.
C
APT10090
1000
12
UNIT
VDSS
ID
Drain-SourceVoltage
Volts
Continuous Drain Current @ TC = 25°C
Amps
Volts
1
IDM
Pulsed Drain Current
48
VGS
VGSM
Gate-SourceVoltageContinuous
±30
Gate-SourceVoltageTransient
±40
Total Power Dissipation @ TC = 25°C
LinearDeratingFactor
298
Watts
W/°C
PD
2.4
TJ,TSTG
TL
OperatingandStorageJunctionTemperatureRange
Lead Temperature: 0.063" from Case for 10 Sec.
-55 to 150
300
°C
Amps
mJ
1
IAR
Avalanche Current (Repetitive and Non-Repetitive)
12
1
EAR
EAS
30
Repetitive Avalanche Energy
4
1210
Single Pulse Avalanche Energy
STATIC ELECTRICAL CHARACTERISTICS
Symbol Characteristic / Test Conditions
MIN
1000
12
TYP
MAX
UNIT
BVDSS
ID(on)
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)
Volts
2
On State Drain Current
(VDS > ID(on) x RDS(on) Max, VGS = 10V)
Amps
2
RDS(on)
Drain-Source On-State Resistance
(VGS = 10V, 6A)
Ohms
µA
0.90
100
500
±100
5
Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V)
Zero Gate Voltage Drain Current (VDS = 800V, VGS = 0V, TC = 125°C)
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)
Gate Threshold Voltage (VDS = VGS, ID = 1mA)
IDSS
IGSS
nA
VGS(th)
Volts
3
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
DYNAMIC CHARACTERISTICS
Symbol Characteristic
APT10090BLL-SLL
TestConditions
MIN
TYP
MAX
UNIT
Ciss
Coss
Crss
Qg
Input Capacitance
1969
332
55
71
12
47
9
V
= 0V
GS
Output Capacitance
V
= 25V
DS
pF
f = 1 MHz
Reverse Transfer Capacitance
3
Total Gate Charge
V
= 10V
GS
V
= 500V
Qgs
Qgd
td(on)
tr
DD
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
nC
ns
I
= 12A @ 25°C
D
RESISTIVESWITCHING
V
= 15V
GS
5
V
= 500V
DD
I
= 12A @ 25°C
td(off)
23
Turn-off Delay Time
Fall Time
D
R
= 1.6Ω
G
tf
4
INDUCTIVESWITCHING@25°C
6
Eon
Eoff
Eon
Eoff
Turn-on Switching Energy
334
77
V
= 670V, V = 15V
GS
DD
I
= 12A, R = 5Ω
Turn-off Switching Energy
D
G
INDUCTIVESWITCHING@125°C
µJ
6
672
100
Turn-on Switching Energy
V
= 670V V = 15V
GS
DD
I
= 12A, R = 5Ω
Turn-off Switching Energy
D
G
SOURCE-DRAINDIODERATINGSANDCHARACTERISTICS
Symbol
IS
MIN
TYP
MAX
12
Characteristic / Test Conditions
UNIT
Continuous Source Current (Body Diode)
Amps
ISM
1
48
Pulsed Source Current
(Body Diode)
2
VSD
t rr
1.3
Diode Forward Voltage (VGS = 0V, IS = -ID12A)
Volts
ns
700
9.0
Reverse Recovery Time (IS = -ID12A, dlS/dt = 100A/µs)
Reverse Recovery Charge (IS = -ID12A, dlS/dt = 100A/µs)
Q rr
µC
dv
/
dv
5
V/ns
10
Peak Diode Recovery
/
dt
dt
THERMALCHARACTERISTICS
Symbol Characteristic
MIN
TYP
MAX
0.42
40
UNIT
RθJC
RθJA
Junction to Case
°C/W
Junction to Ambient
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
4 Starting T = +25°C, L = 16.81mH, R = 25Ω, Peak I = 12A
j
G
L
dv
5
/
numbers reflect the limitations of the test circuit rather than the
di
dt
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
device itself.
I
≤ -I 12A
/
≤ 700A/µs
VR ≤ V
T ≤ 150°C
J
dt
S
D
DSS
6 Eon includes diode reverse recovery measured in accordance wtih
JEDEC standard JESD24-1. See figures 18, 20.
APTReservestherighttochange,withoutnotice,thespecificationsandinformationcontainedherein.
0.45
0.40
0.9
0.35
0.7
0.30
0.25
0.5
0.20
Note:
t
1
0.15
0.3
t
2
0.10
t
1
Duty Factor D =
/
t
2
0.1
Peak T = P
x Z + T
0.05
J
DM
θJC C
0.05
SINGLEPULSE
10-3
0
10-5
10-4
10-2
10-1
1.0
RECTANGULARPULSEDURATION(SECONDS)
FIGURE1,MAXIMUMEFFECTIVETRANSIENTTHERMALIMPEDANCE,JUNCTION-TO-CASEvsPULSEDURATION
Typical Performance Curves
APT10090BLL-SLL
30
25
20
15
10
RC MODEL
Junction
temp. ( ”C)
7V
V
=15,10V& 7.5V
GS
6.5
0.164
0.00592F
0.125F
Power
(Watts)
6V
0.257
Case temperature
5.5V
5V
5
0
0
5
10
15
20
25
30
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)
DS
FIGURE2, TRANSIENT THERMAL IMPEDANCE MODEL
FIGURE3,LOW VOLTAGE OUTPUTCHARACTERISTICS
30
1.40
NORMALIZED TO
T
= -55°C
V
= 10V
@
I
= 6A
J
GS
D
1.30
1.20
1.10
1.00
25
20
15
10
T
= +125°C
= +25°C
J
T
J
V
=10V
GS
V
=20V
GS
V
> I (ON) x
R
MAX.
DS(ON)
250µSEC. PULSE TEST
DS
D
@ <0.5 % DUTY CYCLE
5
0
0.90
0.80
0
1
2
3
4
5
6
7
8
0
5
10
15
20
V
,GATE-TO-SOURCEVOLTAGE(VOLTS)
I ,DRAINCURRENT(AMPERES)
GS
D
FIGURE4, TRANSFERCHARACTERISTICS
FIGURE5, R
vsDRAINCURRENT
DS(ON)
12
10
8
1.15
1.10
1.05
1.00
0.95
6
4
2
0
0.90
0.85
25
50
75
100
125
150
-50 -25
0
25
50 75 100 125 150
T ,CASETEMPERATURE(°C)
T ,JUNCTIONTEMPERATURE(°C)
C
J
FIGURE6,MAXIMUMDRAINCURRENTvsCASETEMPERATURE
FIGURE7,BREAKDOWNVOLTAGEvsTEMPERATURE
2.5
1.2
I
= 6A
D
V
= 10V
GS
1.1
1.0
0.9
0.8
2.0
1.5
1.0
0.5
0.0
0.7
0.6
-50 -25
0
25 50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
T ,JUNCTIONTEMPERATURE(°C)
T ,CASETEMPERATURE(°C)
J
C
FIGURE8, R
vs. TEMPERATURE
FIGURE9,THRESHOLDVOLTAGEvsTEMPERATURE
DS(ON)
Typical Performance Curves
APT10090BLL-SLL
48
10,000
1,000
OPERATIONHERE
LIMITEDBYR (ON)
DS
C
iss
10
100µS
C
oss
1mS
1
100
10
10mS
C
rss
T
=+25°C
C
T =+150°C
J
SINGLEPULSE
10
.1
1
100
1000
0
10
20
30
40
50
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)
DS
DS
FIGURE10,MAXIMUMSAFEOPERATINGAREA
FIGURE11, CAPACITANCEvsDRAIN-TO-SOURCEVOLTAGE
16
200
I
= 12A
D
100
12
V
=200V
DS
T =+150°C
J
V
=500V
DS
T =+25°C
J
V
=800V
DS
8
10
4
0
1
0
10 20 30 40 50 60 70 80 90 100
Q ,TOTALGATECHARGE(nC)
0.3
V
0.5
0.7
0.9
1.1
1.3
1.5
,SOURCE-TO-DRAINVOLTAGE(VOLTS)
g
SD
FIGURE12,GATECHARGEvsGATE-TO-SOURCEVOLTAGE
FIGURE13, SOURCE-DRAINDIODEFORWARDVOLTAGE
60
40
t
d(off)
t
f
50
40
30
20
30
20
V
= 670V
DD
= 5Ω
R
T
G
= 125°C
J
V
= 670V
L = 100µH
DD
= 5Ω
R
T
G
= 125°C
t
r
J
L = 100µH
10
0
t
10
0
d(on)
5
10
15
20
0
5
10
(A)
15
20
I
(A)
I
D
D
FIGURE 14, DELAY TIMES vs CURRENT
FIGURE 15, RISE AND FALL TIMES vs CURRENT
1200
1000
800
1200
V
= 670V
DD
= 5Ω
R
T
E
G
on
1000
800
600
400
= 125°C
J
L = 100µH
EON includes
E
diode reverse recovery.
on
600
V
I
= 670V
DD
= 12A
400
D
T
= 125°C
J
E
off
E
5
L = 100µH
200
0
off
200
0
EON includes
diode reverse recovery.
5
10
15
20
0
10 15 20 25 30 35 40 45 50
R ,GATERESISTANCE(Ohms)
I
D
(A)
G
FIGURE16, SWITCHING ENERGYvs CURRENT
FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE
Typical Performance Curves
APT10090BLL-SLL
Gate Voltage
90%
t
10 %
Gate Voltage
T
= 125 C
T
= 125 C
J
J
t
d(off)
d(on)
t
r
Drain Current
Drain Voltage
Drain Current
90%
90%
5 %
5 %
10%
0
10 %
Drain Voltage
t
f
Switching Energy
Switching Energy
Figure18,Turn-onSwitchingWaveformsandDefinitions
Figure19,Turn-offSwitchingWaveformsandDefinitions
APT15DF120B
VCE
IC
VDD
G
D.U.T.
Figure 20, Inductive Switching Test Circuit
D3PAKPackageOutline
TO-247 Package Outline
4.98 (.196)
4.69 (.185)
15.95 (.628)
16.05 (.632)
13.41 (.528)
13.51 (.532)
5.31 (.209)
5.08 (.200)
15.49 (.610)
16.26 (.640)
1.04 (.041)
1.15 (.045)
1.49 (.059)
2.49 (.098)
1.47 (.058)
1.57 (.062)
5.38 (.212)
6.20 (.244)
6.15 (.242) BSC
Revised
8/29/97
11.51 (.453)
11.61 (.457)
13.79 (.543)
13.99 (.551)
20.80 (.819)
21.46 (.845)
3.50 (.138)
3.81 (.150)
0.46 (.018)
0.56 (.022)
{3 Plcs}
1.27 (.050)
1.40 (.055)
0.020 (.001)
0.178 (.007)
2.87 (.113)
3.12 (.123)
3.81 (.150)
4.50 (.177) Max.
1.98 (.078)
2.08 (.082)
4.06 (.160)
2.67 (.105)
2.84 (.112)
(Base of Lead)
1.65 (.065)
2.13 (.084)
1.22 (.048)
1.32 (.052)
0.40 (.016)
0.79 (.031)
19.81 (.780)
20.32 (.800)
Heat Sink (Drain)
and Leads
are Plated
5.45 (.215) BSC
{2 Plcs.}
1.01 (.040)
1.40 (.055)
Gate
Drain
Source
Source
Drain
Gate
Dimensions in Millimeters (Inches)
2.21 (.087)
2.59 (.102)
5.45 (.215) BSC
2-Plcs.
Dimensions in Millimeters and (Inches)
APT'sdevicesarecoveredbyoneormoreofthefollowingU.S.patents:
4,895,810
5,256,583
5,045,903
4,748,103
5,089,434
5,283,202
5,182,234
5,231,474
5,019,522
5,434,095
5,262,336
5,528,058
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APT10090SFLL
Power MOS 7TM is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS.
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Power MOS 7TM is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS.
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