APT10090BLL_03 [ADPOW]

Power MOS 7TM is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS.; 功率MOS 7TM是新一代低损耗,高电压,N沟道增强型功率MOSFET 。
APT10090BLL_03
型号: APT10090BLL_03
厂家: ADVANCED POWER TECHNOLOGY    ADVANCED POWER TECHNOLOGY
描述:

Power MOS 7TM is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS.
功率MOS 7TM是新一代低损耗,高电压,N沟道增强型功率MOSFET 。

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APT10090BLL  
APT10090SLL  
1000V 12A 0.900Ω  
R
BLL  
POWER MOS 7 MOSFET  
D3PAK  
Power MOS 7® is a new generation of low loss, high voltage, N-Channel  
enhancement mode power MOSFETS. Both conduction and switching  
losses are addressed with Power MOS 7® by significantly lowering RDS(ON)  
and Qg. Power MOS 7® combines lower conduction and switching losses  
along with exceptionally fast switching speeds inherent with APT's  
patented metal gate structure.  
TO-247  
SLL  
D
S
• Lower Input Capacitance  
• Lower Miller Capacitance  
• Lower Gate Charge, Qg  
• IncreasedPowerDissipation  
• Easier To Drive  
• TO-247 or Surface Mount D3PAK Package  
G
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specified.  
C
APT10090  
1000  
12  
UNIT  
VDSS  
ID  
Drain-SourceVoltage  
Volts  
Continuous Drain Current @ TC = 25°C  
Amps  
Volts  
1
IDM  
Pulsed Drain Current  
48  
VGS  
VGSM  
Gate-SourceVoltageContinuous  
±30  
Gate-SourceVoltageTransient  
±40  
Total Power Dissipation @ TC = 25°C  
LinearDeratingFactor  
298  
Watts  
W/°C  
PD  
2.4  
TJ,TSTG  
TL  
OperatingandStorageJunctionTemperatureRange  
Lead Temperature: 0.063" from Case for 10 Sec.  
-55 to 150  
300  
°C  
Amps  
mJ  
1
IAR  
Avalanche Current (Repetitive and Non-Repetitive)  
12  
1
EAR  
EAS  
30  
Repetitive Avalanche Energy  
4
1210  
Single Pulse Avalanche Energy  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
MIN  
1000  
12  
TYP  
MAX  
UNIT  
BVDSS  
ID(on)  
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)  
Volts  
2
On State Drain Current  
(VDS > ID(on) x RDS(on) Max, VGS = 10V)  
Amps  
2
RDS(on)  
Drain-Source On-State Resistance  
(VGS = 10V, 6A)  
Ohms  
µA  
0.90  
100  
500  
±100  
5
Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V)  
Zero Gate Voltage Drain Current (VDS = 800V, VGS = 0V, TC = 125°C)  
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)  
Gate Threshold Voltage (VDS = VGS, ID = 1mA)  
IDSS  
IGSS  
nA  
VGS(th)  
Volts  
3
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
APT Website - http://www.advancedpower.com  
DYNAMIC CHARACTERISTICS  
Symbol Characteristic  
APT10090BLL-SLL  
TestConditions  
MIN  
TYP  
MAX  
UNIT  
Ciss  
Coss  
Crss  
Qg  
Input Capacitance  
1969  
332  
55  
71  
12  
47  
9
V
= 0V  
GS  
Output Capacitance  
V
= 25V  
DS  
pF  
f = 1 MHz  
Reverse Transfer Capacitance  
3
Total Gate Charge  
V
= 10V  
GS  
V
= 500V  
Qgs  
Qgd  
td(on)  
tr  
DD  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time  
Rise Time  
nC  
ns  
I
= 12A @ 25°C  
D
RESISTIVESWITCHING  
V
= 15V  
GS  
5
V
= 500V  
DD  
I
= 12A @ 25°C  
td(off)  
23  
Turn-off Delay Time  
Fall Time  
D
R
= 1.6Ω  
G
tf  
4
INDUCTIVESWITCHING@25°C  
6
Eon  
Eoff  
Eon  
Eoff  
Turn-on Switching Energy  
334  
77  
V
= 670V, V = 15V  
GS  
DD  
I
= 12A, R = 5Ω  
Turn-off Switching Energy  
D
G
INDUCTIVESWITCHING@125°C  
µJ  
6
672  
100  
Turn-on Switching Energy  
V
= 670V V = 15V  
GS  
DD  
I
= 12A, R = 5Ω  
Turn-off Switching Energy  
D
G
SOURCE-DRAINDIODERATINGSANDCHARACTERISTICS  
Symbol  
IS  
MIN  
TYP  
MAX  
12  
Characteristic / Test Conditions  
UNIT  
Continuous Source Current (Body Diode)  
Amps  
ISM  
1
48  
Pulsed Source Current  
(Body Diode)  
2
VSD  
t rr  
1.3  
Diode Forward Voltage (VGS = 0V, IS = -ID12A)  
Volts  
ns  
700  
9.0  
Reverse Recovery Time (IS = -ID12A, dlS/dt = 100A/µs)  
Reverse Recovery Charge (IS = -ID12A, dlS/dt = 100A/µs)  
Q rr  
µC  
dv  
/
dv  
5
V/ns  
10  
Peak Diode Recovery  
/
dt  
dt  
THERMALCHARACTERISTICS  
Symbol Characteristic  
MIN  
TYP  
MAX  
0.42  
40  
UNIT  
RθJC  
RθJA  
Junction to Case  
°C/W  
Junction to Ambient  
1 Repetitive Rating: Pulse width limited by maximum junction  
temperature  
4 Starting T = +25°C, L = 16.81mH, R = 25, Peak I = 12A  
j
G
L
dv  
5
/
numbers reflect the limitations of the test circuit rather than the  
di  
dt  
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%  
3 See MIL-STD-750 Method 3471  
device itself.  
I
-I 12A  
/
700A/µs  
VR V  
T 150°C  
J
dt  
S
D
DSS  
6 Eon includes diode reverse recovery measured in accordance wtih  
JEDEC standard JESD24-1. See figures 18, 20.  
APTReservestherighttochange,withoutnotice,thespecificationsandinformationcontainedherein.  
0.45  
0.40  
0.9  
0.35  
0.7  
0.30  
0.25  
0.5  
0.20  
Note:  
t
1
0.15  
0.3  
t
2
0.10  
t
1
Duty Factor D =  
/
t
2
0.1  
Peak T = P  
x Z + T  
0.05  
J
DM  
θJC C  
0.05  
SINGLEPULSE  
10-3  
0
10-5  
10-4  
10-2  
10-1  
1.0  
RECTANGULARPULSEDURATION(SECONDS)  
FIGURE1,MAXIMUMEFFECTIVETRANSIENTTHERMALIMPEDANCE,JUNCTION-TO-CASEvsPULSEDURATION  
Typical Performance Curves  
APT10090BLL-SLL  
30  
25  
20  
15  
10  
RC MODEL  
Junction  
temp. ( ”C)  
7V  
V
=15,10V& 7.5V  
GS  
6.5  
0.164  
0.00592F  
0.125F  
Power  
(Watts)  
6V  
0.257  
Case temperature  
5.5V  
5V  
5
0
0
5
10  
15  
20  
25  
30  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
FIGURE2, TRANSIENT THERMAL IMPEDANCE MODEL  
FIGURE3,LOW VOLTAGE OUTPUTCHARACTERISTICS  
30  
1.40  
NORMALIZED TO  
T
= -55°C  
V
= 10V  
@
I
= 6A  
J
GS  
D
1.30  
1.20  
1.10  
1.00  
25  
20  
15  
10  
T
= +125°C  
= +25°C  
J
T
J
V
=10V  
GS  
V
=20V  
GS  
V
> I (ON) x  
R
MAX.  
DS(ON)  
250µSEC. PULSE TEST  
DS  
D
@ <0.5 % DUTY CYCLE  
5
0
0.90  
0.80  
0
1
2
3
4
5
6
7
8
0
5
10  
15  
20  
V
,GATE-TO-SOURCEVOLTAGE(VOLTS)  
I ,DRAINCURRENT(AMPERES)  
GS  
D
FIGURE4, TRANSFERCHARACTERISTICS  
FIGURE5, R  
vsDRAINCURRENT  
DS(ON)  
12  
10  
8
1.15  
1.10  
1.05  
1.00  
0.95  
6
4
2
0
0.90  
0.85  
25  
50  
75  
100  
125  
150  
-50 -25  
0
25  
50 75 100 125 150  
T ,CASETEMPERATURE(°C)  
T ,JUNCTIONTEMPERATURE(°C)  
C
J
FIGURE6,MAXIMUMDRAINCURRENTvsCASETEMPERATURE  
FIGURE7,BREAKDOWNVOLTAGEvsTEMPERATURE  
2.5  
1.2  
I
= 6A  
D
V
= 10V  
GS  
1.1  
1.0  
0.9  
0.8  
2.0  
1.5  
1.0  
0.5  
0.0  
0.7  
0.6  
-50 -25  
0
25 50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
T ,JUNCTIONTEMPERATURE(°C)  
T ,CASETEMPERATURE(°C)  
J
C
FIGURE8, R  
vs. TEMPERATURE  
FIGURE9,THRESHOLDVOLTAGEvsTEMPERATURE  
DS(ON)  
Typical Performance Curves  
APT10090BLL-SLL  
48  
10,000  
1,000  
OPERATIONHERE  
LIMITEDBYR (ON)  
DS  
C
iss  
10  
100µS  
C
oss  
1mS  
1
100  
10  
10mS  
C
rss  
T
=+25°C  
C
T =+150°C  
J
SINGLEPULSE  
10  
.1  
1
100  
1000  
0
10  
20  
30  
40  
50  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
V
,DRAIN-TO-SOURCEVOLTAGE(VOLTS)  
DS  
DS  
FIGURE10,MAXIMUMSAFEOPERATINGAREA  
FIGURE11, CAPACITANCEvsDRAIN-TO-SOURCEVOLTAGE  
16  
200  
I
= 12A  
D
100  
12  
V
=200V  
DS  
T =+150°C  
J
V
=500V  
DS  
T =+25°C  
J
V
=800V  
DS  
8
10  
4
0
1
0
10 20 30 40 50 60 70 80 90 100  
Q ,TOTALGATECHARGE(nC)  
0.3  
V
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
,SOURCE-TO-DRAINVOLTAGE(VOLTS)  
g
SD  
FIGURE12,GATECHARGEvsGATE-TO-SOURCEVOLTAGE  
FIGURE13, SOURCE-DRAINDIODEFORWARDVOLTAGE  
60  
40  
t
d(off)  
t
f
50  
40  
30  
20  
30  
20  
V
= 670V  
DD  
= 5Ω  
R
T
G
= 125°C  
J
V
= 670V  
L = 100µH  
DD  
= 5Ω  
R
T
G
= 125°C  
t
r
J
L = 100µH  
10  
0
t
10  
0
d(on)  
5
10  
15  
20  
0
5
10  
(A)  
15  
20  
I
(A)  
I
D
D
FIGURE 14, DELAY TIMES vs CURRENT  
FIGURE 15, RISE AND FALL TIMES vs CURRENT  
1200  
1000  
800  
1200  
V
= 670V  
DD  
= 5Ω  
R
T
E
G
on  
1000  
800  
600  
400  
= 125°C  
J
L = 100µH  
EON includes  
E
diode reverse recovery.  
on  
600  
V
I
= 670V  
DD  
= 12A  
400  
D
T
= 125°C  
J
E
off  
E
5
L = 100µH  
200  
0
off  
200  
0
EON includes  
diode reverse recovery.  
5
10  
15  
20  
0
10 15 20 25 30 35 40 45 50  
R ,GATERESISTANCE(Ohms)  
I
D
(A)  
G
FIGURE16, SWITCHING ENERGYvs CURRENT  
FIGURE 17, SWITCHING ENERGY VS. GATE RESISTANCE  
Typical Performance Curves  
APT10090BLL-SLL  
Gate Voltage  
90%  
t
10 %  
Gate Voltage  
T
= 125 C  
T
= 125 C  
J
J
t
d(off)  
d(on)  
t
r
Drain Current  
Drain Voltage  
Drain Current  
90%  
90%  
5 %  
5 %  
10%  
0
10 %  
Drain Voltage  
t
f
Switching Energy  
Switching Energy  
Figure18,Turn-onSwitchingWaveformsandDefinitions  
Figure19,Turn-offSwitchingWaveformsandDefinitions  
APT15DF120B  
VCE  
IC  
VDD  
G
D.U.T.  
Figure 20, Inductive Switching Test Circuit  
D3PAKPackageOutline  
TO-247 Package Outline  
4.98 (.196)  
4.69 (.185)  
15.95 (.628)  
16.05 (.632)  
13.41 (.528)  
13.51 (.532)  
5.31 (.209)  
5.08 (.200)  
15.49 (.610)  
16.26 (.640)  
1.04 (.041)  
1.15 (.045)  
1.49 (.059)  
2.49 (.098)  
1.47 (.058)  
1.57 (.062)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
Revised  
8/29/97  
11.51 (.453)  
11.61 (.457)  
13.79 (.543)  
13.99 (.551)  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
0.46 (.018)  
0.56 (.022)  
{3 Plcs}  
1.27 (.050)  
1.40 (.055)  
0.020 (.001)  
0.178 (.007)  
2.87 (.113)  
3.12 (.123)  
3.81 (.150)  
4.50 (.177) Max.  
1.98 (.078)  
2.08 (.082)  
4.06 (.160)  
2.67 (.105)  
2.84 (.112)  
(Base of Lead)  
1.65 (.065)  
2.13 (.084)  
1.22 (.048)  
1.32 (.052)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
Heat Sink (Drain)  
and Leads  
are Plated  
5.45 (.215) BSC  
{2 Plcs.}  
1.01 (.040)  
1.40 (.055)  
Gate  
Drain  
Source  
Source  
Drain  
Gate  
Dimensions in Millimeters (Inches)  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters and (Inches)  
APT'sdevicesarecoveredbyoneormoreofthefollowingU.S.patents:  
4,895,810  
5,256,583  
5,045,903  
4,748,103  
5,089,434  
5,283,202  
5,182,234  
5,231,474  
5,019,522  
5,434,095  
5,262,336  
5,528,058  

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