STPS2H100A [STMICROELECTRONICS]

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER; 高压功率肖特基整流器
STPS2H100A
型号: STPS2H100A
厂家: ST    ST
描述:

HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
高压功率肖特基整流器

二极管 测试 光电二极管 高压 PC 高电压电源
文件: 总6页 (文件大小:79K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STPS2H100A/U  
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER  
MAIN PRODUCT CHARACTERISTICS  
IF(AV)  
VRRM  
2 A  
100 V  
175 °C  
0.65 V  
Tj (max)  
VF (max)  
FEATURES AND BENEFITS  
SMA  
SMB  
NEGLIGIBLE SWITCHING LOSSES  
HIGH JUNCTION TEMPERATURE CAPABILITY  
LOW LEAKAGE CURRENT  
(JEDEC DO-214AC)  
STPS2H100A  
(JEDEC DO-214AA)  
STPS2H100U  
GOOD TRADE OFF BETWEEN LEAKAGE  
CURRENT AND FORWARD VOLTAGE DROP  
AVALANCHE RATED  
DESCRIPTION  
Schottky rectifier designed for high frequency  
miniature Switched Mode Power Supplies such as  
adaptators and on board DC/DC converters.  
Packaged in SMA or SMB.  
ABSOLUTE RATINGS  
Symbol  
(limiting values)  
Parameter  
Value  
Unit  
V
VRRM  
IF(RMS) RMS forward current  
Repetitive peak reverse voltage  
100  
10  
A
δ
IF(AV)  
IFSM  
IRRM  
IRSM  
Tstg  
Average forward current  
TL = 130°C = 0.5  
2
A
Surge non repetitive forward current  
Repetitive peak reverse current  
Non repetitive peak reverse current  
Storage temperature range  
tp = 10 ms sinusoidal  
75  
A
µ
tp=2 s F=1kHz square  
1
1
A
µ
tp = 100 s square  
A
°
C
- 65 to + 175  
175  
Tj  
Maximum operating junction temperature  
Critical rate of rise of reverse voltage  
°C  
µ
V/ s  
dV/dt  
10000  
November 1998 - Ed: 3A  
1/6  
STPS2H100A/U  
THERMAL RESISTANCES  
Symbol  
Parameter  
Value  
30  
Unit  
°
Rth (j-l)  
Junction to lead  
SMA  
SMB  
C/W  
25  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol  
Parameter  
Tests conditions  
Min. Typ. Max.  
Unit  
°
µ
A
IR *  
Reverse leakage current  
Tj = 25 C  
VR = VRRM  
1
Tj = 125°C  
0.4  
0.6  
1
mA  
V
°
VF **  
Forward voltage drop  
Tj = 25 C  
IF = 2 A  
IF = 2 A  
IF = 4 A  
IF = 4 A  
0.79  
0.65  
0.88  
0.74  
Tj = 125°C  
°
Tj = 25 C  
Tj = 125°C  
0.69  
Pulse test : * tp = 5 ms, δ < 2%  
** tp = 380 µs, δ < 2%  
To evaluate the maximum conduction losses use the following equation :  
2
P = 0.56 IF(AV) + 0.045 IF (RMS)  
Fig. 1:  
average forward current.  
Fig. 2:  
Average forward current versus ambient  
Average forward power dissipation versus  
δ
temperature ( =0.5).  
IF(av)(A)  
PF(av)(W)  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
1.8  
Rth(j-a)=Rth(j-l)  
δ = 0.2  
δ = 0.1  
δ = 0.5  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
δ = 0.05  
SMA  
Rth(j-a)=100°C/W  
S(Cu)=1.5cm²  
δ = 1  
SMB  
Rth(j-a)=80°C/W  
S(Cu)=1.5cm²  
T
T
tp  
IF(av) (A)  
=tp/T  
δ
0.2  
0.0  
tp  
=tp/T  
Tamb(°C)  
δ
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4  
0
25  
50  
75  
100  
125  
150  
175  
2/6  
STPS2H100A/U  
Fig. 3:  
Non repetitive surge peak forward current  
Fig. 4:  
Non repetitive surge peak forward current  
versus overload duration (maximum values)  
(SMB).  
versus overload duration (maximum values)  
(SMA).  
IM(A)  
IM(A)  
10  
9
8
8
7
6
7
Ta=50°C  
Ta=50°C  
5
6
5
4
3
2
1
4
Ta=100°C  
Ta=100°C  
3
2
IM  
IM  
Ta=150°C  
Ta=150°C  
t
t
1
δ
=0.5  
t(s)  
δ
=0.5  
t(s)  
0
0
1E-3  
1E-2  
1E-1  
1E+0  
1E-3  
1E-2  
1E-1  
1E+0  
Fig. 5:  
Fig. 6:  
Relative variation of thermal impedance  
junction to ambient versus pulse duration (SMA).  
Relative variation of thermal impedance  
junction to ambient versus pulse duration (SMB).  
Zth(j-a)/Rth(j-a)  
Zth(j-a)/Rth(j-a)  
1.0  
1.0  
Printed circuit board: S(Cu)=1.5cm² (e=35µm)  
Printed circuit board: S(Cu)=1.5cm² (e=35µm)  
0.9  
0.8  
0.7  
0.9  
0.8  
0.7  
0.6  
0.6  
δ = 0.5  
δ = 0.5  
0.5  
0.4  
0.5  
0.4  
δ = 0.2  
δ = 0.2  
0.3  
0.3  
T
T
0.2  
0.2  
δ = 0.1  
δ = 0.1  
0.1  
0.0  
0.1  
0.0  
tp(s)  
tp  
tp(s)  
tp  
=tp/T  
=tp/T  
δ
δ
Single pulse  
Single pulse  
1E-2  
1E-1  
1E+0  
1E+1  
1E+2  
1E+3  
1E-2  
1E-1  
1E+0  
1E+1  
1E+2  
Fig. 7:  
Fig. 8:  
Junction capacitance versus reverse  
voltage applied (typical values).  
Reverse leakage current versus reverse  
voltage applied (typical values).  
IR(µA)  
C(pF)  
1E+0  
200  
F=1MHz  
Tj=25°C  
Tj=125°C  
1E-1  
100  
50  
Tj=100°C  
1E-2  
Tj=75°C  
1E-3  
20  
1E-4  
VR(V)  
Tj=25°C  
VR(V)  
10  
1E-5  
1
2
5
10  
20  
50  
100  
0
10 20 30 40 50 60 70 80 90 100  
3/6  
STPS2H100A/U  
Fig. 9:  
Fig. 10:  
Thermal resistance junction to ambient  
Thermal resistance junction to ambient  
versus copper surface under each lead  
versus copper surface under each lead  
(Epoxy printed circuit board FR4, copper  
(Epoxy printed circuit board FR4, copper  
µ
µ
thickness: 35 m) (SMB).  
thickness: 35 m) (SMA).  
Rth(j-a) (°C/W)  
Rth(j-a) (°C/W)  
120  
140  
120  
100  
80  
100  
80  
60  
40  
20  
60  
40  
20  
S(Cu) (cm²)  
S(Cu) (cm²)  
0
0
0
1
2
3
4
5
0
1
2
3
4
5
Fig. 11:  
current .  
Forward voltage drop versus forward  
IFM(A)  
1E+1  
1E+0  
1E-1  
1E-2  
Tj=125°C  
Maximum  
values  
Tj=125°C  
Typical  
values  
Tj=25°C  
Maximum  
values  
VFM(V)  
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0  
4/6  
STPS2H100A/U  
PACKAGE MECHANICAL DATA  
SMA  
DIMENSIONS  
Millimeters Inches  
E1  
REF.  
Min.  
Max.  
Min.  
Max.  
D
A1  
A2  
b
1.90  
0.05  
1.25  
0.15  
4.80  
3.95  
2.25  
0.75  
2.70  
0.20  
1.65  
0.41  
5.60  
4.60  
2.95  
1.60  
0.075  
0.002  
0.049  
0.006  
0.189  
0.156  
0.089  
0.030  
0.106  
0.008  
0.065  
0.016  
0.220  
0.181  
0.116  
0.063  
E
c
A1  
E
E1  
D
A2  
C
L
b
L
FOOT PRINT  
(in millimeters)  
1.65  
1.45  
2.40  
1.45  
5/6  
STPS2H100A/U  
PACKAGE MECHANICAL DATA  
SMB  
DIMENSIONS  
Millimeters Inches  
Min. Max.  
E1  
REF.  
Min.  
Max.  
D
A1  
A2  
b
1.90  
0.05  
1.95  
0.15  
5.10  
4.05  
3.30  
0.75  
2.45  
0.20  
2.20  
0.41  
5.60  
4.60  
3.95  
1.60  
0.075  
0.002  
0.077  
0.006  
0.201  
0.159  
0.130  
0.030  
0.096  
0.008  
0.087  
0.016  
0.220  
0.181  
0.156  
0.063  
E
c
E
A1  
E1  
D
A2  
C
L
L
b
FOOT PRINT  
(in millimeters)  
2.3  
1.52  
2.75  
1.52  
Ordering type  
STPS2H100A  
STPS2H100U  
Marking  
S21  
Package  
Weight  
0.068g  
0.107g  
Base qty  
5000  
Delivery mode  
Tape & reel  
SMA  
SMB  
G21  
2500  
Tape & reel  
Band indicates cathode  
Epoxy meets UL94,V0  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of  
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by  
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to  
change without notice. This publication supersedes and replaces all information previously supplied.  
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-  
proval of STMicroelectronics.  
The ST logo is a registered trademark of STMicroelectronics  
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.  
STMicroelectronics GROUP OF COMPANIES  
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Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
6/6  

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