STPS2H100AFN [STMICROELECTRONICS]
Rectifier Diode;
| 型号： | STPS2H100AFN |
| 厂家： | 
ST |
| 描述： | Rectifier Diode 二极管 |
| 文件： | 总19页 (文件大小：403K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS2H100
Datasheet
100 V, 2 A power Schottky rectifier
Features
•
•
•
•
•
•
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade-off between leakage current and forward voltage drop
Avalanche capability specified
ECOPACK2 component
Applications
•
•
•
•
•
•
Switching diode
Battery charger
SMPS
DC / DC converter
Telecom power
LED lighting
Description
This Schottky rectifier is designed for high frequency miniature switched mode power
supplies such as adaptors and on board DC/DC converters.
Packaged in SMA, SMA Flat, SMB, SMB Flat and SMA Flat Notch, the STPS2H100
is ideal for use in lighting and telecom power applications.
Product status link
STPS2H100
Product summary
Symbol
Value
2 A
I
F(AV)
V
100 V
175 °C
0.65 V
RRM
T (max.)
j
V (max.)
F
DS1452 - Rev 10 - October 2019
www.st.com
For further information contact your local STMicroelectronics sales office.
STPS2H100
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
V
Repetitive peak reverse voltage
SMA
SMB
100
V
RRM
T = 130 °C, δ = 0.5
l
T = 135 °C, δ = 0.5
l
I
Average forward current
2
A
F(AV)
T = 145 °C, δ = 0.5
l
SMA Flat, SMA Flat Notch
SMB Flat
T = 150 °C, δ = 0.5
l
I
t = 10 ms sinusoidal
Surge non repetitive forward current
Repetitive peak avalanche power
Storage temperature range
75
173
A
FSM
p
P
t = 10 µs, T = 125 °C
W
°C
°C
ARM
p
j
T
-65 to +175
175
stg
Maximum operating junction temperature(1)
T
j
1. (dP /dT ) < (1/R ) condition to avoid thermal runaway for a diode on its own heatsink.
th(j-a)
tot
j
Table 2. Thermal resistance parameters
Symbol
Parameter
Max. value
Unit
SMA
30
20
25
15
SMA Flat, SMA Flat Notch
R
th(j-l)
Junction to lead
°C/W
SMB
SMB Flat
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
0.40
0.60
0.69
Max.
1.00
1.00
0.79
0.65
0.88
0.74
Unit
µA
T = 25 °C
-
-
-
-
-
-
j
(1)
V
= V
RRM
I
Reverse leakage current
R
R
T = 125 °C
mA
j
T = 25 °C
j
I = 2 A
F
T = 125 °C
j
(2)
V
Forward voltage drop
V
F
T = 25 °C
j
I = 4 A
F
T = 125 °C
j
1. Pulse test: t = 5 ms, δ < 2%
p
2. Pulse test: t = 380 µs, δ < 2%
p
To evaluate the conduction losses, use the following equation:
2
P = 0.56 x IF(AV) + 0.045 x IF (RMS)
DS1452 - Rev 10
page 2/19
STPS2H100
Characteristics (curves)
For more information, please refer to the following application notes related to the power losses :
•
•
AN604: Calculation of conduction losses in a power rectifier
AN4021: Calculation of reverse losses on a power diode
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
Figure 2. Average forward current versus ambient
temperature (δ = 0.5, SMA / SMB)
I
(A)
F(AV)
P
(W)
F(AV)
1.7
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Rth(j-a)=R
t h(j-I)
δ
= 0.2
= 0.1
δ
δ = 0.5
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
= 0.05
δ
SMB
SMA
SMA
Rth(j-a)= 100°C/W
S(CU) 1.5cm2
= 1
δ
=
SMB
Rth(j-a)
= 80°C/W
S(CU)= 1.5cm2
T
T
I
(A)
)
T
amb
(°C
F(AV)
tp
tp
=tp/T
1.8
δ =tp/T
25
δ
0
50
75
100
125
150
175
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
2.0
2.2
Figure 3. Average forward current versus ambient
temperature (δ = 0.5, SMB Flat)
Figure 4. Average forward current versus ambient
temperature (δ = 0.5, SMA Flat, SMA Flat Notch)
I
(A)
I
(A)
F(AV)
F(AV)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Rth(j-a)=Rth(j-l)
Rth(j-a)=Rth(j-l)
SMA Flat
SMA Flat Notch
SMBflat
Rth(j-a)= 40 °C/W
S
= 2.5 cm 2
CU
T
T
T
amb
(°C)
100
T
amb
(°C)
tp
=tp/T
δ
tp
=tp/T
δ
0
25
50
75
100
125
150
175
0
2 5
5 0
7 5
125
150
175
DS1452 - Rev 10
page 3/19
STPS2H100
Characteristics (curves)
Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
Figure 5. Normalized avalanche power derating versus
junction temperature (Tj = 125 °C)
PARM(t
)
Z
/R
p
th(j-a) th(j-a)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
PARM(10 µs)
SMA
1
0.1
0.01
0.001
Single pulse
tp(µs)
t (s)
p
1
10
100
1000
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction
to lead versus pulse duration (SMA Flat, SMA Flat Notch)
to ambient versus pulse duration (SMB)
Z
/R
Z
/R
th(j-l) th(j-l)
th(j-a) th(j-a)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
SMB
SMA Flat
SMA Flat Notch
Single pulse
Single pulse
t (s)
p
t (s)
p
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 9. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB Flat)
Figure 10. Reverse leakage current versus reverse
voltage applied (typical values)
Z
/R
th(j-l) th(j-l)
I
(µA)
R
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
SMBflat
Tj = 150 °C
T
j = 125 °C
Tj = 100 °C
Tj = 75 °C
Tj = 50 °C
Tj = 25 °C
Single pulse
t (s)
p
V (V)
R
0
20
40
60
80
100
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
DS1452 - Rev 10
page 4/19
STPS2H100
Characteristics (curves)
Figure 11. Junction capacitance versus reverse voltage
applied (typical values)
Figure 12. Forward voltage drop versus forward current
(low level)
C(pF)
I (A)
F
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
F= 1MHz
VOSC= 30mV
Tj= 25°C
RMS
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
Tj=25°C
(Maximum values)
V (V)
F
V
R
(V)
10
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1
10
100
Figure 13. Forward voltage drop versus forward current
(high level)
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
R
th(j-a)
(°C/W)
I (A)
F
100
10
1
200
150
100
50
Epoxy printed circuit board FR4,copper thickness: 35 µm
SMA
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
Tj=25°C
(Maximum values)
S(Cu)(cm²)
V (V)
F
0
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 15. Thermal resistance junction to ambient versus
copper surface under each lead (SMA Flat, SMA Flat
Notch)
Figure 16. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
R
th(j-a)
(°C/W)
R
th(j-a)
(°C/W)
200
150
100
50
200
150
100
50
Epoxy printed circuit board FR4,copper thickness: 35 µm
Epoxy p rinted circuit board FR4, copper t hickness: 35 µm
SMB
SMA Flat
SMA Flat Notch
S(Cu)(cm²)
S(Cu)(cm²)
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
DS1452 - Rev 10
page 5/19
STPS2H100
Characteristics (curves)
Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat)
Rth(j-a) (°C/W)
200
SMB-Flat
Epoxy printed circuit board FR4, e = 35 µm
Cu
150
100
50
SCu(cm²)
4.5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
5.0
DS1452 - Rev 10
page 6/19
STPS2H100
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMA Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 18. SMA Flat package outline
A
c
D
L 2x
L1 2x
E
E1
L
L2 2x
2x
b
Table 4. SMA Flat package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Inches (for reference only)
Typ.
Min.
0.90
1.25
0.15
2.25
4.80
3.95
0.75
Max.
1.10
1.65
0.40
2.95
5.60
4.60
1.50
Min.
0.035
0.049
0.005
0.088
0.188
0.155
0.029
Max.
0.044
0.065
0.016
0.117
0.221
0.182
0.060
A
b
c
D
E
E1
L
L1
L2
0.50
0.50
0.020
0.020
DS1452 - Rev 10
page 7/19
STPS2H100
SMA Flat package information
Figure 19. SMA Flat recommended footprint in mm (inches)
5.52
(0.217)
1.52
(0.060)
1.20
3.12
1.20
(0.047)
(0.123)
(0.047)
millimeter
(inches)
s
DS1452 - Rev 10
page 8/19
STPS2H100
SMA Flat Notch package information
2.2
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 20. SMA Flat Notch package outline
Table 5. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Typ.
Inches (for reference only)
Min.
Max.
Min.
Typ.
Max.
A1
A1
b
0.90
1.10
0.035
0.044
0.05
0.002
1.25
0.15
2.25
5.00
3.95
1.65
0.40
2.90
5.35
4.60
0.049
0.005
0.088
0.196
0.155
0.065
0.016
0.115
0.211
0.182
C
D
E
E1
G
2.00
0.85
0.079
0.033
G1
L
0.75
1.20
0.029
L1
L2
L3
V
0.45
0.45
0.05
0.018
0.018
0.002
8°
8°
8°
8°
V1
DS1452 - Rev 10
page 9/19
STPS2H100
SMA Flat Notch package information
Figure 21. SMA Flat Notch recommended footprint in mm (inches)
3.12
1.20
1.20
(0.047)
(0.047)
(0.123)
1.52
(0.060)
5.52
(0.217)
DS1452 - Rev 10
page 10/19
STPS2H100
SMA package information
2.3
SMA package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 22. SMA package outline
E1
D
E
A1
A2
C
L
b
Table 6. SMA package mechanical data
Dimensions
Millimeters
Ref.
Inches
Min.
1.90
0.05
1.25
0.15
2.25
4.80
3.95
0.75
Max.
2.45
0.20
1.65
0.40
2.90
5.35
4.60
1.50
Min.
Max.
0.097
0.008
0.065
0.016
0.114
0.211
0.181
0.059
A1
A2
b
0.075
0.002
0.049
0.006
0.089
0.189
0.156
0.030
c
D
E
E1
L
DS1452 - Rev 10
page 11/19
STPS2H100
SMA package information
Figure 23. SMA recommended footprint in mm (inches)
2.63
1.4
1.4
(0.055)
(0.055)
(0.103)
1.64
(0.064)
5.43
(0.214)
DS1452 - Rev 10
page 12/19
STPS2H100
SMB package information
2.4
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 24. SMB package outline
E1
D
E
A1
C
A2
L
b
Table 7. SMB package mechanical data
Dimensions
Ref.
Millimeters
Inches (for reference only)
Min.
1.90
0.05
1.95
0.15
3.30
5.10
4.05
0.75
Max.
2.45
0.20
2.20
0.40
3.95
5.60
4.60
1.50
Min.
Max.
A1
A2
b
0.0748
0.0020
0.0768
0.0059
0.1299
0.2008
0.1594
0.0295
0.0965
0.0079
0.0867
0.0157
0.1556
0.2205
0.1811
0.0591
c
D
E
E1
L
DS1452 - Rev 10
page 13/19
STPS2H100
SMB package information
Figure 25. SMB recommended footprint
2.60
1.62
1.62
(0.064)
(0.064)
(0.102)
2.18
(0.086)
5.84
(0.230)
DS1452 - Rev 10
page 14/19
STPS2H100
SMB Flat package information
2.5
SMB Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 26. SMB Flat package outline
A
c
D
L 2x
L1 2x
E
E1
L2 2x
b
Table 8. SMB Flat mechanical data
Dimensions
Ref.
Millimeters
Typ.
Inches (for reference only)
Typ.
Min.
0.90
1.95
0.15
3.30
5.10
4.05
0.75
Max.
1.10
2.20
0.40
3.95
5.60
4.60
1.50
Min.
0.035
0.077
0.006
0.130
0.201
0.159
0.030
Max.
0.043
0.087
0.016
0.156
0.220
0.181
0.059
A
b
c
D
E
E1
L
L1
L2
0.40
0.60
0.016
0.024
DS1452 - Rev 10
page 15/19
STPS2H100
SMB Flat package information
Figure 27. Footprint recommendations, dimensions in mm (inches)
1.20
3.44
1.20
(0.047)
(0.136) (0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS1452 - Rev 10
page 16/19
STPS2H100
Ordering Information
3
Ordering Information
Table 9. Ordering information
Order code
STPS2H100A
STPS2H100AF
STPS2H100AFN
STPS2H100U
STPS2H100UF
Marking
S21
Package
SMA
Weight
0.068 g
0.035 g
0.039 g
0.107 g
0.050 g
Base qty.
5000
Delivery mode
Tape and reel
Tape and reel
Tape and reel
Tape and reel
Tape and reel
F21
SMA Flat
SMA Flat Notch
SMB
10 000
10 000
2500
A21
G21
FG21
SMB Flat
5000
DS1452 - Rev 10
page 17/19
STPS2H100
Revision history
Table 10. Document revision history
Date
Version
Changes
Jul-2003
4A
5
Last update.
SMA package dimensions update. Reference A1 max. changed from 2.70
(0.106 inches) to 2.03 mm (0.080 inches).
Aug-2004
Reformatted to current standards. Added ECOPACK statement. Added
SMBflat package.
08-Feb-2007
6
15-Feb-2010
24-Jun-2013
7
8
Updated weight for SMBflat in Table 9.
Added SMAflat package
Removed figure 6.
Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise
specified) and Section Description.
17-May-2018
08-Oct-2019
9
Minor text changes to improve readability.
10
Added Section 2.2 SMA Flat Notch package information.
DS1452 - Rev 10
page 18/19
STPS2H100
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© 2019 STMicroelectronics – All rights reserved
DS1452 - Rev 10
page 19/19
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