STPS2L25UF [STMICROELECTRONICS]
Low drop power Schottky rectifier; 电力低压降肖特基整流器
| 型号： | STPS2L25UF |
| 厂家： | 
ST |
| 描述： | Low drop power Schottky rectifier |
| 文件： | 总9页 (文件大小：115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS2L25
Low drop power Schottky rectifier
Main product characteristics
A
IF(AV)
VRRM
2 A
25 V
Tj (max)
VF(max)
150° C
0.375 V
K
SMB
STPS2L25U
Features and benefits
■ Very low forward voltage drop for less power
dissipation
■ Optimized conduction/reverse losses trade-off
which means the highest efficiency in the
applications
A
■ Avalanche capability specified
K
Description
SMB flat
STPS2L25UF
Single Schottky rectifier suited to switched mode
power supplies and high frequency DC to DC
converters.
Packaged in SMB, SMB flat for thermal resistance
characteristic improvement, this device is
especially intended for use in parallel with
MOSFETs in synchronous rectification.
Table 1.
Symbol
VRRM
Absolute ratings (limiting values)
Parameter
Value
Unit
Repetitive peak reverse voltage
25
V
SMB
Average forward current
SMB flat
TL = 125° C δ = 0.5
TL = 135° C δ = 0.5
tp = 10 ms sinusoidal
tp = 1 µs Tj = 25° C
IF(AV)
2
A
IFSM
PARM
Tstg
Surge non repetitive forward current
Repetitive peak avalanche power
Storage temperature range
75
1500
A
W
°C
°C
-65 to + 150
150
Tj
Operating junction temperature(1)
dPtot
dTj
1
---------------
-------------------------
1.
<
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j – a)
February 2007
Rev 5
1/9
www.st.com
9
Characteristics
STPS2L25
1
Characteristics
Table 2.
Symbol
Thermal resistance
Parameter
Value
Unit
SMB
25
15
Rth(j-l)
Junction to lead
°C/W
SMB flat
Table 3.
Symbol
Static electrical characteristics
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
T = 25° C
90
30
µA
j
(1)
IR
Reverse leakage current
VR = VRRM
T = 125° C
j
15
mA
T = 25° C
j
0.45
0.375
0.53
0.51
IF = 2 A
T = 125° C
j
0.325
0.43
(1)
VF
Forward voltage drop
V
T = 25° C
j
IF = 4 A
T = 125° C
j
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the maximum conduction losses, use the following equation:
2
P = 0.24 x I
+ 0.068 I
F(AV)
F (RMS)
2/9
STPS2L25
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature (δ = 0.5) SMB
P
(W)
I
(A)
F(AV)
F(AV)
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Rth(j-a)=Rth(j-l)
SMB
δ = 0.2
δ = 0.1
δ = 0.5
δ = 0.05
Rth(j-a)=100°C/W
δ = 1
T
T
I
(A)
F(AV)
T (°C)
amb
tp
2.2 2.4
=tp/T
tp
=tp/T
δ
δ
0.0
0.2 0.4
0.6 0.8
1.0 1.2
1.4 1.6
1.8 2.0
2.6
0
25
50
75
100
125
150
Figure 3.
Average forward current
versus ambient temperature
(δ = 0.5) SMB flat
Figure 4.
Non repetitive surge peak forward
current versus overload duration
(maximum values) SMB
I
(A)
I
(A)
M
F(AV)
10
9
8
7
6
5
4
3
2
1
0
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Rth(j-a)=Rth(j-l)
SMB
SMB flat
Rth(j-a)=100°C/W
Ta=25°C
Ta=75°C
Ta=125°C
T
IM
t
T (°C)
amb
tp
t(s)
=tp/T
δ=0.5
δ
0
25
50
75
100
125
150
1.E-03
1.E-02
1.E-01
1.E+00
Figure 5.
Non repetitive surge peak forward Figure 6.
current versus overload duration
(maximum values) SMB flat
Normalized avalanche power
derating versus pulse duration
I
(A)
M
P
(t )
p
(1µs)
ARM
30
25
20
15
10
5
SMB flat
P
ARM
1
0.1
TL=25°C
TL=75°C
0.01
TL=125°C
IM
t
t (µs)
p
0.001
t(s)
δ=0.5
0
0.01
0.1
1
10
100
1000
1.E-03
1.E-02
1.E-01
1.E+00
3/9
Characteristics
STPS2L25
Figure 7.
Normalized avalanche power
Figure 8.
Relative variation of thermal
derating versus junction
temperature
impedance junction to ambient
versus pulse duration - SMB
Z
/R
th(j-a) th(j-a)
P
ARM
(t )
p
(25°C)
ARM
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
SMB
P
1.2
1
0.8
0.6
0.4
0.2
T
T (°C)
j
Single pulse
t (s)
p
0
tp
=tp/T
δ
25
50
75
100
125
150
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 9.
Relative variation of thermal
impedance junction to lead
versus pulse duration - SMB flat
Figure 10. Reverse leakage current versus
reverse voltage applied (typical
values)
I (mA)
R
Z
/R
th(j-l) th(j-l)
1.E+02
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
SMB flat
Tj=150°C
Tj=125°C
1.E+01
Tj=100°C
1.E+00
1.E-01
Tj=25°C
1.E-02
Single pulse
t (s)
p
V (V)
R
1.E-03
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0
5
10
15
20
25
Figure 11. Junction capacitance versus
Figure 12. Forward voltage drop versus
forward current (typical values)
reverse voltage applied (typical
values)
C(pF)
I
(A)
FM
1000
100
10
10.0
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=125°C
Tj=150°C
Tj=25°C
1.0
V
(V)
FM
V (V)
R
0.1
1
10
100
0.0
0.1
0.2
0.3
0.4
0.5
0.6
4/9
STPS2L25
Characteristics
Figure 13. Forward voltage drop versus
forward current (maximum values,
high level)
Figure 14. Forward voltage drop versus
forward current (maximum values,
low level)
I
(A)
I
(A)
FM
FM
10.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Tj=125 °C
(maximum values)
Tj=125 °C
(maximum values)
1.0
Tj=125 °C
(typical values)
Tj=125 °C
(typical values)
Tj=25 °C
(maximum values)
Tj=25 °C
(maximum values)
V
(V)
FM
V (V)
FM
0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, e =35µm)
CU
R
(°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
SMB
SMB flat
S
(Cm²)
CU
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5/9
Package information
STPS2L25
2
Package information
●
Epoxy meets UL94, V0
Table 4.
SMB dimensions
Dimensions
Millimeters
Min. Max.
Ref.
Inches
E1
Min.
Max.
A1
A2
b
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
2.45
0.20
2.20
0.40
5.60
4.60
3.95
1.50
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.059
D
E
c
A1
E
A2
E1
D
C
L
b
L
Figure 16. SMB footprint (dimensions in mm)
1.62
2.60
1.62
2.18
5.84
6/9
STPS2L25
Package information
Table 5.
SMB Flat dimensions
Dimensions
Millimeters
Min. Typ. Max. Min. Typ. Max.
Ref.
Inches
A
c
A
0.90
1.10 0.035
2.20 0.077
0.40 0.006
3.95 0.130
5.60 0.200
4.60 0.189
1.50 0.029
0.043
0.087
0.016
0.156
0.220
0.181
0.059
D
b(1) 1.95
c(1) 0.15
L
L2
L1
D
E
3.30
5.10
E
E1
L
E1 4.05
b
L
0.75
L1
L2
0.40
0.60
0.016
0.024
1. Applies to plated leads
Figure 17. SMB Flat footprint (dimensions in mm)
5.84
2.07
1.20
3.44
1.20
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Ordering information
STPS2L25
3
Ordering information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS2L25U
G23
SMB
0.107 g
0.50 g
2500
5000
Tape and reel
Tape and reel
STPS2L25UF
FG23
SMB flat
4
Revision history
Date
Revision
Changes
July 2003
4A
5
Last update
Reformatted to current standard. Added ECOPACK
statement. Added SMB flat package.
08-Feb-2007
8/9
STPS2L25
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