STPS2H100-Y [STMICROELECTRONICS]
Automotive power Schottky rectifier; 汽车大功率肖特基整流
| 型号： | STPS2H100-Y |
| 厂家： | 
ST |
| 描述： | Automotive power Schottky rectifier |
| 文件： | 总9页 (文件大小：112K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STPS2H100-Y
Automotive power Schottky rectifier
Features
■ Negligible switching losses
■ High junction temperature capability
■ Low leakage current
A
A
K
K
■ Good trade-off between leakage current and
SMA
STPS2H100AY
SMB
STPS2H100UY
forward voltage drop
■ Avalanche capability specified
®
■ ECOPACK 2 compliant component
■ AEC-Q101 qualified
Description
Table 1.
Device summary
Symbol
Value
Schottky rectifiers designed for high frequency
miniature switched mode power supplies such as
adaptators and on board DC/DC converters.
Available in SMA and SMB.
IF(AV)
VRRM
2 A
100 V
175 °C
0.65 V
Tj (max)
VF (max)
December 2010
Doc ID 17944 Rev 1
1/9
www.st.com
9
Characteristics
STPS2H100-Y
1
Characteristics
Table 2.
Symbol
Absolute ratings (limiting values)
Parameter
Value
Unit
VRRM Repetitive peak reverse voltage
IF(AV) Average forward current
100
2
V
A
SMA / SMB TL = 130 °C δ = 0.5
tp =10 ms sinusoidal
IFSM
Surge non repetitive forward current
75
A
PARM Repetitive peak avalanche power
tp = 1 µs Tj = 25 °C
2400
W
°C
°C
Tstg
Tj
Storage temperature range
Operating junction temperature range(1)
-65 to +175
-40 to +175
1
dPtot
dTj
<
1.
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
Table 3.
Symbol
Thermal resistance
Parameter
Value
Unit
SMA
30
25
Rth(j-l) Junction to lead
°C/W
SMB
Table 4.
Static electrical characteristics
Symbol
Parameter
Test conditions
Tj = 25 °C
Min.
Typ.
Max.
Unit
-
-
-
-
-
-
-
0.4
-
1
µA
(1)
IR
Reverse leakage current
VR = VRRM
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
1
mA
0.79
0.65
0.88
0.74
IF = 2 A
IF = 4 A
0.6
-
(2)
VF
Forward voltage drop
V
0.69
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
2
P = 0.56 x I
+ 0.045 I
F(AV)
F (RMS)
2/9
Doc ID 17944 Rev 1
STPS2H100-Y
Characteristics
Figure 1.
Average forward power dissipation Figure 2.
versus average forward current
Average forward current versus
ambient temperature (δ = 0.5)
(SMA / SMB)
P
(W)
I
(A)
F(AV)
F(AV)
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Rth(j-a)=Rth(j-I)
δ = 0.2
δ = 0.1
δ = 0.5
δ = 0.05
SMB
SMA
SMA
Rth(j-a)=100°C/W
S(CU)=1.5cm2
δ = 1
SMB
Rth(j-a)=80°C/W
S(CU)=1.5cm2
T
T
I
(A)
F(AV)
T (°C)
amb
tp
=tp/T
δ
1.8
tp
=tp/T
δ
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
2.0
2.2
0
25
50
75
100
125
150
175
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
Normalized avalanche power
derating versus junction
temperature
P
(t )
p
ARM
P
ARM
(T )
j
ARM
(25 °C)
P
ARM
(1 µs)
P
1
1.2
1
0.1
0.8
0.6
0.4
0.2
0.01
T (°C)
j
t (µs)
p
0.001
0
25
50
75
100
125
150
0.01
0.1
1
10
100
1000
Figure 5.
Non repetitive surge peak forward Figure 6.
current versus overload duration
(maximum values) (SMA)
Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
I
M
(A)
I
M
(A)
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
SMA
SMB
Ta=25°C
Ta=75°C
Ta=25°C
Ta=75°C
Ta=125°C
Ta=125°C
IM
IM
t
t
δ=0.5
δ=0.5
t(s)
t(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03
1.E-02
1.E-01
1.E+00
Doc ID 17944 Rev 1
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Characteristics
STPS2H100-Y
Figure 7.
Relative variation of thermal
Figure 8.
Reverse leakage current versus
impedance junction to ambient
versus pulse duration (SMA / SMB)
reverse voltage applied
(typical values)
I (µA)
Z
/R
R
th(j-a) th(j-a)
1.E+04
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
SMA
Tj=150°C
SMB
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
T
Single pulse
t (s)
p
tp
1.E+03
V (V)
R
=tp/T
δ
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0
20
40
60
80
100
Figure 9.
Junction capacitance versus
reverse voltage applied
(typical values)
Figure 10. Forward voltage drop versus
forward current (low level)
C(pF)
I
(A)
FM
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
Tj=25°C
(Maximum values)
V (V)
FM
V (V)
R
10
1
10
100
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
4/9
Doc ID 17944 Rev 1
STPS2H100-Y
Characteristics
Figure 11. Forward voltage drop versus
forward current (high level)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
R
(°C/W)
th(j-a)
I
(A)
FM
100
10
1
130
120
110
100
90
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
SMA
Tj=125°C
(Maximum values)
80
Tj=125°C
(Typical values)
70
60
50
40
Tj=25°C
(Maximum values)
30
20
10
V
(V)
FM
S (cm²)
CU
0
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB)
R (°C/W)
th(j-a)
110
100
90
80
70
60
50
40
30
20
10
0
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
SMB
S (cm²)
CU
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Doc ID 17944 Rev 1
5/9
Package information
STPS2H100-Y
2
Package information
●
●
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
Table 5.
SMA dimensions
Dimensions
Millimeters
Min. Max.
Ref.
Inches
Min. Max.
E1
A1
A2
b
1.90
0.05
1.25
0.15
2.25
4.80
3.95
0.75
2.45
0.20
1.65
0.40
2.90
5.35
4.60
1.50
0.075
0.002
0.049
0.006
0.089
0.189
0.156
0.030
0.094
0.008
0.065
0.016
0.114
0.211
0.181
0.059
D
E
c
D
A1
E
C
A2
L
b
E1
L
Figure 14. SMA footprint (dimensions in mm)
2.63
1.4
1.4
1.64
5.43
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Doc ID 17944 Rev 1
STPS2H100-Y
Package information
Dimensions
Table 6.
SMB dimensions
Ref.
Millimeters
Inches
E1
Min.
Max.
Min.
Max.
A1
A2
b
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
2.45
0.20
2.20
0.40
5.60
4.60
3.95
1.50
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.059
D
E
c
A1
E
A2
E1
D
C
L
b
L
Figure 15. SMB footprint (dimensions in mm)
1.62
2.60
1.62
2.18
5.84
Doc ID 17944 Rev 1
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Ordering information
STPS2H100-Y
3
Ordering information
Table 7.
Order code
STPS2H100AY
STPS2H100UY
Ordering information
Marking
Package
Weight
Base qty Delivery mode
S21Y
G21Y
SMA
SMB
0.068 g
0.107 g
5000
2500
Tape and reel
Tape and reel
4
Revision history
Table 8.
Date
03-Dec-2010
Document revision history
Revision
Changes
1
Initial release.
8/9
Doc ID 17944 Rev 1
STPS2H100-Y
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