STLC2690WTR [STMICROELECTRONICS]
Bluetooth V2.1 and FM RDS transceiver system-on-chip; 蓝牙V2.1和FM RDS收发器系统级芯片
| 型号： | STLC2690WTR |
| 厂家： | 
ST |
| 描述： | Bluetooth V2.1 and FM RDS transceiver system-on-chip |
| 文件： | 总6页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
STLC2690
Bluetooth V2.1 and FM RDS transceiver system-on-chip
Data Brief
Features
Description
■ Addition of the FM transmit functionality to
The STLC2690 combines Bluetooth V2.1 + EDR
and FM R(B)DS transceiver functionality on a
single chip designed in ST low power 65 nm
RFCMOS process. The device is fully optimized
for mobile phones, smart phones, PDAs and
portable multimedia player applications. The
required board space has been minimized. Power
consumption levels are optimized for battery
powered devices and the high integration level
allows a cost effective solution. The low external
BOM count allows easy integration of the
STLC2690 into products, enabling short time to
market.
Bluetooth and FM radio combo system-on-chip
– Send music content stored on a portable
device to any in-car or home FM tuner
system
– SureTuneTM technology to select the
optimal FM transmit frequency
■ Simultaneous operation of Bluetooth and FM
■ Very low power consumption for battery
powered devices
– Designed in ST’s low power 65 nm
RFCMOS technology
■ Increased link budget for both Bluetooth and
Figure 1.
Block diagram
FM to improve the connection stability
■ Small PCB footprint
– WLCSP package, 0.6 mm height and
0.4 mm pitch
– Only 10 external components
– Easy layout
– Require PCB footprint < 36 mm2
■ Easy integration on mobile platforms
– Support for low power and system
reference clocks (up to 52 MHz) of the
major cellular basebands
– 1.8 V supply voltage
– Several analog and digital audio and data
interfaces supported
– Reference design, development tools and
guidelines
January 2008
Rev 1
1/6
For further information contact your local STMicroelectronics sales office.
www.st.com
6
Overview
STLC2690
1
Overview
TM
1.1
Bluetooth features
●
Bluetooth™ V2.1+EDR compliant
–
–
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–
Point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability
ACL and SCO links
Extended SCO (eSCO) links
Faster connection
●
HW support for packet types
–
ACL:
DM1, DM3, DM5, DH1, DH3, DH5, 2-DH1, 2-DH3, 2-DH5, 3-DH1, 3-DH3, 3-DH5
–
–
SCO: HV1, HV3 and DV
eSCO: EV3, EV4, EV5, 2-EV3, 2-EV5, 3-EV3, 3-EV5
●
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Wide band speech support
Adaptive Frequency Hopping (AFH)
Channel Quality Driven Data Rate (CQDDR)
Transmit power
–
–
–
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Power Class 2 and Power Class 1.5 with integrated PA
Class 1.5 typical output power above 10 dBm
Programmable output power
Power Class 1 compatible
●
●
Sensitivity down to -90 dBm
HCI
–
–
–
–
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HCI H4 transport layer on UART and SPI
Bluetooth Type A transport layer on SDIO
HCI proprietary commands (for example peripherals control)
Single HCI command for patch/upgrade download
(e)SCO over HCI
●
●
●
Pitch-Period Error Concealment (PPEC) for improved voice quality
Efficient and flexible support for WLAN coexistence scenarios
Low power consumption
–
–
–
–
Ultra low power architecture with 3 different low-power levels
Deep sleep modes, including Host-power saving feature
Dual wake-up mechanism
Current consumption with 1.8 V supply:
Sniff mode (1.28 sec.): 75 µA
eSCO: 2-EV3: 5.1 mA
ACL: 3-DH5: 27 mA
2/6
STLC2690
Overview
●
Communication interfaces
–
–
–
–
–
–
–
UART up to 4 MHz
SPI interface
SDIO interface up to 25 MHz
PCM interface/I2S interface
I2C interface
Up to 16 additional flexibly programmable GPIOs
External interrupts possible through the GPIOs
●
●
On-chip memory organization
–
–
On chip RAM, including provision for patches
On chip ROM, preloaded with SW up to HCI
Ciphering support up to 128 bits key
1.2
FM transceiver features
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●
●
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Worldwide FM band (65 - 108 MHz) including Russian band
RDS/RBDS processor
On-chip demodulator, modulator and packet decoding and encoding
World best, State of the art receiver sensitivity of - 2.5 dBµV
Excellent receiver selectivity for audio and RDS
Adaptive signal processing, to provide best audio quality versus received signal quality
or in-band blockers.
●
●
●
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Autonomous ultra fast checking for alternate frequencies
Fast search tuning
Digital volume control and equalizer
High output power linear transmitter
Programmable transmit output level to comply with FCC and ETSI requirements
Embedded filtering for coexistence in mobile handset
Programmable AGC for optimized frequency deviation
SureTuneTM technology to automatically select the optimal transmit frequency
On-chip controller with ROM/RAM
Analog and digital audio output and input
Typical current consumption FM rx: 15 mA (1.8 V supply)
Control interface: I2C or HCI
High level API: easy software integration
3/6
Overview
STLC2690
1.3
Description
The STLC2690 is a system-on-chip Bluetooth V2.1 + EDR transceiver and FM R(B)DS
transceiver designed in ST low-power 65 nm RFCMOS process. The chip is offered in a
Wafer Level Chip Scale Package (WLCSP) of 0.6 mm height and 0.4 mm pitch.
The Bluetooth part is ROM-based, for applications requiring integration up to HCI level.
Patch RAM is available, enabling multiple patches/upgrades and fast time to volume. The
main interfaces are UART, SPI or SDIO for HCI transport, PCM or I2S for voice and a WLAN
coexistence interface. The radio has been designed specifically for single chip requirements,
for low power and minimum BOM count.
The FM radio transceiver contains both a broadcast FM radio tuner and a FM transmitter for
portable applications with worldwide FM band support. (De)multiplexing and (de)modulation
are performed in a digital data path. A small embedded microcontroller manages the
flexibility of the data path and takes care of the overall control of the transceiver. This
microcontroller is also used for transmission and reception of the European Radio Data
System (RDS) and the North American Radio Broadcast Data System (RBDS), including all
required symbol decoding, block synchronization, error detection, and error correction
functions. The FM can be controlled by the Host via a dedicated I2C interface or via the
Bluetooth HCI interface. A Host-level API is offered in order to facilitate integration of the FM
driver on the Host. Also a low-level API is supported.
The Bluetooth transceiver and FM transceiver are integrated on the same silicon, and share
at top-level power supplies, clocks and reset control. The chip integrates several regulators
to generate the internally needed voltages from the Host platform supply input.
The low external BOM count results in an overall PCB footprint of less than 36 mm2 (using
0201 components where possible, with a 0.3 mm spacing rule). The FM antenna matching
network, which depends on the specific antenna implementation, is included in this footprint.
4/6
STLC2690
Ordering information
2
Ordering information
Table 1.
Ordering information
Order code
Package
Packing
Tape on reel
STLC2690WTR
WLCSP
3
Revision history
Table 2.
Date
17-Jan-2008
Document revision history
Revision
Changes
1
Initial release.
5/6
STLC2690
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