STB55NE06T4 [STMICROELECTRONICS]

55A, 60V, 0.022ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB, D2PAK-3;
STB55NE06T4
型号: STB55NE06T4
厂家: ST    ST
描述:

55A, 60V, 0.022ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB, D2PAK-3

开关 脉冲 晶体管
文件: 总8页 (文件大小:276K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STB55NE06  
2
N-CHANNEL 60V - 0.19- 55A D PAK  
STripFET™ POWER MOSFET  
V
R
I
D
TYPE  
DSS  
DS(on)  
STB55NE06  
60 V  
<0.022 Ω  
55 A  
TYPICAL R (on) = 0.019Ω  
DS  
EXCEPTIONAL dv/dt CAPABILITY  
100% AVALANCHE TESTED  
o
LOW GATE CHARGE 100 C  
3
1
HIGH dv/dt CAPABILITY  
2
APPLICATION ORIENTED  
CHARACTERIZATION  
D PAK  
TO-263  
(suffix“T4”)  
FOR THROUGH-HOLE VERSION CONTACT  
SALES OFFICE  
DESCRIPTION  
This Power Mosfet is the latest development of  
STMicroelectronis unique "Single Feature Size™" strip-  
based process. The resulting transistor shows extremely  
high packing density for low on-resistance, rugged  
avalance characteristics and less critical alignment steps  
therefore a remarkable manufacturing reproducibility.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
DC MOTOR CONTROL  
DC-DC & DC-AC CONVERTERS  
SYNCHRONOUS RECTIFICATION  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
60  
Unit  
V
V
Drain-source Voltage (V = 0)  
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
60  
V
DGR  
GS  
V
Gate- source Voltage  
±20  
55  
V
GS  
I
Drain Current (continuos) at T = 25°C  
A
D
C
I
Drain Current (continuos) at T = 100°C  
39  
A
D
C
I
()  
Drain Current (pulsed)  
220  
130  
0.96  
7
A
DM  
P
Total Dissipation at T = 25°C  
W
tot  
C
Derating Factor  
W/°C  
V/ns  
°C  
°C  
(2)  
Peak Diode Recovery voltage slope  
Storage Temperature  
dv/dt  
T
–60 to 175  
175  
stg  
T
Max. Operating Junction Temperature  
j
()Pulse width limited by safe operating area.  
I
55A, di/dt 300A/µs, V V  
, T T  
(BR)DSS j JMAX.  
SD  
DD  
November 2000  
1/8  
STB55NE06  
THERMAL DATA  
R
Thermal Resistance Junction-case  
Max  
Max  
Typ  
1.15  
62.5  
0.5  
°C/W  
°C/W  
°C/W  
°C  
thj-case  
R
Thermal Resistance Junction-ambient  
Thermal Resistance Case-sink  
thj-amb  
thc-sink  
R
T
Maximum Lead Temperature For Soldering Purpose  
300  
j
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
Avalanche Current, Repetitive or Not-Repetitive  
I
AR  
55  
A
(pulse width limited by T max)  
j
Single Pulse Avalanche Energy  
E
AS  
200  
mJ  
(starting T = 25 °C, I = I , V = 25 V)  
j
D
AR  
DD  
ELECTRICAL CHARACTERISTICS (T  
= 25 °C unless otherwise specified)  
case  
OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
I
= 25 µA, V = 0  
GS  
D
V
60  
V
(BR)DSS  
Breakdown Voltage  
V
V
= Max Rating  
= Max Rating, T = 125 °C  
Zero Gate Voltage  
1
10  
µA  
µA  
DS  
I
DSS  
Drain Current (V = 0)  
GS  
DS  
C
Gate-body Leakage  
V
GS  
= ±20V  
±100  
nA  
I
GSS  
Current (V = 0)  
DS  
(1)  
ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
3
Max.  
4
Unit  
V
V
GS(th)  
V
V
= V  
I
= 250 µA  
I = 27.5 A  
D
Gate Threshold Voltage  
2
DS  
GS  
GS  
D
= 10V  
Static Drain-source On  
Resistance  
0.019  
0.022  
I
DS(on)  
V
V
> I  
= 10V  
x R  
D(on) DS(on)max  
DS  
I
On State Drain Current  
55  
A
D(on)  
GS  
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
> I x R  
DS(on)max,  
Min.  
Typ.  
Max.  
Unit  
V
DS  
D(on)  
(1)  
Forward Transconductance  
25  
35  
S
g
fs  
I
D
= 27.5 A  
C
C
V
= 25V f = 1 MHz V = 0  
DS GS  
Input Capacitance  
Output Capacitance  
3050  
380  
4000  
500  
pF  
pF  
iss  
oss  
Reverse Transfer  
Capacitances  
C
100  
130  
pF  
rss  
2/8  
STB55NE06  
ELECTRICAL CHARACTERISTICS (continued)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time Rise Time  
V
= 30V  
I
= 27.5 A  
= 10 V  
GS  
30  
120  
40  
160  
ns  
ns  
d(on)  
DD  
D
R
G
= 4.7 Ω  
V
t
r
(see test circuit, Figure 3)  
Q
V
DD  
=48V I =55A V =10V  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
80  
13  
25  
105  
nC  
nC  
nC  
g
D
GS  
Q
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time Rise Time  
Fall Time  
V
= 48 V  
I
= 55 A  
= 10 V  
GS  
55  
155  
70  
ns  
ns  
d(on)  
DD  
D
R
G
= 4.7 Ω  
V
(see test circuit, Figure 5)  
t
r
Cross-over Time  
t
c
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
55  
Unit  
A
I
Source-drain Current  
SD  
I
()  
Source-drain Current (pulsed)  
Forward On Voltage  
220  
1.5  
A
SDM  
V
(*)  
I
I
= 60A  
V
= 0  
GS  
V
SD  
SD  
SD  
t
rr  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
= 55 A  
di/dt = 100 A/µs  
T = 150 °C  
110  
430  
7.5  
ns  
µC  
A
V
= 30V  
DD  
j
Q
rr  
(see test circuit, Figure 3)  
I
RRM  
(*)Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
()Pulse width limited by safe operating area.  
Safe Operating Area  
Thermal Impedance  
3/8  
STB55NE06  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
4/8  
STB55NE06  
Normalized Gate Threshold Voltage vs  
Temperature  
Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
5/8  
STB55NE06  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuits For Resistive  
Fig. 4: Gate Charge test Circuit  
Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/8  
STB55NE06  
2
D PAK MECHANICAL DATA  
mm.  
inch  
TYP.  
DIM.  
MIN.  
4.4  
TYP  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.027  
0.044  
0.017  
0.048  
0.352  
MAX.  
0.181  
0.106  
0.009  
0.036  
0.067  
0.023  
0.053  
0.368  
A
A1  
A2  
B
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.393  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.590  
0.050  
0.055  
0.094  
0.208  
0.625  
0.055  
0.068  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0º  
8º  
7/8  
STB55NE06  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is registered trademark of STMicroelectronics  
2000 STMicroelectronics - All Rights Reserved  
All other names are the property of their respective owners.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -  
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
8/8  

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