STB20NM50-1 [STMICROELECTRONICS]
N-CHANNEL 500V - 0.20ohm - 20A TO-220/FP/D2PAK/I2PAK MDmesh?Power MOSFET; N沟道500V - 0.20ohm - 20A TO- 220 / FP / D2PAK / I2PAK的MDmesh功率MOSFET ?型号: | STB20NM50-1 |
厂家: | ST |
描述: | N-CHANNEL 500V - 0.20ohm - 20A TO-220/FP/D2PAK/I2PAK MDmesh?Power MOSFET |
文件: | 总16页 (文件大小:355K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
STB20NM50 - STB20NM50-1
STP20NM50 - STP20NM50FP
N-CHANNEL 550V@Tjmax - 0.20Ω - 20A - TO220/FP-D²PAK-I²PAK
Zener-Protected SuperMESH™ MOSFET
General features
Package
V
DSS(@Tj
max)
R
I
D
Type
DS(on)
STB20NM50
STB20NM50-1
STP20NM50
550 V
550 V
550 V
550 V
<0.25 Ω
<0.25 Ω
<0.25 Ω
<0.25 Ω
20 A
20 A
20 A
20 A
3
2
1
3
2
1
I²PAK
TO-220
STP20NM50FP
■ HIGH dv/dt AND AVALANCHE CAPABILITIES
■ 100% AVALANCHE TESTED
3
3
2
1
1
TO-220FP
D²PAK
■ LOW INPUT CAPACITANCE AND GATE
CHARGE
■ LOW GATE INPUT RESISTANCE
Internal schematic diagram
Description
The MDmesh™ is a new revolutionary MOSFET
technology that associates the Multiple Drain
process
with
the
Company’s
PowerMESH™horizontal layout. The resulting
product has an outstanding low on-resistance,
impressively high dv/dt and exellent avalanche
characteristics and dynamic performances.
Applications
The MDmesh™ family is very suitable for
increasing power density of high voltage
converters allowing system miniaturization
andhiher efficiencies
Order codes
Sales Type
Marking
Package
Packaging
STB20NM50T4
STB20NM50-1
STP20NM505
STP20NM50FP
B20NM50
B20NM50-1
P20NM50
D²PAK
I²PAK
TAPE & REEL
TUBE
TO-220
TO-220FP
TUBE
P20NM50FP
TUBE
Rev 2
1/16
September 2005
www.st.com
16
1 Electrical ratings
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
1
Electrical ratings
Table 1.
Symbol
Absolute maximum ratings
Parameter
Value
TO-220/D²PAK/I²PAK
Unit
TO-220FP
V
Gate-Source Voltage
± 30
V
A
A
A
GS
I
Drain Current (continuous) at T = 25°C
20
12.6
80
20 (Note 3)
12.6 (Note 3)
80 (Note 3)
45
D
C
I
Drain Current (continuous) at T = 100°C
D
C
I
Note 2
Drain Current (pulsed)
DM
P
Total Dissipation at T = 25°C
192
1.2
W
W/°C
V/ns
V
TOT
C
Derating Factor
0.36
dv/dt Note 1 Peak Diode Recovery voltage slope
15
V
Insulation Withstand Volatge (DC)
--
2000
ISO
T
Operating Junction Temperature
Storage Temperature
j
-65 to 150
°C
T
stg
Table 2.
Thermal data
TO-220/D²PAK/I²PAK
TO-220FP
Unit
Rthj-case Thermal Resistance Junction-case Max
0.65
62.5
2.8
°C/W
°C/W
Rthj-amb
Thermal Resistance Junction-amb Max
Maximum Lead Temperature For Soldering
Purpose
T
300
°C
l
Table 3.
Avalanche characteristics
Parameter
Symbol
Max Value
Unit
Avalanche Current, repetitive or
Not-Repetitive (pulse width limited by Tj max)
I
10
A
AR
Single Pulse Avalanche Energy
E
650
mJ
AS
(starting Tj=25°C, I =5A, V = 50V)
D
DD
2/16
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
2 Electrical characteristics
2
Electrical characteristics
(T
= 25 °C unless otherwise specified)
CASE
Table 4.
On/off states
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Drain-Source Breakdown
Voltage
V
I = 250µA, V = 0
500
V
(BR)DSS
D
GS
V
= Max Rating,
1
µA
µA
Zero Gate Voltage Drain
DS
DS
I
I
DSS
Current (V = 0)
V
= Max Rating,Tc = 125°C
10
GS
Gate Body Leakage Current
V
= ±30V
±100
µA
GSS
GS
(V = 0)
DS
V
R
V
V
= V , I = 250 µA
Gate Threshold Voltage
3
4
5
V
GS(th)
DS
GS
D
Static Drain-Source On
Resistance
= 10 V, I = 10 A
0.20
0.25
Ω
DS(on)
GS
D
Table 5.
Symbol
Dynamic
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
> I
xR
D(ON) DS(ON)max,
DS
g
Note 4
Forward Transconductance
10
S
fs
I
= 10A
D
C
C
iss
Input Capacitance
1480
285
34
pF
pF
pF
V
V
=25V, f=1 MHz, V =0
Output Capacitance
oss
DS
GS
Reverse Transfer Capacitance
C
rss
C
oss eq.
=0, V =0V to 400V
Equivalent Ouput Capacitance
Gate Input Resistance
130
1.6
pF
GS
DS
Note 5
f=1MHz Gate DC Bias=0
Test Signal Level=20mV
Open Drain
Rg
Ω
Q
V
V
=400V, I = 20A
g
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
40
13
19
56
nC
nC
nC
DD
GS
D
Q
=10V
gs
Q
(see Figure 15)
gd
3/16
2 Electrical characteristics
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
Table 6.
Symbol
Switching times
Parameter
Test Conditions
=250 V, I =10A,
Min.
Typ.
Max.
Unit
V
DD
D
t
Turn-on Delay Time
Rise Time
24
16
ns
ns
d(on)
R =4.7Ω, V =10V
G
GS
t
r
(see Figure 16)
=400 V, I =20A,
t
V
r(Voff)
Off-voltage Rise Time
Fall Time
9
ns
ns
ns
DD
D
t
R =4.7Ω, V =10V
8.5
23
f
G
GS
Cross-over Time
t
(see Figure 16)
c
Table 7.
Symbol
Source drain diode
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
I
Source-drain Current
20
80
A
A
SD
I
Note 2 Source-drain Current (pulsed)
SDM
V
Note 4
I
I
=20A, V =0
Forward on Voltage
1.5
V
SD
SD
GS
t
rr
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
350
4.6
26
ns
µC
A
=20A, di/dt = 100A/µs,
SD
Q
rr
V
=100 V, Tj=25°C
DD
I
I
RRM
t
rr
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
435
5.9
27
ns
µC
A
I
=20A, di/dt = 100A/µs,
SD
Q
rr
RRM
V
=100 V, Tj=150°C
DD
(1) ISD ≤20A, di/dt ≤400A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
(2) Pulse width limited by safe operating area
(3) Limited only by maximum temperature allowed
(4) Pulsed: pulse duration = 300µs, duty cycle 1.5%
(5) Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0
to 80% VDSS
4/16
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
2 Electrical characteristics
2.1
Electrical Characteristics (curves)
Figure 1. Safe Operating Area for
TO-220/D²PAK/I²PAK
Figure 2. Thermal Impedance for
TO-220/D²PAK/I²PAK
Figure 3. Safe Operating Area for TO-220FP
Figure 4. Thermal Impedance for TO-220FP
Figure 5. Output Characteristics
Figure 6. Transfer Characteristics
5/16
2 Electrical characteristics
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
Figure 8. Static Drain-Source on Resistance
Figure 7. Transconductance
Figure 9. Gate Charge vs Gate -Source
Voltage
Figure 11. Capacitance Variations
Figure 10. Normalized Gate Threshold Voltage Figure 12. Normalized on Resistance vs
vs Temperatute Temperature
6/16
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
2 Electrical characteristics
Figure 13. Source-drain Diode Forward
Characteristics
7/16
3 Test circuits
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
3
Test circuits
Figure 14. Switching Times Test Circuit For
Resistive Load
Figure 15. Gate Charge Test Circuit
Figure 16. Test Circuit For Indictive Load
Switching and Diode Recovery
Times
Figure 18. Unclamped Inductive Load Test
Circuit
Figure 17. Unclamped Inductive Waveform
8/16
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
4 Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com
9/16
4 Package mechanical data
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
TO-220 MECHANICAL DATA
mm.
TYP
inch
TYP.
DIM.
MIN.
4.40
0.61
1.15
0.49
15.25
10
MAX.
4.60
0.88
1.70
0.70
15.75
10.40
2.70
5.15
1.32
6.60
2.72
14
MIN.
0.173
0.024
0.045
0.019
0.60
MAX.
0.181
0.034
0.066
0.027
0.620
0.409
0.106
0.202
0.052
0.256
0.107
0.551
0.154
A
b
b1
c
D
E
0.393
0.094
0.194
0.048
0.244
0.094
0.511
0.137
e
2.40
4.95
1.23
6.20
2.40
13
e1
F
H1
J1
L
L1
L20
L30
øP
Q
3.50
3.93
16.40
28.90
0.645
1.137
3.75
2.65
3.85
2.95
0.147
0.104
0.151
0.116
10/16
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
4 Package mechanical data
TO-220FP MECHANICAL DATA
mm.
inch
TYP.
DIM.
MIN.
4.4
TYP
MAX.
4.6
2.7
2.75
0.7
1
MIN.
0.173
0.098
0.098
0.017
0.030
0.045
0.045
0.195
0.094
0.393
MAX.
0.181
0.106
0.108
0.027
0.039
0.067
0.067
0.204
0.106
0.409
A
B
2.5
D
2.5
E
0.45
0.75
1.15
1.15
4.95
2.4
F
F1
F2
G
1.7
1.7
5.2
2.7
10.4
G1
H
10
L2
L3
L4
L5
L6
L7
Ø
16
0.630
28.6
9.8
2.9
15.9
9
30.6
10.6
3.6
1.126
.0385
0.114
0.626
0.354
0.118
1.204
0.417
0.141
0.645
0.366
0.126
16.4
9.3
3
3.2
L3
L6
L7
1
2 3
L5
L2
L4
11/16
4 Package mechanical data
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
2
TO-262 (I PAK) MECHANICAL DATA
mm.
TYP
inch
TYP.
DIM.
MIN.
4.40
2.40
0.61
1.14
0.49
1.23
8.95
2.40
4.95
10
MAX.
4.60
2.72
0.88
1.70
0.70
1.32
9.35
2.70
5.15
10.40
14
MIN.
0.173
0.094
0.024
0.044
0.019
0.048
0.352
0.094
0.194
0.393
0.511
0.137
0.050
MAX.
0.181
0.107
0.034
0.066
0.027
0.052
0.368
0.106
0.202
0.410
0.551
0.154
0.055
A
A1
b
b1
c
c2
D
e
e1
E
L
13
L1
L2
3.50
1.27
3.93
1.40
12/16
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
4 Package mechanical data
D2PAK MECHANICAL DATA
mm.
inch
TYP.
DIM.
MIN.
4.4
TYP
MAX.
4.6
MIN.
0.173
0.098
0.001
0.027
0.044
0.017
0.048
0.352
MAX.
0.181
0.106
0.009
0.036
0.067
0.023
0.053
0.368
A
A1
A2
B
2.49
0.03
0.7
2.69
0.23
0.93
1.7
B2
C
1.14
0.45
1.23
8.95
0.6
C2
D
1.36
9.35
D1
E
8
0.315
0.334
10
10.4
0.393
E1
G
8.5
4.88
15
5.28
15.85
1.4
0.192
0.590
0.050
0.055
0.094
0.208
0.625
0.055
0.068
0.126
L
L2
L3
M
1.27
1.4
1.75
3.2
2.4
R
0.4
0.015
V2
0º
4º
3
1
13/16
5 Packing mechanical data
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
5
Packing mechanical data
2
D PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
mm
MIN. MAX. MIN. MAX.
330 12.992
inch
DIM.
A
B
C
D
G
N
T
1.5
12.8
20.2
24.4
100
0.059
13.2 0.504 0.520
0795
26.4 0.960 1.039
3.937
30.4
1.197
BASE QTY
BULK QTY
1000
TAPE MECHANICAL DATA
1000
mm
inch
DIM.
MIN. MAX. MIN. MAX.
10.5 10.7 0.413 0.421
15.7 15.9 0.618 0.626
A0
B0
D
1.5
1.6 0.059 0.063
D1
E
1.59 1.61 0.062 0.063
1.65 1.85 0.065 0.073
F
11.4
4.8
3.9
11.9
1.9
50
11.6 0.449 0.456
5.0 0.189 0.197
4.1 0.153 0.161
12.1 0.468 0.476
2.1 0.075 0.082
1.574
K0
P0
P1
P2
R
T
0.25 0.35 0.0098 0.0137
23.7 24.3 0.933 0.956
W
* on sales type
14/16
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
6 Revision History
6
Revision History
Date
Revision
Changes
05-Sep-2005
2
Inserted Ecopack indication
15/16
6 Revision History
STB20NM50-1 - STB20NM50 - STP20NM50 - STP20NM50FP
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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© 2005 STMicroelectronics - All rights reserved
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16/16
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