SSG4462N [SECOS]

N-Ch Enhancement Mode Power MOSFET; N沟道增强型功率MOSFET
SSG4462N
型号: SSG4462N
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

N-Ch Enhancement Mode Power MOSFET
N沟道增强型功率MOSFET

文件: 总2页 (文件大小:142K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSG4462N  
9.7 A, 60 V, RDS(ON) 22 m  
N-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen & lead-free  
DESCRIPTION  
These miniature surface mount MOSFETs  
SOP-8  
utilize a high cell density trench process to  
provide low RDS(on) and to ensure minimal  
power loss and heat dissipation. Typical  
applications are DC-DC converters and power  
management in portable and battery-powered  
products such as computers, printers, PCMCIA  
cards, cellular and cordless telephones.  
B
L
D
M
FEATURES  
A
C
J
Low RDS(on) provides higher efficiency and extends battery life.  
Low thermal impedance copper leadframe SOP-8 saves board space.  
Fast switching speed.  
N
E
K
H
G
F
High performance trench technology.  
Millimeter  
Min. Max.  
Millimeter  
REF.  
REF.  
PACKAGE INFORMATION  
Min.  
Max.  
A
B
C
D
E
F
5.80  
4.80  
3.80  
0°  
6.20  
5.00  
4.00  
8°  
H
J
K
L
M
N
0.35  
0.49  
0.375 REF.  
Package  
MPQ  
LeaderSize  
45°  
1.35  
0.10  
1.75  
0.25  
0.40  
0.19  
0.90  
0.25  
SOP-8  
2.5K  
13’ inch  
0.25 REF.  
G
1.27 TYP.  
S
S
S
G
D
D
D
D
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)  
Parameter  
Drain-Source Voltage  
Symbol  
Ratings  
Unit  
V
VDS  
VGS  
ID  
60  
±20  
9.7  
Gate-Source Voltage  
V
TA = 25°C  
Continuous Drain Current 1  
A
TA = 70°C  
ID  
8.0  
25  
A
Pulsed Drain Current 2  
Continuous Source Current (Diode Conduction) 1  
IDM  
A
IS  
2
A
TA = 25°C  
Total Power Dissipation 1  
PD  
3.1  
W
W
°C  
TA = 70°C  
PD  
2
Operating Junction & Storage Temperature Range  
TJ, TSTG  
-55 ~ 150  
THERMAL RESISTANCE RATINGS  
t 10 sec  
RθJA  
40  
80  
°C / W  
°C / W  
Maximum Junction to Ambient a  
Notes:  
Steady State  
1
Surface Mounted on 1” x 1” FR4 Board.  
Pulse width limited by maximum junction temperature.  
2
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
06-Jan-2011 Rev. A  
Page 1 of 2  
SSG4462N  
9.7 A, 60 V, RDS(ON) 22 m  
N-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test conditions  
Static  
Gate-Threshold Voltage  
Gate-Body Leakage  
VGS(th)  
IGSS  
1
-
-
-
-
±100  
1
V
VDS= VGS, ID= 250μA  
VDS= 0V, VGS= 20V  
DS= 60V, VGS= 0V  
nA  
μA  
μA  
A
-
-
V
Zero Gate Voltage Drain Current  
On-State Drain Current 1  
IDSS  
ID(on)  
-
-
10  
-
VDS= 60V, VGS= 0V, TJ= 55°C  
VDS= 5V, VGS= 10V  
20  
-
-
-
38  
50  
-
VGS= 10V, ID= 6.7A  
Drain-Source On-Resistance 1  
RDS(ON)  
mΩ  
-
-
VGS= 4.5V, ID= 5.9A  
VDS= 15V, ID= 5.2A  
IS= 2.0A, VGS= 0V  
Forward Transconductance 1  
Diode Forward Voltage  
gfs  
-
11  
0.7  
S
V
VSD  
-
-
Dynamic 2  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Qg  
Qgs  
Qgd  
Td(on)  
Tr  
-
-
-
-
-
-
-
8.5  
3.3  
4.0  
18  
59  
37  
9
-
-
-
-
-
-
-
ID= 6.7A  
VDS= 30V  
nC  
nS  
VGS= 4.5V  
VDD= 30V  
ID= 1A  
VGEN= 10V  
RL= 30Ω  
Turn-Off Delay Time  
Fall Time  
Td(off)  
Tf  
Notes:  
1
2
Pulse testPW 300μs duty cycle 2%.  
Guaranteed by design, not subject to production testing.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
06-Jan-2011 Rev. A  
Page 2 of 2  

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