SSG4492N [SECOS]

N-Ch Enhancement Mode Power MOSFET; N沟道增强型功率MOSFET
SSG4492N
型号: SSG4492N
厂家: SECOS HALBLEITERTECHNOLOGIE GMBH    SECOS HALBLEITERTECHNOLOGIE GMBH
描述:

N-Ch Enhancement Mode Power MOSFET
N沟道增强型功率MOSFET

文件: 总2页 (文件大小:148K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSG4492N  
9A, 100V, RDS(ON) 26m  
N-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen & lead-free  
SOP-8  
DESCRIPTION  
These miniature surface mount MOSFETs  
B
utilize a high cell density trench process to provide  
low RDS(on) and to ensure minimal power loss and  
heat dissipation.  
L
D
M
FEATURES  
Low RDS(on) provides higher efficiency and  
extends battery life.  
Low thermal impedance copper lead frame  
SOP-8 saves board space.  
A
C
J
N
E
K
H
G
F
Fast switching speed.  
High performance trench technology.  
Millimeter  
Min. Max.  
Millimeter  
REF.  
REF.  
Min.  
Max.  
A
B
C
D
E
F
5.80  
4.80  
3.80  
0°  
0.40  
0.19  
6.20  
5.00  
4.00  
8°  
0.90  
0.25  
H
J
K
L
M
N
0.35  
0.375 REF.  
0.49  
APPLICATION  
45°  
DC-DC converters and power management  
1.35  
0.10  
0.25 REF.  
1.75  
0.25  
in portable and battery-powered products such  
as computers, printers, PCMCIA cards, cellular  
and cordless telephones.  
G
1.27 TYP.  
PACKAGE INFORMATION  
S
S
S
G
D
D
D
D
Package  
MPQ  
LeaderSize  
SOP-8  
2.5K  
13’ inch  
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)  
Parameter Symbol  
Ratings  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
100  
±20  
9
V
V
A
TA = 25°C  
TA = 70°C  
Continuous Drain Current 1  
Pulsed Drain Current 2  
ID  
7.3  
A
IDM  
IS  
50  
A
Continuous Source Current (Diode Conduction) 1  
TA = 25°C  
TA = 70°C  
Operating Junction & Storage Temperature Range  
2.3  
A
3.1  
W
W
°C  
Total Power Dissipation 1  
PD  
2.2  
TJ, TSTG  
-55 ~ 150  
Thermal Resistance Ratings  
Maximum Junction to Case 1  
Maximum Junction to Ambient 1  
t 5 sec  
t 5 sec  
RθJC  
RθJA  
25  
50  
°C / W  
°C / W  
Notes:  
1
2
Surface Mounted on 1” x 1” FR4 Board.  
Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
16-Feb-2011 Rev. A  
Page 1 of 2  
SSG4492N  
9A, 100V, RDS(ON) 26m  
N-Ch Enhancement Mode Power MOSFET  
Elektronische Bauelemente  
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)  
Parameter  
Symbol  
Min.  
Typ.  
Static  
Max.  
Unit  
Test conditions  
Gate-Threshold Voltage  
Gate-Body Leakage  
VGS(th)  
IGSS  
1
-
-
-
±100  
1
V
VDS=VGS, ID=250μA  
VDS=0, VGS=20V  
DS=80V, VGS=0  
-
-
nA  
-
V
Zero Gate Voltage Drain Current  
On-State Drain Current 1  
IDSS  
ID(on)  
μA  
A
-
-
25  
-
VDS=80V, VGS=0, TJ= 55°C  
VDS=5V, VGS=10V  
20  
-
-
-
26  
36  
-
VGS=10V, ID=2A  
Drain-Source On-Resistance 1  
RDS(ON)  
mΩ  
-
-
VGS=4.5V, ID=2A  
VDS=15V, ID=2A  
IS=2A, VGS=0  
Forward Transconductance 1  
Diode Forward Voltage  
gfs  
-
40  
S
V
VSD  
-
0.7  
-
Dynamic 2  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Qg  
Qgs  
Qgd  
-
-
-
12.5  
-
-
-
ID=2A  
VDS=15V  
2.6  
nC  
nS  
VGS=4.5V  
4.6  
Switching  
Turn-On Delay Time  
Rise Time  
Td(on)  
Tr  
-
-
-
-
20  
9
-
-
-
-
VDD=25  
ID=1A  
VGEN=10V  
Turn-Off Delay Time  
Td(off)  
Tf  
70  
20  
RL=25Ω  
Fall Time  
Notes:  
1
2
Pulse testPW 300μs duty cycle 2%.  
Guaranteed by design, not subject to production testing.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
16-Feb-2011 Rev. A  
Page 2 of 2  

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