APTGT150A170G [MICROSEMI]

Phase leg Trench + Field Stop IGBT Power Module; 相脚沟道+场截止IGBT功率模块
APTGT150A170G
型号: APTGT150A170G
厂家: Microsemi    Microsemi
描述:

Phase leg Trench + Field Stop IGBT Power Module
相脚沟道+场截止IGBT功率模块

晶体 晶体管 功率控制 双极性晶体管 局域网
文件: 总5页 (文件大小:246K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APTGT150A170G  
Phase leg  
Trench + Field Stop IGBT®  
Power Module  
VCES = 1700V  
IC = 150A @ Tc = 80°C  
Application  
VBUS  
Welding converters  
Q1  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
G1  
E1  
OUT  
Features  
Trench + Field Stop IGBT® Technology  
Q2  
-
-
-
-
-
-
-
-
Low voltage drop  
G2  
Low tail current  
Switching frequency up to 20 kHz  
Soft recovery parallel diodes  
Low diode VF  
E2  
Low leakage current  
0/VBUS  
Avalanche energy rated  
RBSOA and SCSOA rated  
Kelvin emitter for easy drive  
Very low stray inductance  
-
-
Symmetrical design  
M5 power connectors  
G1  
E1  
High level of integration  
VBUS  
0/VBUS  
OUT  
Benefits  
Stable temperature behavior  
Very rugged  
E2  
G2  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
Low profile  
RoHS Compliant  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
1700  
Unit  
VCES  
Collector - Emitter Breakdown Voltage  
V
TC = 25°C  
TC = 80°C  
TC = 25°C  
250  
150  
300  
±20  
890  
IC  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
V
W
TC = 25°C  
RBSOA Reverse Bias Safe Operating Area  
Tj = 125°C 300A @ 1600V  
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 - 5  
www.microsemi.com  
APTGT150A170G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
ICES  
Zero Gate Voltage Collector Current  
VGE = 0V, VCE = 1700V  
350  
2.4  
µA  
Tj = 25°C  
Tj = 125°C  
2.0  
2.4  
5.8  
VGE = 15V  
VCE(sat) Collector Emitter Saturation Voltage  
V
IC = 150A  
VGE(th) Gate Threshold Voltage  
IGES  
VGE = VCE , IC = 3mA  
VGE = 20V, VCE = 0V  
5.0  
6.5  
600  
V
nA  
Gate – Emitter Leakage Current  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Input Capacitance  
VGE = 0V  
VCE = 25V  
f = 1MHz  
13.5  
nF  
Output Capacitance  
0.55  
0.44  
370  
40  
650  
180  
400  
50  
Reverse Transfer Capacitance  
Inductive Switching (25°C)  
VGE = 15V  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
Tf Fall Time  
Td(on) Turn-on Delay Time  
Tr Rise Time  
Td(off) Turn-off Delay Time  
ns  
VBus = 900V  
IC = 150A  
RG = 4.7  
Inductive Switching (125°C)  
VGE = 15V  
ns  
VBus = 900V  
800  
IC = 150A  
Tf  
Fall Time  
300  
RG = 4.7Ω  
VGE = 15V  
Tj = 125°C  
VBus = 900V  
Eon  
Turn-on Switching Energy  
48  
47  
mJ  
IC = 150A  
Tj = 125°C  
RG = 4.7Ω  
Eoff  
Turn-off Switching Energy  
Diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
VRRM  
Maximum Peak Repetitive Reverse Voltage  
1700  
V
Tj = 25°C  
VR=1700V  
350  
600  
IRM  
Maximum Reverse Leakage Current  
µA  
Tj = 125°C  
IF  
DC Forward Current  
Tc = 80°C  
150  
1.8  
1.9  
385  
490  
38  
62  
17.5  
35  
A
V
Tj = 25°C  
2.2  
VF  
Diode Forward Voltage  
IF = 150A  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
trr  
Reverse Recovery Time  
ns  
IF = 150A  
Tj = 25°C  
VR = 900V  
Qrr  
Er  
Reverse Recovery Charge  
Reverse Recovery Energy  
µC  
mJ  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
di/dt =1600A/µs  
2 - 5  
www.microsemi.com  
APTGT150A170G  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.14  
0.26  
RthJC  
Junction to Case Thermal Resistance  
°C/W  
V
VISOL  
TJ  
TSTG  
TC  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
3500  
-40  
-40  
-40  
3
150  
125  
100  
5
3.5  
280  
°C  
Operating Case Temperature  
To heatsink  
For terminals  
M6  
M5  
Torque Mounting torque  
N.m  
g
2
Wt  
Package Weight  
SP6 Package outline (dimensions in mm)  
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com  
3 - 5  
www.microsemi.com  
APTGT150A170G  
Typical Performance Curve  
Output Characteristics (VGE=15V)  
Output Characteristics  
300  
250  
200  
150  
100  
50  
300  
250  
200  
150  
100  
50  
TJ = 125°C  
VGE=20V  
TJ=25°C  
VGE=13V  
VGE=15V  
TJ=125°C  
VGE=9V  
0
0
0
1
2
3
4
0
1
2
3
4
5
VCE (V)  
V
CE (V)  
Energy losses vs Collector Current  
Transfert Characteristics  
120  
100  
80  
60  
40  
20  
0
300  
250  
200  
150  
100  
50  
VCE = 900V  
VGE = 15V  
Eon  
TJ=25°C  
RG = 4.7  
TJ = 125°C  
Eoff  
Er  
TJ=125°C  
TJ=125°C  
0
0
50  
100 150 200 250 300  
C (A)  
5
6
7
8
9
10 11 12 13  
I
V
GE (V)  
Switching Energy Losses vs Gate Resistance  
120  
Reverse Bias Safe Operating Area  
350  
300  
250  
200  
150  
100  
50  
VCE = 900V  
VGE =15V  
100  
Eon  
IC = 150A  
80  
60  
40  
20  
0
TJ = 125°C  
Eoff  
Er  
VGE=15V  
TJ=125°C  
RG=4.7Ω  
0
0
400  
800  
1200  
CE (V)  
1600  
2000  
0
5
10  
15  
20  
25  
30  
V
Gate Resistance (ohms)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.16  
0.14  
0.12  
0.1  
IGBT  
0.9  
0.7  
0.08  
0.06  
0.04  
0.02  
0
0.5  
0.3  
0.1  
0.05  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
4 - 5  
www.microsemi.com  
APTGT150A170G  
Forward Characteristic of diode  
TJ=25°C  
Operating Frequency vs Collector Current  
20  
15  
10  
5
300  
250  
200  
150  
100  
50  
VCE=900V  
D=50%  
RG=4.7  
TJ=125°C  
TC=75°C  
ZVS  
ZCS  
TJ=125°C  
TJ=125°C  
hard  
switching  
0
0
0
0.5  
1
1.5  
F (V)  
2
2.5  
3
0
40  
80  
120 160 200  
C (A)  
240  
V
I
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.3  
Diode  
0.25  
0.2  
0.9  
0.7  
0.15  
0.1  
0.5  
0.3  
0.05  
0
0.1  
0.05  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
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