APTGT150A60T3AG [MICROSEMI]

Phase leg Trench + Field Stop IGBT Power Module; 相脚沟道+场截止IGBT功率模块
APTGT150A60T3AG
型号: APTGT150A60T3AG
厂家: Microsemi    Microsemi
描述:

Phase leg Trench + Field Stop IGBT Power Module
相脚沟道+场截止IGBT功率模块

晶体 晶体管 功率控制 双极性晶体管 栅 局域网
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中文:  中文翻译
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APTGT150A60T3AG  
Phase leg  
Trench + Field Stop IGBT  
Power Module  
VCES = 600V  
IC = 150A @ Tc = 100°C  
Application  
29 30 31 32  
13  
Welding converters  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
4
3
Features  
Trench + Field Stop IGBT Technology  
26 27 28  
22 23 25  
R1  
-
-
-
-
-
-
-
Low voltage drop  
Low tail current  
Switching frequency up to 20 kHz  
Soft recovery parallel diodes  
Low diode VF  
8
7
Low leakage current  
RBSOA and SCSOA rated  
Very low stray inductance  
Kelvin emitter for easy drive  
Internal thermistor for temperature monitoring  
High level of integration  
AlN substrate for improved thermal performance  
16 18 19 20  
14  
28 27 26 25  
23 22  
20 19 18  
29  
30  
16  
15  
Benefits  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
31  
32  
14  
13  
Low profile  
Easy paralleling due to positive TC of VCEsat  
RoHS Compliant  
2
3
4
7
8
10 11  
12  
Pins 29/30/31/32 must be shorted together  
Pins 26/27/28/22/23/25 must be shorted together  
to achieve a phase leg  
Pins 16/18/19/20 must be shorted together  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
600  
Unit  
V
VCES  
Collector - Emitter Breakdown Voltage  
TC = 25°C  
TC = 100°C  
TC = 25°C  
225  
150  
300  
±20  
IC  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Maximum Power Dissipation  
V
W
TC = 25°C  
Tj = 150°C  
600  
RBSOA Reverse Bias Safe Operating Area  
300A @ 550V  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 – 5  
www.microsemi.com  
APTGT150A60T3AG  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
ICES  
Zero Gate Voltage Collector Current  
VGE = 0V, VCE = 600V  
250  
1.9  
µA  
Tj = 25°C  
1.5  
1.7  
5.8  
V
GE =15V  
VCE(sat) Collector Emitter Saturation Voltage  
VGE(th) Gate Threshold Voltage  
V
IC = 150A  
Tj = 150°C  
VGE = VCE , IC = 1.5 mA  
VGE = 20V, VCE = 0V  
5.0  
6.5  
400  
V
nA  
IGES  
Gate – Emitter Leakage Current  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Cies  
Coes  
Cres  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
VGE = 0V  
9200  
580  
270  
V
CE = 25V  
pF  
f = 1MHz  
VGE= ±15V ; VCE=300V  
IC=150A  
QG  
Gate charge  
1.6  
µC  
Inductive Switching (25°C)  
Td(on)  
Tr  
Turn-on Delay Time  
Rise Time  
115  
45  
V
V
GE = ±15V  
Bus = 300V  
ns  
ns  
Td(off) Turn-off Delay Time  
225  
IC = 150A  
RG = 3.3Ω  
Inductive Switching (150°C)  
Tf  
Td(on)  
Tr  
Fall Time  
55  
130  
50  
Turn-on Delay Time  
Rise Time  
V
GE = ±15V  
VBus = 300V  
IC = 150A  
RG = 3.3Ω  
Td(off) Turn-off Delay Time  
300  
Tf  
Fall Time  
70  
0.85  
1.5  
Tj = 25°C  
Tj = 150°C  
Tj = 25°C  
Tj = 150°C  
V
V
GE = ±15V  
Bus = 300V  
Eon  
Turn on Energy  
mJ  
mJ  
A
IC = 150A  
RG = 3.3Ω  
4.1  
Eoff  
Isc  
Turn off Energy  
Short Circuit data  
5.3  
V
GE 15V ; VBus = 360V  
750  
tp 6µs ; Tj = 150°C  
Reverse diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
VRRM  
IRM  
IF  
600  
V
µA  
A
Tj = 25°C  
150  
400  
VR = 600V  
Tj = 150°C  
Tc = 100°C  
Tj = 25°C  
Tj = 150°C  
150  
1.6  
1.5  
IF = 150A  
VGE = 0V  
2
VF  
Diode Forward Voltage  
V
Tj = 25°C  
Tj = 150°C  
Tj = 25°C  
Tj = 150°C  
Tj = 25°C  
Tj = 150°C  
100  
trr  
Qrr  
Er  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Energy  
ns  
µC  
mJ  
150  
7.2  
IF = 150A  
VR = 300V  
di/dt =2800A/µs  
15.2  
1.7  
3.6  
2 – 5  
www.microsemi.com  
APTGT150A60T3AG  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
IGBT  
Diode  
0.25  
0.42  
°C/W  
V
RthJC  
Junction to Case Thermal Resistance  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
TJ  
TSTG  
TC  
2500  
-40  
-40  
-40  
2.5  
175  
125  
100  
4.7  
°C  
Operating Case Temperature  
Torque Mounting torque  
Wt Package Weight  
To heatsink  
M4  
N.m  
g
110  
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).  
Symbol  
R25  
R25/R25  
B25/85  
Characteristic  
Resistance @ 25°C  
Min Typ Max Unit  
50  
5
3952  
4
kΩ  
%
K
T25 = 298.15 K  
%
B/B  
TC=100°C  
R25  
T: Thermistor temperature  
RT: Thermistor value at T  
RT  
=
1
1
exp B  
25/ 85  
T25  
T
SP3 Package outline (dimensions in mm)  
2 8  
1 7  
1
12  
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com  
3 – 5  
www.microsemi.com  
APTGT150A60T3AG  
Typical Performance Curve  
Output Characteristics (VGE=15V)  
TJ=25°C  
TJ=125°C  
Output Characteristics  
300  
300  
250  
200  
150  
100  
50  
VGE=19V  
TJ = 150°C  
250  
VGE=13V  
VGE=15V  
200  
150  
TJ=150°C  
100  
VGE=9V  
50  
0
TJ=25°C  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
0
0.5  
1
1.5  
2
2.5  
3
VCE (V)  
VCE (V)  
Energy losses vs Collector Current  
Transfert Characteristics  
300  
250  
200  
150  
100  
50  
10  
8
VCE = 300V  
Eoff  
TJ=25°C  
VGE = 15V  
RG = 3.3  
TJ = 150°C  
6
Er  
4
TJ=125°C  
Eon  
TJ=150°C  
2
TJ=25°C  
0
0
0
50  
100  
150  
200  
250  
300  
5
6
7
8
9
10  
11  
12  
I
C (A)  
VGE (V)  
Switching Energy Losses vs Gate Resistance  
Reverse Bias Safe Operating Area  
12  
350  
300  
250  
200  
150  
100  
50  
VCE = 300V  
Eon  
VGE =15V  
10  
IC = 150A  
Eoff  
Eoff  
TJ = 150°C  
8
6
4
2
0
VGE=15V  
TJ=150°C  
RG=3.3Ω  
Er  
Eon  
0
0
5
10  
15  
20  
25  
0
100 200 300 400 500 600 700  
CE (V)  
V
Gate Resistance (ohms)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.3  
IGBT  
0.25  
0.2  
0.15  
0.1  
0.05  
0
0.9  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.01  
0.05  
0.00001  
0.0001  
0.001  
0.1  
1
10  
Rectangular Pulse Duration in Seconds  
4 – 5  
www.microsemi.com  
APTGT150A60T3AG  
Operating Frequency vs Collector Current  
Forward Characteristic of diode  
300  
120  
100  
80  
60  
40  
20  
0
VCE=300V  
ZVS  
D=50%  
RG=3.3  
250  
200  
ZCS  
TJ=150°C  
Tc=85°C  
150  
TJ=125°C  
100  
TJ=150°C  
Hard  
switching  
50  
TJ=25°C  
1.6  
0
0
0.4  
0.8  
1.2  
2
2.4  
0
50  
100  
150  
200  
250  
VF (V)  
IC (A)  
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.5  
0.4  
0.3  
0.2  
0.1  
0
Diode  
0.9  
0.7  
0.5  
0.3  
0.1  
Single Pulse  
0.01  
0.05  
0.00001  
0.0001  
0.001  
0.1  
1
10  
Rectangular Pulse Duration in Seconds  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103  
5,283,202 5,231,474 5,434,095 5,528,058 6,939,743 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262  
and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
5 – 5  
www.microsemi.com  

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