TC1266_13 [MICROCHIP]

200mA PCI LDO; 200毫安PCI LDO
TC1266_13
型号: TC1266_13
厂家: MICROCHIP    MICROCHIP
描述:

200mA PCI LDO
200毫安PCI LDO

PC
文件: 总18页 (文件大小:302K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TC1266  
200mA PCI LDO  
Features  
General Description  
• Glitch Free Transition Between Input Sources  
• Automatic Input Source Selection  
• External PMOS Bypass Switch Control  
• Built-in 5V Detector  
The TC1266 is an application-specific, low dropout  
regulator (LDO), specifically intended for use in PCI  
peripheral card applications complying with PCI Power  
Management (PCI 2.0). It provides an uninterrupted,  
3.3V, 200mA (max) output voltage when the main (5V)  
or auxiliary (3.3V) input voltage supplies are present.  
• 1% Regulated Output Voltage Accuracy  
• 200mA Load Current Capability  
• Kelvin Sense Input  
The TC1266 consists of an LDO, a voltage threshold  
detector, external switchover logic and gate drive  
circuitry. It functions as a conventional LDO as long as  
the voltage on the main supply input (VIN) is above the  
lower threshold (3.90V typical). Should the voltage on  
VIN fall below the lower threshold, the LDO is disabled  
and an external P-channel MOSFET is automatically  
turned on, connecting the auxiliary supply input to  
VOUT, and ensuring an uninterrupted 3.3V output. The  
main supply is automatically selected, if both the main  
and auxiliary input supplies are present, and transition  
from one input supply to the other is ensured glitch-  
free. High integration, automatic secondary supply swi-  
tchover, Kelvin sensing, and small size make the  
TC1266 the optimum LDO for PCI 2.0 applications.  
• Low Dropout Voltage (240mV @ Full Load)  
• Low Ground Current, Independent of Load  
Applications  
• PCMCIA  
• PCI  
• Network Interface Cards (NICs)  
• CardbusTM Technology  
Device Selection Table  
Junction  
Temp. Range  
Part Number  
Package  
Functional Block Diagram  
TC1266VOA 8-Pin SOIC (Narrow) -5°C to +125°C  
TC1266VUA  
8-Pin MSOP  
-5°C to +125°C  
V
IN  
D
V
Package Type  
Detect  
R
AUX  
8-Pin SOIC  
Bandgap  
Reference  
1
2
3
4
8
7
6
5
V
D
V
IN  
R
E/A  
NC  
OUT  
V
+
OUT  
TC1266  
SENSE  
V
GND  
SENSE  
AUX  
NC  
GND  
8-Pin MSOP  
TC1266  
V
D
V
IN  
8
7
6
5
1
2
3
4
R
NC  
OUT  
SENSE  
NC  
V
AUX  
GND  
2001-2012 Microchip Technology Inc.  
DS21377C-page 1  
TC1266  
*Stresses above those listed under "Absolute Maximum  
Ratings" may cause permanent damage to the device. These  
are stress ratings only and functional operation of the device  
at these or any other conditions above those indicated in the  
operation sections of the specifications is not implied.  
Exposure to Absolute Maximum Rating conditions for  
extended periods may affect device reliability.  
1.0  
ELECTRICAL  
CHARACTERISTICS  
Absolute Maximum Ratings*  
Input Supply Voltage (VIN)..............-0.5V to +7V (Max)  
Auxiliary Supply Voltage (VAUX) .....-0.5V to +7V (Max)  
LDO Output Current (IOUT)................................200mA  
Thermal Impedance,  
Junction-to-Ambient (JA)............130°C/W for SOIC  
ESD Rating .......................................................... 2 KV  
Operating Temperature Range (TA)........-5°C to +70°C  
Storage Temperature Range (TSTG)...-65°C to +150°C  
TC1266 ELECTRICAL SPECIFICATIONS  
Electrical Characteristics: T = +25°C, V = 5V, V  
= 3.3V, I  
= 0.1mA, C  
= 4.7F, unless otherwise noted. Boldface  
OUT  
A
IN  
AUX  
OUT  
type specifications apply over full operating temperature range.  
Symbol  
Parameter  
Supply Voltage  
Min  
4.3  
Typ  
5.0  
Max  
5.5  
Units  
Test Conditions  
V
I
V
V
= 0V  
IN  
AUX  
Ground Current  
230  
260  
450  
500  
A  
V
= 0V (Note 6)  
= 3.3V (Note 6)  
GND  
AUX  
V
AUX  
I
Reverse Leakage from V  
Supply Voltage  
-0.1  
-1.0  
3.6  
A  
V
V
= 3.6V, V = 0V, I  
= 0mA  
= 0mA  
VIN  
AUX  
AUX  
IN  
OUT  
V
3.0  
3.3  
AUX  
I
Quiescent Current  
50  
70  
100  
A  
V
V
= 0V, I  
= 0mA  
= 0mA  
Q(AUX)  
IN  
OUT  
60  
80  
120  
A  
= 5V, I  
IN  
OUT  
I
Reverse Leakage from V  
-0.1  
-1.0  
A  
V
V
= 5,5V, V  
= 0V, I  
VAUX  
IN  
IN  
AUX OUT  
V
V
V
5V Detector  
Low Threshold Voltage  
3.75  
3.90  
4.05  
V
Falling (Notes 2, 3)  
TH(LO)  
IN  
5V Detector  
Hysteresis Voltage  
200  
260  
300  
mV  
V
(Notes 2, 3)  
HYST  
5V Detector  
High Threshold Voltage  
4.0  
4.15  
4.30  
V
Rising (Notes 2, 3)  
TH(HI)  
IN  
V
LDO Output Voltage  
3.300  
3.366  
V
I
= 20mA  
OUT  
OUT  
3.234  
3.000  
4.3V V 5.5V, 0mA I  
200mA  
OUT  
IN  
3.75V V V,  
IN  
0mA I  
200mA (Note 4)  
OUT  
I
Output Current  
Line Regulation  
200  
mA  
%
OUT  
REG  
-0.5  
0.05  
0.5  
V
= 4.3V to 5.5V  
(LINE)  
IN  
REG  
Load Regulation  
-0.5  
0.05  
0.5  
%
I
= 0.1mA to 200mA  
OUT  
(LOAD)  
Note 1: Ensured by design.  
2: See 5V Detect Thresholds, Figure 4-1.  
3: Recommended source impedance for 5V supply: 0.25. This will ensure that IOUT x RSOURCE < VHYST, thus avoiding DR toggling during  
5V detect threshold transitions.  
4: In Application Circuit, Figure 3-1.  
5: See Timing Diagram, Figure 4-2.  
6: Ground Current is independent of ILOAD  
.
DS21377C-page 2  
2001-2012 Microchip Technology Inc.  
TC1266  
TC1266 ELECTRICAL SPECIFICATIONS (CONTINUED)  
Electrical Characteristics: T = +25°C, V = 5V, V  
= 3.3V, I  
= 0.1mA, C = 4.7F, unless otherwise noted. Boldface  
OUT  
A
IN  
AUX  
OUT  
type specifications apply over full operating temperature range.  
Symbol Parameter Min Typ  
Drive Voltage - 0.1  
Max  
Units  
Test Conditions  
V
V
- 0.2  
V
V
4.3V V 5.5V, I = 200A  
DR  
IN  
IN  
IN  
DR  
V
- 0.3  
IN  
35  
150  
200  
mV  
mA  
V
< V  
, I = 200A  
TH(LO) DR  
IN  
I
t
t
Peak Drive Current  
7
6
Sinking: V = 3.75V, V = 1V;  
IN DR  
Sourcing: V = 4.3V, V – V = 2V  
DR(PK)  
IN IN DR  
Drive High Delay  
(Notes 1, 5)  
4
8
sec  
sec  
C
= 1.2nF, V ramping up,  
DR IN  
DH  
measured from V = V  
to V = 2V  
IN  
TH(HI) DR  
Drive Low Delay  
(Notes 1, 5)  
0.6  
1.5  
3.0  
C
= 1.2nF, V ramping down,  
DR IN  
DL  
measured from V = V  
to V = 2V  
IN  
TH(LO) DR  
Note 1: Ensured by design.  
2: See 5V Detect Thresholds, Figure 4-1.  
3: Recommended source impedance for 5V supply: 0.25. This will ensure that IOUT x RSOURCE < VHYST, thus avoiding DR toggling during  
5V detect threshold transitions.  
4: In Application Circuit, Figure 3-1.  
5: See Timing Diagram, Figure 4-2.  
6: Ground Current is independent of ILOAD  
.
2001-2012 Microchip Technology Inc.  
DS21377C-page 3  
TC1266  
2.0  
PIN DESCRIPTIONS  
The descriptions of the pins are listed in Table 2-1.  
TABLE 2-1:  
PIN FUNCTION TABLE  
Pin No.  
(8-Pin SOIC)  
(8-Pin MSOP)  
Symbol  
Description  
1
2
3
4
5
6
7
8
V
Main input supply for the TC1266, nominally 5V.  
IN  
NC  
Not connected.  
V
Auxiliary input supply, nominally 3.3V.  
Logic and power ground.  
Not connected.  
AUX  
GND  
NC  
SENSE  
Sense pin for V  
. Connect to V  
at the load to minimize voltage drop across PCB traces.  
OUT  
OUT  
V
LDO 3.3V output.  
Driver output for external P-channel MOSFET pass element.  
OUT  
D
R
3.0  
DETAILED DESCRIPTION  
FIGURE 3-1:  
APPLICATION CIRCUIT  
Q1  
U1  
1
8
D
V
5V  
R
IN  
2
7
6
NC  
V
OUT  
3.3V  
TC1266  
3
4
V
SENSE  
AUX  
3.3V  
C4  
4.7μF  
C5  
0.1μF  
C2  
4.7μF  
C3  
5
GND  
NC  
0.1μF  
C1  
0.1μF  
NOTE: External switch (Q1): use Motorola MGSF1P02ELT1 or equivalent  
(PMOS, typical Gate Threshold Voltage = 1V, typical R  
= 0.4Ω at VGS = 2.5V)  
DS(ON)  
DS21377C-page 4  
2001-2012 Microchip Technology Inc.  
TC1266  
Equation 4-1 can be used in conjunction with  
Equation 4-2 to ensure regulator thermal operation is  
within limits. For example:  
4.0  
4.1  
THERMAL CONSIDERATIONS  
Thermal Shutdown  
Given:  
Integrated thermal protection circuitry shuts the  
regulator off when die temperature exceeds 160°C.  
The regulator remains off until the die temperature  
drops to approximately 150°C.  
VINMAX  
= 5V ± 5%  
VOUTMIN = 3.217V  
ILOADMAX = 200mA  
TJMAX  
TAMAX  
JA  
= 125°C  
4.2  
Power Dissipation  
= 70°C  
The amount of power the regulator dissipates is  
primarily a function of input and output voltage, and  
output current. The following equation is used to  
calculate worst case actual power dissipation:  
= 130°C/W (SOIC)  
Find: 1. Actual power dissipation  
2. Maximum allowable dissipation  
Actual power dissipation:  
PD (VINMAX – VOUTMIN)ILOADMAX  
= (5.25V - 3.217V) 200mA  
= 407mW  
EQUATION 4-1:  
PD (VINMAX – VOUTMIN)ILOADMAX  
Where:  
PD = Worst case actual power dissipation  
Maximum allowable power dissipation:  
= Maximum voltage on VIN  
VINMAX  
PDMAX = (TJMAX TAMAX  
)
VOUTMIN = Minimum regulator output voltage  
ILOADMAX = Maximum output (load) current  
JA  
= (125 – 70)  
130  
The  
maximum  
allowable  
power  
dissipation  
(Equation 4-2) is a function of the maximum ambient  
temperature (TAMAX), the maximum allowable die  
temperature (TJMAX) and the thermal resistance from  
junction-to-air (JA).  
= 423mW  
In this example, the TC1266 dissipates a maximum of  
407mW; below the allowable limit of 423mW.  
EQUATION 4-2:  
PDMAX = (TJMAX TAMAX  
)
JA  
Where all terms are previously defined.  
2001-2012 Microchip Technology Inc.  
DS21377C-page 5  
TC1266  
FIGURE 4-1:  
5V DETECT THRESHOLD  
4.4V  
V
HYST  
V
TH(HI)  
V
IN  
V
TH(LO)  
3.65V  
2.0V  
2.0V  
D
R
NOTE: V rise and fall times (10% to 90%) to be 100μsec.  
IN  
FIGURE 4-2:  
TIMING DIAGRAM  
4.4V  
V
IN  
3.65V  
t
DH  
t
DL  
D
R
2.0V  
2.0V  
NOTE: V rise and fall times (10% to 90%) to be 0.1μsec.  
IN  
DS21377C-page 6  
2001-2012 Microchip Technology Inc.  
TC1266  
5.0  
TYPICAL CHARACTERISTICS  
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of  
samples and are provided for informational purposes only. The performance characteristics listed herein are  
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified  
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.  
I
vs. V vs. Junction Temperature  
IN  
I
vs. V vs. Junction Temperature  
IN  
Q
Q
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
0.45  
0.40  
0.35  
0.30  
0.25  
0.20  
0.15  
+125°C  
I
V
= 0.1mA  
O
I
V
= 0.1mA  
= 3.3V  
O
AUX  
= 0V  
AUX  
+125°C  
+25°C  
-5°C  
0.10  
0.05  
0.00  
-5°C  
0.10  
0.05  
+25°C  
0.00  
3
4
5
0
1
2
6
0
1
2
3
4
5
6
V
(V)  
IN  
V
(V)  
IN  
I
0.35  
0.30  
0.25  
(Aux) vs. V  
vs. Junction Temperature  
Q
AUX  
I
(Aux) vs. V  
vs. Junction Temperature  
Q
AUX  
0.35  
0.30  
0.25  
I
= 0mA  
O
I
= 0mA  
O
V
= 0V  
AUX  
V
= 5V  
AUX  
-5°C  
0.20  
+125°C  
0.20  
-5°C  
+125°C  
0.15  
0.10  
0.05  
0.00  
0.15  
0.10  
0.05  
0.00  
+25°C  
+25°C  
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7  
(V)  
3
3.3 3.6  
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7  
(V)  
3
3.3 3.6  
V
AUX  
V
AUX  
LDO Output Voltage vs. Junction Temperature  
3.34  
I
V
= 200mA  
O
3.33  
= 5V  
IN  
3.32  
3.31  
3.30  
3.29  
3.28  
3.27  
3.26  
-50  
-25  
0
25  
50  
75  
100  
125  
JUNCTION TEMPERATURE °C  
2001-2012 Microchip Technology Inc.  
DS21377C-page 7  
TC1266  
5.0  
TYPICAL CHARACTERISTICS (CONTINUED)  
Drive High Delay  
Drive Low Delay  
V
steps from 0.8V to 5V  
IN  
See application circuit on Page 5  
= 200mA  
I
LOAD  
Trace 1: VIN stepping for 0.8V to 5V  
Trace 1: VIN stepping for 5.5V to 0V  
Trace 2: DR  
TDH = < 4 S  
TH(HI)  
R
TDL = < 600nS  
V
O
(min) with V Rising  
IN  
V
O
(min) with V Falling  
IN  
Notice no voltage spikes during transition  
from V to LDO output  
AUX  
V
voltage difference is I  
OUT  
x R  
and variations  
OUT  
between V  
DS(ON)  
supply and LDO output voltage  
V
voltage difference is I  
x R  
+ voltage  
DS(ON)  
OUT  
difference from LDO to V  
OUT  
supply  
AUX  
AUX  
Trace 1: VIN – 3A charging a 1500µF capacitor  
Trace 2: DR going high at VTH(HI)  
Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.24V  
Trace 1: VIN – discharging a 1500µF capacitor  
Trace 2: DR going low at VTH(LO)  
Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.14V  
ILOAD = 200µA  
ILOAD = 200µA  
DS21377C-page 8  
2001-2012 Microchip Technology Inc.  
TC1266  
5.0  
TYPICAL CHARACTERISTICS (CONTINUED)  
Load Response Falling Edge  
Load Response Rising Edge  
I
= 200mA  
LOAD  
I
= 200mA  
LOAD  
I
= 3mA  
LOAD  
I
= 3mA  
LOAD  
V
AC 60mV/div  
OUT  
See application circuit on Page5  
See application circuit on Page 5  
2001-2012 Microchip Technology Inc.  
DS21377C-page 9  
TC1266  
6.0  
6.1  
PACKAGING INFORMATION  
Package Marking Information  
Package marking data not available at this time.  
6.2  
Taping Form  
Component Taping Orientation for 8-Pin MSOP Devices  
User Direction of Feed  
PIN 1  
W
P
Standard Reel Component Orientation  
for TR Suffix Device  
Carrier Tape, Number of Components Per Reel and Reel Size  
Package  
Carrier Width (W)  
Pitch (P)  
Part Per Full Reel  
Reel Size  
8-Pin MSOP  
12 mm  
8 mm  
2500  
13 in  
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices  
User Direction of Feed  
PIN 1  
W
P
Standard Reel Component Orientation  
for TR Suffix Device  
Carrier Tape, Number of Components Per Reel and Reel Size  
Package  
Carrier Width (W)  
Pitch (P)  
Part Per Full Reel  
Reel Size  
8-Pin SOIC (N)  
12 mm  
8 mm  
2500  
13 in  
DS21377C-page 10  
2001-2012 Microchip Technology Inc.  
TC1266  
6.3  
Package Dimensions  
Note: For the most current package drawings, please see the Microchip Packaging Specification located  
at http://www.microchip.com/packaging  
8-Pin MSOP  
PIN 1  
.197 (5.00)  
.189 (4.80)  
.122 (3.10)  
.114 (2.90)  
.026 (0.65) TYP.  
.122 (3.10)  
.114 (2.90)  
.043 (1.10)  
MAX.  
.008 (0.20)  
.005 (0.13)  
6° MAX.  
.016 (0.40)  
.010 (0.25)  
.006 (0.15)  
.002 (0.05)  
.028 (0.70)  
.016 (0.40)  
Dimensions: inches (mm)  
2001-2012 Microchip Technology Inc.  
DS21377C-page 11  
TC1266  
Note: For the most current package drawings, please see the Microchip Packaging Specification located  
at http://www.microchip.com/packaging  
8-Pin SOIC  
PIN 1  
.157 (3.99)  
.150 (3.81)  
.244 (6.20)  
.228 (5.79)  
.050 (1.27) TYP.  
.197 (5.00)  
.189 (4.80)  
.069 (1.75)  
.053 (1.35)  
.010 (0.25)  
.007 (0.18)  
8
°
MAX.  
.020 (0.51)  
.013 (0.33)  
.010 (0.25)  
.004 (0.10)  
.050 (1.27)  
.016 (0.40)  
Dimensions: inches (mm)  
DS21377C-page 12  
2001-2012 Microchip Technology Inc.  
TC1266  
7.0  
REVISION HISTORY  
Revision C (November 2012)  
Added a note to each package outline drawing.  
2001-2012 Microchip Technology Inc.  
DS21377C-page 13  
TC1266  
NOTES:  
DS21377C-page 14  
2001-2012 Microchip Technology Inc.  
TC1266  
SALES AND SUPPORT  
Data Sheets  
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-  
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:  
1. Your local Microchip sales office  
2. The Microchip Worldwide Site (www.microchip.com)  
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.  
New Customer Notification System  
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  
2001-2012 Microchip Technology Inc.  
DS21377C-page15  
TC1266  
NOTES:  
DS21377C-page16  
2001-2012 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
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OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
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intellectual property rights.  
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chipKIT, chipKIT logo, CodeGuard, dsPICDEM,  
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,  
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial  
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB  
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code  
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,  
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,  
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA  
and Z-Scale are trademarks of Microchip Technology  
Incorporated in the U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
GestIC and ULPP are registered trademarks of Microchip  
Technology Germany II GmbH & Co. & KG, a subsidiary of  
Microchip Technology Inc., in other countries.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2001-2012, Microchip Technology Incorporated, Printed in  
the U.S.A., All Rights Reserved.  
Printed on recycled paper.  
ISBN: 9781620767801  
QUALITY MANAGEMENT SYSTEM  
CERTIFIED BY DNV  
Microchip received ISO/TS-16949:2009 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
== ISO/TS 16949 ==  
2001-2012 Microchip Technology Inc.  
DS21377C-page 17  
Worldwide Sales and Service  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://www.microchip.com/  
support  
Asia Pacific Office  
Suites 3707-14, 37th Floor  
Tower 6, The Gateway  
Harbour City, Kowloon  
Hong Kong  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
India - Bangalore  
Tel: 91-80-3090-4444  
Fax: 91-80-3090-4123  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
India - New Delhi  
Tel: 91-11-4160-8631  
Fax: 91-11-4160-8632  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
India - Pune  
Tel: 91-20-2566-1512  
Fax: 91-20-2566-1513  
Australia - Sydney  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
Web Address:  
www.microchip.com  
Germany - Munich  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Japan - Osaka  
Tel: 81-66-152-7160  
Fax: 81-66-152-9310  
Atlanta  
Duluth, GA  
Tel: 678-957-9614  
Fax: 678-957-1455  
China - Beijing  
Tel: 86-10-8569-7000  
Fax: 86-10-8528-2104  
Italy - Milan  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
Japan - Yokohama  
Tel: 81-45-471- 6166  
Fax: 81-45-471-6122  
China - Chengdu  
Tel: 86-28-8665-5511  
Fax: 86-28-8665-7889  
Boston  
Westborough, MA  
Tel: 774-760-0087  
Fax: 774-760-0088  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
Korea - Daegu  
Tel: 82-53-744-4301  
Fax: 82-53-744-4302  
China - Chongqing  
Tel: 86-23-8980-9588  
Fax: 86-23-8980-9500  
Chicago  
Itasca, IL  
Tel: 630-285-0071  
Fax: 630-285-0075  
Spain - Madrid  
Tel: 34-91-708-08-90  
Fax: 34-91-708-08-91  
Korea - Seoul  
China - Hangzhou  
Tel: 86-571-2819-3187  
Fax: 86-571-2819-3189  
Tel: 82-2-554-7200  
Fax: 82-2-558-5932 or  
82-2-558-5934  
UK - Wokingham  
Tel: 44-118-921-5869  
Fax: 44-118-921-5820  
Cleveland  
Independence, OH  
Tel: 216-447-0464  
Fax: 216-447-0643  
China - Hong Kong SAR  
Tel: 852-2943-5100  
Fax: 852-2401-3431  
Malaysia - Kuala Lumpur  
Tel: 60-3-6201-9857  
Fax: 60-3-6201-9859  
Dallas  
Addison, TX  
Tel: 972-818-7423  
Fax: 972-818-2924  
China - Nanjing  
Tel: 86-25-8473-2460  
Fax: 86-25-8473-2470  
Malaysia - Penang  
Tel: 60-4-227-8870  
Fax: 60-4-227-4068  
China - Qingdao  
Tel: 86-532-8502-7355  
Fax: 86-532-8502-7205  
Philippines - Manila  
Tel: 63-2-634-9065  
Fax: 63-2-634-9069  
Detroit  
Farmington Hills, MI  
Tel: 248-538-2250  
Fax: 248-538-2260  
China - Shanghai  
Tel: 86-21-5407-5533  
Fax: 86-21-5407-5066  
Singapore  
Tel: 65-6334-8870  
Fax: 65-6334-8850  
Indianapolis  
Noblesville, IN  
Tel: 317-773-8323  
Fax: 317-773-5453  
China - Shenyang  
Tel: 86-24-2334-2829  
Fax: 86-24-2334-2393  
Taiwan - Hsin Chu  
Tel: 886-3-5778-366  
Fax: 886-3-5770-955  
Los Angeles  
China - Shenzhen  
Tel: 86-755-8864-2200  
Fax: 86-755-8203-1760  
Taiwan - Kaohsiung  
Tel: 886-7-213-7828  
Fax: 886-7-330-9305  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
China - Wuhan  
Tel: 86-27-5980-5300  
Fax: 86-27-5980-5118  
Taiwan - Taipei  
Tel: 886-2-2508-8600  
Fax: 886-2-2508-0102  
Santa Clara  
Santa Clara, CA  
Tel: 408-961-6444  
Fax: 408-961-6445  
China - Xian  
Tel: 86-29-8833-7252  
Fax: 86-29-8833-7256  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Fax: 66-2-694-1350  
Toronto  
Mississauga, Ontario,  
Canada  
China - Xiamen  
Tel: 905-673-0699  
Fax: 905-673-6509  
Tel: 86-592-2388138  
Fax: 86-592-2388130  
China - Zhuhai  
Tel: 86-756-3210040  
Fax: 86-756-3210049  
11/27/12  
DS21377C-page 18  
2001-2012 Microchip Technology Inc.  

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