TC1267_13 [MICROCHIP]
400mA PCI LDO; 400毫安PCI LDO
| 型号： | TC1267_13 |
| 厂家： | 
MICROCHIP |
| 描述： | 400mA PCI LDO |
| 文件： | 总14页 (文件大小：276K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1267
400mA PCI LDO
Features
General Description
• Glitch Free Transition Between Input Sources
• Automatic Input Source Selection
• External PMOS Bypass Switch Control
• Built-in 5V Detector
The TC1267 is an application-specific, low dropout
regulator (LDO), specifically intended for use in PCI
peripheral card applications complying with PCI Power
Management (PCI 2.0). It provides an uninterrupted,
3.3V output voltage when the main (5V) or auxiliary
(3.3V) input voltage supplies are present.
• 1% Regulated Output Voltage Accuracy
• 400mA Load Current Capability
• Kelvin Sense Input
The TC1267 consists of an LDO, a voltage threshold
detector, external switchover logic and gate drive
circuitry. It functions as a conventional LDO as long as
the voltage on the main supply input (VIN) is above the
lower threshold (3.90V typical). Should the voltage on
VIN fall below the lower threshold, the LDO is disabled
and an external P-channel MOSFET is automatically
turned on, connecting the auxiliary supply input to
VOUT, and ensuring an uninterrupted 3.3V output. The
main supply is automatically selected, if both the main
and auxiliary input supplies are present, and transition
from one input supply to the other is ensured glitch-
free. High integration, automatic secondary supply swi-
tchover, Kelvin sensing, and small size make the
TC1267 the optimum LDO for PCI 2.0 applications.
• Low Ground Current, Independent of Load
Applications
• PCMCIA
• PCI
• Network Interface Cards (NICs)
• CardbusTM Technology
• Desktop Computers
Device Selection Table
Junction
Temp. Range
Part Number
Package
Functional Block Diagram
TC1267VET
5-Pin DDPAK
-5°C to +95°C
Pin Configuration
5-Pin DDPAK
V
IN
D
V
Detect
R
AUX
Tab is GND
Bandgap
Reference
TC1267
–
E/A
+
V
OUT
GND
1
2 3 4
5
2001-2012 Microchip Technology Inc.
DS21378C-page 1
TC1267
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Supply Voltage (VIN)..............-0.5V to +7V (Max)
Auxiliary Supply Voltage (VAUX) .....-0.5V to +7V (Max)
LDO Output Current (IOUT)................................400mA
Thermal Impedance,
Junction-to-Ambient (JA).......... 27°C/W for DDPAK
ESD Rating .......................................................... 2 KV
Operating Temperature Range (TA)........-5°C to +70°C
Storage Temperature Range (TSTG)...-65°C to +150°C
TC1267 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: T = +25°C, V = 5V, V
= 3.3V, I
= 0.1mA, C
= 4.7F, unless otherwise noted. Boldface
OUT
A
IN
AUX
OUT
type specifications apply over full operating range.
Symbol
Parameter
Supply Voltage
Min
4.4
Typ
5.0
Max
5.5
Units
Test Conditions
V
I
V
V
= 0V
IN
AUX
Ground Current
—
—
230
260
450
500
A
V
= 0V (Note 6)
= 3.3V (Note 6)
GND
AUX
V
AUX
I
Reverse Leakage from
—
-0.1
-1.0
A
V
= 3.5V, V = 0V, I
= 0mA
VIN
AUX
IN
OUT
V
AUX
V
Supply Voltage
3.0
3.3
3.6
V
AUX
I
Quiescent Current
—
—
50
—
70
100
A
V
V
= 0V, I
= 0mA
= 0mA
Q(AUX)
IN
OUT
—
—
60
—
80
120
A
= 5V, I
IN
OUT
I
Reverse Leakage from V
—
-0.1
-1.0
A
V
V
= 5.5V, V
= 0V, I
= 0mA
VAUX
IN
IN
AUX
OUT
V
V
V
5V Detector
Low Threshold Voltage
—
3.75
3.90
—
—
4.05
V
Falling (Notes 2, 3)
TH(LO)
IN
5V Detector
Hysteresis Voltage
—
200
260
—
—
300
mV
V
(Notes 2, 3)
HYST
5V Detector
High Threshold Voltage
—
4.0
4.15
—
—
4.30
V
Rising (Notes 2, 3)
TH(HI)
IN
V
LDO Output Voltage
—
3.300
—
—
3.366
—
V
V
I
= 20mA
OUT
OUT
3.201
3.000
400
4.4V V 5.5V, 0mA I
400mA
IN
OUT
—
V
0mA I
400mA (Note 4)
OUT
I
Output Current
Line Regulation
—
—
mA
%
OUT
REG
—
-0.5
0.05
—
—
+0.5
V
= 4.3V to 5.5V
(LINE)
IN
REG
Load Regulation
Drive Voltage
—
-1.5
-0.1
—
—
+0.5
%
V
I
= 0.1mA to 400mA
(LOAD)
OUT
V
V
V
- 0.2
V
- 0.1
—
—
4.3V V 5.5V, I = 200A
IN DR
DR
IN
IN
- 0.3
—
IN
—
—
35
—
150
200
mV
V
< V
, I = 200A
TH(LO) DR
IN
Note 1: Ensured by design.
2: See 5V Detect Thresholds, Figure 4-1.
3: Recommended source impedance for 5V supply: 0.25. This will ensure that IOUT x RSOURCE < VHYST, thus avoiding DR toggling during
5V detect threshold transitions.
4: In Application Circuit, Figure 3-1.
5: See Timing Diagram, Figure 4-2.
6: Ground Current is independent of ILOAD
.
DS21378C-page 2
2001-2012 Microchip Technology Inc.
TC1267
TC1267 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: T = +25°C, V = 5V, V
= 3.3V, I
= 0.1mA, C = 4.7F, unless otherwise noted. Boldface
OUT
A
IN
AUX
OUT
type specifications apply over full operating range.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
Sinking: V = 3.75V, V = 1V;
I
t
Peak Drive Current
7
6
—
—
—
—
mA
DR(PK)
IN
DR
Sourcing: V = 4.3V, V – V = 2V
IN IN OR
Drive High Delay
(Notes 1, 5)
—
—
4
—
—
8
sec
sec
C
= 1.2nF, V ramping up,
DR IN
DH
measured from V = V
to V = 2V
IN
TH(HI) DR
t
Drive Low Delay
(Notes 1, 5)
—
—
0.6
—
1.5
3.0
C
= 1.2nF, V ramping down,
DR IN
DL
measured from V = V
to V = 2V
IN
TH(LO) DR
Note 1: Ensured by design.
2: See 5V Detect Thresholds, Figure 4-1.
3: Recommended source impedance for 5V supply: 0.25. This will ensure that IOUT x RSOURCE < VHYST, thus avoiding DR toggling during
5V detect threshold transitions.
4: In Application Circuit, Figure 3-1.
5: See Timing Diagram, Figure 4-2.
6: Ground Current is independent of ILOAD
.
2001-2012 Microchip Technology Inc.
DS21378C-page 3
TC1267
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
Symbol
Description
1
2
3
4
5
V
Auxiliary input supply, nominally 3.3V.
AUX
V
Main input supply for the TC1267, nominally 5V.
Logic and power ground.
IN
GND
V
LDO 3.3V output.
OUT
D
Driver output for external P-channel MOSFET pass element.
R
3.0
DETAILED DESCRIPTION
FIGURE 3-1:
APPLICATION CIRCUIT
Q1
TAB IS GND
TC1267
3.3V
5V
3.3V
C1
4.7μF
C2
0.1μF
C3
0.1μF
C4
4.7μF
C5
0.1μF
NOTE: External switch (Q1): use Motorola MGSF1P02ELT1 or equivalent
(PMOS, typical Gate Threshold Voltage = 1V, typical RDS(ON) = 0.4Ω at VGS = 2.5V)
DS21378C-page 4
2001-2012 Microchip Technology Inc.
TC1267
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
VINMAX
= 5V ± 5%
VOUTMIN = 3.217V
ILOADMAX = 400mA
TJMAX
TAMAX
JA
= 95°C
= 70°C
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
= 27°C/W (DDPAK mounted on
1000 sq mm topside copper area)
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
EQUATION 4-1:
Actual power dissipation:
PD (VINMAX – VOUTMIN)ILOADMAX
= (5.25V - 3.217V) 400mA
= 813mW
PD (VINMAX – VOUTMIN)ILOADMAX
Where:
PD = Worst case actual power dissipation
= Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
VINMAX
Maximum allowable power dissipation:
PDMAX = (TJMAX – TAMAX
)
JA
The
maximum
allowable
power
dissipation
= (95 – 70)
27
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (JA).
= 423mW
In this example, the TC1267 dissipates a maximum of
813mW; below the allowable limit of 926mW.
EQUATION 4-2:
PDMAX = (TJMAX – TAMAX
)
JA
Where all terms are previously defined.
Table 4-1 shows various values of JA for the TC1267
packages.
TABLE 4-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1267 IN
5-PIN DDPAK
Copper
Area
(Topside)*
Copper
Area
(Backside)
Thermal
Resistance
Board
Area
)
JA
2500 sq mm 2500 sq mm 2500 sq mm
1000 sq mm 2500 sq mm 2500 sq mm
125 sq mm 2500 sq mm 2500 sq mm
25°C/W
27°C/W
35°C/W
*Tab of device attached to topside copper.
2001-2012 Microchip Technology Inc.
DS21378C-page 5
TC1267
FIGURE 4-1:
5V DETECT THRESHOLD
4.4V
V
HYST
V
TH(HI)
V
IN
V
TH(LO)
3.65V
2.0V
2.0V
D
R
NOTE: V rise and fall times (10% to 90%) to be ≥ 100μsec.
IN
FIGURE 4-2:
TIMING DIAGRAM
4.4V
V
IN
3.65V
t
DH
t
DL
D
R
2.0V
2.0V
NOTE: V rise and fall times (10% to 90%) to be ≤ 0.1μsec.
IN
DS21378C-page 6
2001-2012 Microchip Technology Inc.
TC1267
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
I
vs. V vs. Junction Temperature
IN
I
vs. V vs. Junction Temperature
IN
Q
Q
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.45
0.40
0.35
0.30
0.25
0.20
0.15
+125°C
I
V
= 0.1mA
O
I
V
= 0.1mA
= 3.3V
O
AUX
= 0V
AUX
+125°C
+25°C
-5°C
0.10
0.05
0.00
-5°C
0.10
0.05
+25°C
0.00
3
4
5
0
1
2
6
0
1
2
3
4
5
6
V
(V)
IN
V
(V)
IN
I
0.35
0.30
0.25
(Aux) vs. V
vs. Junction Temperature
Q
AUX
I
(Aux) vs. V
vs. Junction Temperature
Q
AUX
0.35
0.30
0.25
I
= 0mA
O
I
= 0mA
O
V
= 0V
AUX
V
= 5V
AUX
-5°C
0.20
+125°C
0.20
-5°C
+125°C
0.15
0.10
0.05
0.00
0.15
0.10
0.05
0.00
+25°C
+25°C
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
(V)
3
3.3 3.6
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
(V)
3
3.3 3.6
V
AUX
V
AUX
LDO Output Voltage vs. Junction Temperature
3.34
I
V
= 200mA
O
3.33
= 5V
IN
3.32
3.31
3.30
3.29
3.28
3.27
3.26
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE °C
2001-2012 Microchip Technology Inc.
DS21378C-page 7
TC1267
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
Drive High Delay
Drive Low Delay
V
steps from 0.8V to 5V
IN
See application circuit on Page 5
= 200mA
I
LOAD
Trace 1: VIN stepping for 0.8V to 5V
Trace 1: VIN stepping for 5.5V to 0V
Trace 2: DR
TDH = < 4 S
TH(HI)
R
TDL = < 600nS
V
O
(min) with V Rising
IN
V
O
(min) with V Falling
IN
Notice no voltage spikes during transition
from V to LDO output
AUX
V
voltage difference is I
OUT
x R
and variations
OUT
between V
DS(ON)
supply and LDO output voltage
V
voltage difference is I
x R
+ voltage
DS(ON)
OUT
difference from LDO to V
OUT
supply
AUX
AUX
Trace 1: VIN – 3A charging a 1500µF capacitor
Trace 2: DR going high at VTH(HI)
Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.24V
Trace 1: VIN – discharging a 1500µF capacitor
Trace 2: DR going low at VTH(LO)
Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.14V
ILOAD = 20mA
ILOAD = 20mA
DS21378C-page 8
2001-2012 Microchip Technology Inc.
TC1267
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 5-Pin DDPAK Devices
PIN 1
User Direction of Feed
M a r k i n g
D e v i c e
W
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
5-Pin DDPAK
24 mm
16 mm
750
13 in
6.3
Package Dimensions
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
5-Pin DDPAK
.410 (10.41)
.385 (9.78)
.183 (4.65)
.170 (4.32)
.067 (1.70)
.045 (1.14)
.055 (1.40)
.045 (1.14)
3° - 7°
(5x)
.370 (9.40)
.330 (8.38)
.010 (0.25)
.000 (0.00)
.605 (15.37)
.549 (13.95)
.026 (0.66)
.014 (0.36)
.110 (2.79)
.068 (1.72)
.037 (0.94)
.026 (0.66)
PIN 1
.067 (1.70) TYP.
8° MAX.
Dimensions: inches (mm)
2001-2012 Microchip Technology Inc.
DS21378C-page 9
TC1267
7.0
REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
DS21378C-page 10
2001-2012 Microchip Technology Inc.
TC1267
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2001-2012 Microchip Technology Inc.
DS21378C-page11
TC1267
NOTES:
DS21378C-page12
2001-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767818
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CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
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Tempe, Arizona; Gresham, Oregon and design centers in California
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== ISO/TS 16949 ==
2001-2012 Microchip Technology Inc.
DS21378C-page 13
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Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/27/12
DS21378C-page 14
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