TC1269-2.5VUA [MICROCHIP]
300mA CMOS LDO with Shutdown and VREF Bypass; 300毫安CMOS LDO具有关断功能和VREF绕道型号: | TC1269-2.5VUA |
厂家: | MICROCHIP |
描述: | 300mA CMOS LDO with Shutdown and VREF Bypass |
文件: | 总12页 (文件大小:198K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TC1269
300mA CMOS LDO with Shutdown and VREF Bypass
Features
General Description
• Very Low Ground Current for Longer Battery Life
• Very Low Dropout Voltage
The TC1269 is a fixed output, high accuracy (typically
±0.5%) CMOS upgrade for older (bipolar) low dropout
regulators. Total supply current is typically 50A at full
load (20 to 60 times lower than in bipolar regulators).
• 300mA Output Circuit
• High Output Voltage Accuracy
TC1269 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load), and fast response to step
changes in load. Supply current is reduced to 0.05A
(typical) and VOUT falls to zero when the shutdown
input is low.
• Standard or Custom Output Voltages
• Power Saving Shutdown Mode
• Bypass Input for Ultra Quiet Operation
• Over Current and Over Temperature Protection
• Space-Saving MSOP Package
The TC1269 incorporates both over temperature and
over current protection. The TC1269 is stable with an
output capacitor of only 1F and has a maximum
output current of 300mA.
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
Typical Application
1
8
7
• Cellular/GSM/PHS Phones
• Linear Post-Regulator for SMPS
• Pagers
V
V
IN
V
V
IN
OUT
OUT
+
C1
1µF
2
SHDN
NC
Shutdown Control
(from Power
Control Logic)
• Digital Cameras
TC1269
Device Selection Table
6
3
4
NC
NC
Output*
Junction
GND
Bypass
C
470pF
BYPASS
Part Number Voltage Package
Temp. Range
(V)
(Optional)
TC1269-2.5VUA
TC1269-2.8VUA
TC1269-3.0VUA
TC1269-3.3VUA
TC1269-5.0VUA
2.5
2.8
3.0
3.3
5.0
8-Pin MSOP -40°C to +125°C
8-Pin MSOP -40°C to +125°C
8-Pin MSOP -40°C to +125°C
8-Pin MSOP -40°C to +125°C
8-Pin MSOP -40°C to +125°C
*Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
8-Pin MSOP
V
1
8
V
IN
OUT
NC
NC
2
3
7
6
SHDN
NC
TC1269
4
5
GND
Bypass
2002-2012 Microchip Technology Inc.
DS21380C-page 1
TC1269
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................... (VSS – 0.3) to (VIN + 0.3V)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Power Dissipation................Internally Limited (Note 6)
Operating Temperature ...............-40°C < TJ < +125°C
Storage Temperature..........................-65°C to +150°C
TC1269 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V = V
+ 1V, I = 0.1A, C = 3.3F, SHDN > V , T = 25°C, unless otherwise noted. Boldface
L L IH A
IN
OUT
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
Input Operating Voltage
Maximum Output Current
Output Voltage
—
—
—
6.0
—
V
mA
V
IN
I
300
OUTMAX
V
—
– 2.5%
V
±0.5%
—
—
+ 2.5%
Note 1
OUT
R
V
V
R
R
V
V
V
/T
/V
/V
V
Temperature Coefficient
OUT
—
—
—
40
— ppm/°C Note 2
OUT
Line Regulation
Load Regulation
Dropout Voltage
0.05
0.5
0.35
2.0
%
%
(V + 1V) V 6V
OUT
IN
R
IN
I = 0.1mA to I
OUTMAX
OUT OUT
L
V
-V
—
—
—
20
80
240
30
mV
I = 0.1mA
L
IN OUT
160
480
I = 100mA
L
I = 300mA (Note 4)
L
I
Supply Current
—
—
—
—
—
—
50
0.05
50
90
0.5
—
A
A
SHDN = V
SS1
IH
I
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
SHDN = 0V
SS2
PSRR
dB
F
120Hz
RE
I
550
0.04
260
650
—
mA
V/W
V
= 0V
OUT
OUTSC
V
/P
Note 5
OUT
D
eN
Output Noise
—
nV/Hz F = 1kHz, C
= 1F, R
= 50
LOAD
OUT
SHDN Input
V
V
SHDN Input High Threshold
SHDN Input Low Threshold
V is the regulator output voltage setting.
R
45
—
—
—
%V
%V
IH
IL
IN
—
15
IN
Note 1:
2:
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specifica-
tion.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differen-
tial.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
DS21380C-page 2
2002-2012 Microchip Technology Inc.
TC1269
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
Symbol
Description
1
2
3
4
5
6
7
V
Regulated voltage output.
No connect.
OUT
NC
NC
No connect.
GND
Bypass
NC
Ground terminal.
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
No connect.
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator is fully enabled when a logic high is applied to this input. The regulator enters shut-
down when a logic low is applied to this input. During shutdown, output voltage falls to zero and
supply current is reduced to 0.05A (typical).
8
V
Unregulated supply input.
IN
2002-2012 Microchip Technology Inc.
DS21380C-page 3
TC1269
3.1
Bypass Input
3.0
DETAILED DESCRIPTION
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
The TC1269 is a precision regulator available in fixed
voltages. Unlike the bipolar regulators, the TC1269
supply current does not increase with load current. In
addition, VOUT remains stable and within regulation
over the entire 0mA to IOUTMAX operating load current
range, (an important consideration in RTC and CMOS
RAM battery backup applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05A
(typical), VOUT falls to zero.
3.2
Output Capacitor
A 1F (min) capacitor from VOUT to ground is
recommended. The output capacitor should have an
effective series resistance greater than 0.1 and less
than 5.0, and a resonant frequency above 1MHz. A
1F capacitor should be connected from VIN to GND if
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approxi-
mately -30°C, solid tantalums are recommended for
applications operating below -25°C.) When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
1
8
V
V
V
OUT
OUT
IN
+
+
C1
C1
1µF
1µF
+
–
Battery
7
2
SHDN
NC
Shutdown Control
(from Power
Control Logic)
TC1269
6
3
4
NC
NC
GND
Bypass
C
BYPASS
470pF
(Optional)
DS21380C-page 4
2002-2012 Microchip Technology Inc.
TC1269
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
VINMAX
= 3.0V ± 10%
VOUTMIN = 2.7V – 2.5%
ILOAD
TAMAX
= 250mA
= 55°C
4.2
Power Dissipation
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
Actual power dissipation:
PD (VINMAX – VOUTMIN) ILOADMAX
= [(3.0 x 1.1) – (2.7 x .975)]250 x 10-3
= 167mW
EQUATION 4-1:
PD (VINMAX – VOUTMIN)ILOADMAX
Maximum allowable power dissipation:
Where:
PDMAX = (TJMAX – TAMAX
)
PD = Worst case actual power dissipation
JA
= Maximum voltage on VIN
VIN
MAX
= (125 – 55)
200
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
= 350mW
The
maximum
allowable
power
dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (JA).
In this example, the TC1269 dissipates a maximum of
167mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.
EQUATION 4-2:
4.3
Layout Considerations
PDMAX = (TJ
–
TA
)
MAX
MAX
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower JA and, therefore,
increase the maximum allowable power dissipation
limit.
JA
Where all terms are previously defined.
2002-2012 Microchip Technology Inc.
DS21380C-page 5
TC1269
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1μF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 100mA
1 to 50mA
-0.002
0.20
0.00
-0.004
0.01
10
-40° -20° 0° 20° 40° 60° 80° 100° 120°
TEMPERATURE ( C)
-40° -20°
0.01
1
100
1000
0° 20° 40° 60° 80° 100° 120°
FREQUENCY (kHz)
°
TEMPERATURE (°C)
Supply Current
V
vs. Temperature
OUT
100.0
90.0
80.0
0.40
0.35
3.075
3.025
125C
85C
V
= 4V
LOAD
LOAD
IN
I
= 100μA
= 3.3μF
C
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70C
25C
70.0
60.0
50.0
40.0
0C
2.975
-40C
2.925
-40° -20°
0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
50
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
100
150 200 250 300
LOAD CURRENT (mA)
DS21380C-page 6
2002-2012 Microchip Technology Inc.
TC1269
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
6.3
Package Dimensions
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin MSOP
PIN 1
.197 (5.00)
.189 (4.80)
.122 (3.10)
.114 (2.90)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.008 (0.20)
.005 (0.13)
6° MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
2002-2012 Microchip Technology Inc.
DS21380C-page 7
TC1269
7.0
REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
DS21380C-page 8
2002-2012 Microchip Technology Inc.
TC1269
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002-2012 Microchip Technology Inc.
DS21380C-page9
TC1269
NOTES:
DS21380C-page10
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767825
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
DS21380C-page 11
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Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/27/12
DS21380C-page 12
2002-2012 Microchip Technology Inc.
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