TC1269 [MICROCHIP]
300mA CMOS LDO with Shutdown and VREF Bypass; 300毫安CMOS LDO具有关断功能和VREF绕道
| 型号： | TC1269 |
| 厂家： | 
MICROCHIP |
| 描述： | 300mA CMOS LDO with Shutdown and VREF Bypass |
| 文件： | 总12页 (文件大小：434K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1269
300mA CMOS LDO with Shutdown and V
Bypass
REF
Features
General Description
• Very Low Ground Current for Longer Battery Life
• Very Low Dropout Voltage
The TC1269 is a fixed output, high accuracy (typically
±0.5%) CMOS upgrade for older (bipolar) low dropout
regulators. Total supply current is typically 50µA at full
load (20 to 60 times lower than in bipolar regulators).
• 300mA Output Circuit
• High Output Voltage Accuracy
TC1269 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load), and fast response to step
changes in load. Supply current is reduced to 0.05µA
• Standard or Custom Output Voltages
• Power Saving Shutdown Mode
• Bypass Input for Ultra Quiet Operation
• Over Current and Over Temperature Protection
• Space-Saving MSOP Package
(typical) and V
input is low.
falls to zero when the shutdown
OUT
The TC1269 incorporates both over temperature and
over current protection. The TC1269 is stable with an
output capacitor of only 1µF and has a maximum
output current of 300mA.
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
Typical Application
1
8
7
• Cellular/GSM/PHS Phones
• Linear Post-Regulator for SMPS
• Pagers
V
V
IN
V
V
IN
OUT
OUT
+
C1
1µF
2
SHDN
NC
Shutdown Control
(from Power
Control Logic)
• Digital Cameras
TC1269
Device Selection Table
6
3
4
NC
NC
Output*
Junction
GND
Bypass
C
470pF
BYPASS
Part Number Voltage Package
Temp. Range
(V)
(Optional)
TC1269-2.5VUA
TC1269-2.8VUA
TC1269-3.0VUA
TC1269-3.3VUA
TC1269-5.0VUA
2.5
2.8
3.0
3.3
5.0
8-Pin MSOP -40°C to +125°C
8-Pin MSOP -40°C to +125°C
8-Pin MSOP -40°C to +125°C
8-Pin MSOP -40°C to +125°C
8-Pin MSOP -40°C to +125°C
*Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
8-Pin MSOP
V
1
8
V
IN
OUT
NC
NC
2
3
7
6
SHDN
NC
TC1269
4
5
GND
Bypass
2002 Microchip Technology Inc.
DS21380B-page 1
TC1269
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................... (V – 0.3) to (V + 0.3V)
SS
IN
Maximum Voltage on Any Pin ........V +0.3V to -0.3V
IN
Power Dissipation................Internally Limited (Note 6)
Operating Temperature ............... -40°C < T < +125°C
J
Storage Temperature..........................-65°C to +150°C
TC1269 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
VIN
IOUTMAX
VOUT
Parameter
Min
Typ
Max
Units
Test Conditions
Input Operating Voltage
Maximum Output Current
Output Voltage
—
—
—
6.0
V
mA
V
300
—
—
R – 2.5%
VR ±0.5%
—
—
Note 1
V
V
R + 2.5%
∆VOUT/∆T
VOUT Temperature Coefficient
—
—
—
40
0.05
0.5
—
0.35
2.0
ppm/°C Note 2
∆VOUT/∆VIN Line Regulation
∆VOUT/VOUT Load Regulation
%
%
(VR + 1V) ≤ VIN ≤ 6V
IL = 0.1mA to IOUTMAX
VIN-VOUT
Dropout Voltage
—
—
—
20
80
240
30
160
480
mV
I
I
I
L = 0.1mA
L = 100mA
L = 300mA (Note 4)
ISS1
Supply Current
—
—
—
—
—
—
50
0.05
50
90
0.5
—
µA
µA
SHDN = VIH
SHDN = 0V
FRE ≤ 120Hz
VOUT = 0V
Note 5
ISS2
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
PSRR
IOUTSC
dB
550
0.04
260
650
—
mA
V/W
∆VOUT/∆PD Thermal Regulation
eN
Output Noise
—
nV/√Hz F = 1kHz, COUT = 1µF, RLOAD = 50Ω
SHDN Input
VIH
VIL
SHDN Input High Threshold
SHDN Input Low Threshold
V is the regulator output voltage setting.
R
45
—
—
—
%VIN
%VIN
—
15
Note 1:
2:
TC VOUT = (VOUTMAX – VOUTMIN) x 106
VOUT x ∆T
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from
0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specifica-
tion.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differen-
tial.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
DS21380B-page 2
2002 Microchip Technology Inc.
TC1269
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
Symbol
Description
1
2
3
4
5
6
7
VOUT
NC
Regulated voltage output.
No connect.
NC
No connect.
GND
Bypass
NC
Ground terminal.
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
No connect.
SHDN
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator is fully enabled when a logic high is applied to this input. The regulator enters shut-
down when a logic low is applied to this input. During shutdown, output voltage falls to zero and
supply current is reduced to 0.05µA (typical).
8
VIN
Unregulated supply input.
2002 Microchip Technology Inc.
DS21380B-page 3
TC1269
3.1
Bypass Input
3.0
DETAILED DESCRIPTION
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
The TC1269 is a precision regulator available in fixed
voltages. Unlike the bipolar regulators, the TC1269
supply current does not increase with load current. In
addition, V
remains stable and within regulation
OUT
over the entire 0mA to I
operating load current
OUTMAX
range, (an important consideration in RTC and CMOS
RAM battery backup applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
3.2
Output Capacitor
(SHDN) is at or above V , and shutdown (disabled)
A
1µF (min) capacitor from
V
to ground is
OUT
IH
when SHDN is at or below V . SHDN may be
recommended. The output capacitor should have an
effective series resistance greater than 0.1Ω and less
than 5.0Ω, and a resonant frequency above 1MHz. A
IL
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05µA
1µF capacitor should be connected from V to GND if
IN
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approxi-
mately -30°C, solid tantalums are recommended for
applications operating below -25°C.) When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.
(typical), V
falls to zero.
OUT
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
1
8
V
V
V
OUT
OUT
IN
+
+
C1
C1
1µF
1µF
+
Battery
7
2
SHDN
NC
Shutdown Control
(from Power
–
Control Logic)
TC1269
6
3
4
NC
NC
GND
Bypass
C
BYPASS
470pF
(Optional)
DS21380B-page 4
2002 Microchip Technology Inc.
TC1269
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Given:
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
V
= 3.0V ± 10%
= 2.7V – 2.5%
= 250mA
INMAX
V
OUTMIN
LOAD
I
T
AMAX
= 55°C
4.2
Power Dissipation
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
Actual power dissipation:
P
≈ (VINMAX – VOUTMIN) I
LOADMAX
D
-3
= [(3.0 x 1.1) – (2.7 x .975)]250 x 10
= 167mW
EQUATION 4-1:
P
≈ (VINMAX – VOUTMIN)I
LOADMAX
D
Maximum allowable power dissipation:
Where:
P
DMAX = (TJMAX – T
)
AMAX
P
= Worst case actual power dissipation
D
θ
JA
= Maximum voltage on
V
V
MAX
IN
IN
= (125 – 55)
200
V
= Minimum regulator output voltage
= Maximum output (load) current
OUTMIN
I
LOADMAX
= 350mW
The
maximum
allowable
power
dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
In this example, the TC1269 dissipates a maximum of
167mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.
junction-to-air (θ ).
JA
EQUATION 4-2:
4.3
Layout Considerations
P
MAX = (T
–
T
)
MAX
D
JMAX
A
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
θ
JA
Where all terms are previously defined.
supply bus lines combine to lower θ and, therefore,
JA
increase the maximum allowable power dissipation
limit.
2002 Microchip Technology Inc.
DS21380B-page 5
TC1269
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1µF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 100mA
1 to 50mA
-0.002
0.20
0.00
-0.004
0.01
10
-40° -20° 0° 20° 40° 60° 80° 100° 120°
TEMPERATURE ( C)
-40° -20°
0.01
1
100
1000
0° 20° 40° 60° 80° 100° 120°
FREQUENCY (kHz)
°
TEMPERATURE (°C)
Supply Current
V
vs. Temperature
OUT
100.0
90.0
80.0
0.40
0.35
3.075
3.025
125C
85C
V
= 4V
LOAD
LOAD
IN
I
= 100µA
= 3.3µF
C
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70C
25C
70.0
60.0
50.0
40.0
0C
2.975
-40C
2.925
-40° -20°
0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
50
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
100
150 200 250 300
LOAD CURRENT (mA)
DS21380B-page 6
2002 Microchip Technology Inc.
TC1269
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
6.3
Package Dimensions
8-Pin MSOP
PIN 1
.197 (5.00)
.189 (4.80)
.122 (3.10)
.114 (2.90)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.008 (0.20)
.005 (0.13)
6° MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21380B-page 7
TC1269
NOTES:
DS21380B-page 8
2002 Microchip Technology Inc.
TC1269
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21380B-page 9
TC1269
NOTES:
DS21380B-page 10
2002 Microchip Technology Inc.
TC1269
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
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2002 Microchip Technology Inc.
DS21380B-page 11
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05/01/02
DS21380B-page 12
2002 Microchip Technology Inc.
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