HI-5700/883_技术文档

®

HI-5700/883

8-Bit, 20 MSPS Flash A/D Converter

May 1997

Features

Description

• This Circuit is Processed in Accordance to MIL-STD- The HI-5700/883 is a monolithic, 8-bit, CMOS Flash Analog-

883 and is Fully Conformant Under the Provisions of to-Digital Converter. It is designed for high speed applica-

Paragraph 1.2.1.

tions where wide bandwidth and low power consumption are

essential. Its 20 MSPS speed is made possible by a parallel

architecture which also eliminates the need for an external

sample and hold circuit. The HI-5700/883 delivers ±0.5 LSB

differential nonlinearity while consuming only 725mW (typi-

cal) at 20 MSPS. Microprocessor compatible data output

latches are provided which present valid data to the output

bus 1.5 clock cycles after the convert command is received.

An overflow bit is provided to allow the series connection of

two converters to achieve 9-bit resolution.

• 20 MSPS with No Missing Codes

• 18MHz Full Power Input Bandwidth

• No Missing Codes Over Temperature

• Sample and Hold Not Required

• Single +5V Supply Voltage

• CMOS/TTL

• Overflow Bit

Applications

Ordering Information

• Video Digitizing

TEMPERATURE

• Radar Systems

PART NUMBER

RANGE

PACKAGE

• Medical Imaging

HI1-5700S/883

-55^oC to +125^oC

28 Lead CerDIP

• Communication Systems

• High Speed Data Acquisition Systems

Functional Block Diagram

Pinout

∅2

∅1

∅2

HI-5700/883

(28 LEAD CERDIP)

TOP VIEW

V_IN

28

OVERFLOW

(OVF)

D

CL

R/2

Q

14

V_REF+ 17

V

1

2

R

CLK

D7

28

IN

COMP

D

CL

256

Q

2

3

D7 (MSB)

D6

-

27

26

25

24

REF

R

D6

AV

DD

3

9

22

6

3/4R

1/2R

1/4R

D

CL

Q

R

AGND

4

D5

COMP

193

5

D4

1/4R

V_DD

D

CL

Q

D5

D4

D3

4

5

6

23 AV_DD

COMP

129

1/2R

AV

7

22

21

20

19

18

17

16

15

D

CL

Q

8

GND

3/4R

DD

AGND

D

CL

9

10

Q

COMP

65

D3

D2

10

11

12

13

14

AGND

D

CL

AV

DD

D2

D1

Q

11

12

V

+

D1

REF

D

CL

COMP

2

Q

D0

CE1

CE2

R

OVF

D

CL

V_REF

-

27

1

13

D0 (LSB)

Q

R/2

COMP

1

CE1

CE2

16

15

∅1

∅2

V

DD

AV

7

8

23 21 26 18

24 25 19 20

DD

CLK

AGND

GND

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.

Spec Number 512023

File Number 3286.1

6-8

HI-5700/883

Chip Enable Truth Table

Pin Descriptions

PIN #

NAME

CLK

D7

DESCRIPTION

Clock Input

CE1

CE2

D0 - D7

Valid

OVF

1

0

1

0

Valid

2

Bit 7, Output (MSB)

Bit 6, Output

1

Three-State

3

D6

X

Three-State

4

D5

Bit 5, Output

X = Don’t Care.

5

D4

Bit 4, Output

6

1/4R

V_DD

GND

3/4R

D3

1/4th Point of Reference Ladder

Digital Power Supply

Digital Ground

7

8

9

3/4th Point of Reference Ladder

Bit 3, Output

10

11

12

13

14

15

D2

Bit 2, Output

D1

Bit 1, Output

D0

Bit 0, Output (LSB)

Overflow, Output

OVF

CE2

Three-State Output Enable Input,

Active High. (See Truth Table)

16

CE1

Three-State Output Enable Input,

Active Low. (See Truth Table))

17

18

19

20

21

22

23

24

25

26

27

28

V_REF

+

Reference Voltage Positive Input

Analog Power Supply, +5V

Analog Ground

AV_DD

AGND

AV_DD

1/2R

Analog Ground

Analog Power Supply, +5V

1/2 Point of Reference Ladder

Analog Power Supply, +5V

Analog Ground

AV_DD

AGND

AV_DD

Analog Ground

Analog Power Supply, +5V

Reference Voltage Negative Input

Analog Input

V_REF

V_IN

-

Spec Number 512023

6-9

Specifications HI-5700/883

Absolute Maximum Ratings

Thermal Information

Supply Voltage, V_DDto GND . . . . . . . . . (GND - 0.5) < V_DD< +7.0V

Analog and Reference Input Pins. .(V_SS- 0.5) < V_INA< (V_DD+0.5V)

Thermal Resistance

θ_JA

θ_JC

HI1-5700S/883 . . . . . . . . . . . . . . . . . . . .

47⁰C/W

28^oC/W

Digital I/O Pins . . . . . . . . . . . . . . . (GND - 0.5) < V_I/O< (V_DD+0.5V) Power Dissipation at +75^oC (Note 1)

Operating Temperature Range

HI1-5700S/883 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2100mW

HI1-5700S/883 . . . . . . . . . . . . . . . . . . . . . . . . . . -55^oC to +125^oC

Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175^oC

Power Dissipation Derating Factor Above +75^oC

HI1-5700S/883 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21mW/^oC

Storage Temperature Range . . . . . . . . . . . . . . . -65^oC to +150^oC Reliabiliy Information

Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . 300^oC

ESD Clasification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1

Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14677

Worst Case Density . . . . . . . . . . . . . . . . . . . . . . . . 3.05 x 10⁴A/cm²

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS

Device Tested at: AV_DD= V_DD= +5.0V; V_REF+ = +4.0V; V_REF- = GND = AGND = 0V; F_S= Specified Clock Frequency at 50% Duty Cycle;

C_L= 30pF; Unless Otherwise Specified.

LIMITS

GROUP A

PARAMETERS

ACCURACY

SYMBOL

CONDITIONS

SUBGROUP

TEMPERATURE

MIN

MAX

UNIT

Integral Linearity Error

(Best Fit Method)

INL

F_S= 15MHz, f_IN= DC

F_S= 20MHz, f_IN= DC

F_S= 15MHz, f_IN= DC

F_S= 20MHz, f_IN= DC

F_S= 15MHz, f_IN= DC

F_S= 20MHz, f_IN= DC

F_S= 15MHz, f_IN= DC

F_S= 20MHz, f_IN= DC

1

2, 3

1

+25^oC

+125^oC, -55^oC

+25^oC

-

±2.0

±2.65

±2.25

±4.1

±0.9

±1.0

±0.9

±1.0

±8.0

±9.5

±8.0

±9.5

±4.5

±8.0

±4.5

±8.0

LSB

2, 3

1

+125^oC, -55^oC

+25^oC

Differential Linearity Error

(Guaranteed No Missing

Codes)

DNL

VOS

FSE

2, 3

1

+125^oC, -55^oC

+25^oC

2, 3

1

+125^oC, -55^oC

+25^oC

Offset Error

(Adjustable to Zero)

2, 3

1

+125^oC, -55^oC

+25^oC

2, 3

1

+125^oC, -55^oC

+25^oC

Full Scale Error

(Adjustable to Zero)

2, 3

1

+125^oC, -55^oC

+25^oC

2, 3

+125^oC, -55^oC

ANALOG INPUT

Analog Input Resistance

R_IN

V_IN= 4V

1

+25^oC

+125^oC, -55^oC

+25^oC

4

-

MΩ

µA

2, 3

1

-

Analog Input Bias Current

I_B

V_IN= 0V, 4V

±1.0

2, 3

+125^oC, -55^oC

µA

REFERENCE INPUT

Total Reference Resistance

R_L

1

+25^oC

250

235

-

Ω

2, 3

+125^oC, -55^oC

Spec Number 512023

6-10

Specifications HI-5700/883

TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)

Device Tested at: AV_DD= V_DD= +5.0V; V_REF+ = +4.0V; V_REF- = GND = AGND = 0V; F_S= Specified Clock Frequency at 50% Duty Cycle;

C_L= 30pF; Unless Otherwise Specified.

LIMITS

GROUP A

PARAMETERS

DIGITAL INPUTS

SYMBOL

V_IH

CONDITIONS

SUBGROUP

TEMPERATURE

MIN

MAX

UNIT

Input High Voltage

Input Low Voltage

Logic Input Current

1

2, 3

1

+25^oC

+125^oC, -55^oC

+25^oC

2.0

-

V

2.0

-

V_IL

-

0.8

±1

V

2, 3

1

+125^oC, -55^oC

+25^oC

V

I_IN

V_IN= 0V, +5V

µA

2, 3

+125^oC, -55^oC

DIGITAL OUTPUTS

Output Leakage

I_OZ

I_OH

I_OL

CE2 = 0V, V_O= 0V, 5V

V_O= 4.5V

1

2, 3

1

+25^oC

+125^oC, -55^oC

+25^oC

-

±1.0

µA

-

±1.0

Output Logic Source Current

Output Logic Sink Current

-3.2

3.2

-

mA

2, 3

1

+125^oC, -55^oC

+25^oC

V_O= 0.4V

2, 3

+125^oC, -55^oC

POWER SUPPLY REJECTION

Offset Error PSRR

∆VOS

∆FSE

V_DD= 5V ±10%

1

+25^oC

+125^oC, -55^oC

+25^oC

-

±2.75

±5.5

LSB

2, 3

1

Gain Error PSRR

±2.75

±5.5

2, 3

+125^oC, -55^oC

POWER SUPPLY CURRENT

Supply Current

I_DD

F_S= 20MHz

1

+25^oC

-

180

190

mA

2, 3

+125^oC, -55^oC

NOTE:

1. Dissipation rating assumes device is mounted with all leads soldered to printed circuit board.

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS

Device Tested at: AV_DD= V_DD= +5.0V; V_REF+ = +4.0V; V_REF- = GND = AGND = 0V; F_S= Specified Clock Frequency at 50% Duty Cycle;

C_L= 30pF; Unless Otherwise Specified.

LIMITS

GROUP A

PARAMETER

SYMBOL

CONDITIONS

SUBGROUP

TEMPERATURE

+25^oC

MIN

20

-

MAX

UNIT

MSPS

ns

Maximum Conversion Rate

No Missing Codes

9

-

10, 11

9

+125^oC, -55^oC

+25^oC

-

Data Output Enable Time

t_EN

25

30

10, 11

+125^oC, -55^oC

-

ns

Spec Number 512023

6-11

Specifications HI-5700/883

TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)

Device Tested at: AV_DD= V_DD= +5.0V; V_REF+ = +4.0V; V_REF- = GND = AGND = 0V; F_S= Specified Clock Frequency at 50% Duty Cycle;

C_L= 30pF; Unless Otherwise Specified.

LIMITS

GROUP A

PARAMETER

SYMBOL

CONDITIONS

SUBGROUP

TEMPERATURE

+25^oC

MIN

MAX

20

25

30

-

UNIT

ns

Data Output Disable Time

t_DIS

9

-

10, 11

9

+125^oC, -55^oC

+25^oC

ns

Data Output Delay

Data Output Hold

t_OD

-

ns

10, 11

9

+125^oC, -55^oC

+25^oC

-

ns

t_H

10

5

ns

10, 11

+125^oC, -55^oC

-

ns

TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (NOTE 1)

Device Characterized at: AV_DD= V_DD= +5.0V; V_REF+ = +4.0V; V_REF- = GND = AGND = 0V; F_S= Specified Clock Frequency at 50% Duty

Cycle; C_L= 30pF; Unless Otherwise Specified.

LIMITS

PARAMETER

Minimum Conversion Rate

NOTE:

SYMBOL

CONDITIONS

TEMPERATURE

MIN

MAX

UNIT

No Missing Codes

+25^oC, +125^oC, -55^oC

-

0.125

MSPS

1. Parameters listed in Table 3 are controlled via design or process parameters and are not directly tested at final production. These pa-

rameters are lab characterized upon initial design release, or upon design changes. These parameters are guaranteed by character-

ization based upon data from multiple production runs which reflect lot to lot and within lot variation.

TABLE 4. ELECTRICAL TEST REQUIREMENTS

MIL-STD-883 TEST REQUIREMENTS

Interim Electrical Parameters (Pre Burn-In)

Final Electrical Test Parameters

Group A Test Requirements

Groups C & D Endpoints

SUBGROUPS (SEE TABLES 1 AND 2)

1

1 (Note 1), 2, 3, 9, 10, 11

1, 2, 3, 9, 10, 11

1

NOTE:

1. PDA applies to Subgroup 1 only. No other subgroups are included in PDA.

Spec Number 512023

6-12

HI-5700/883

Die Characteristics

DIE DIMENSIONS:

154.3 x 173.2 x 19 ± 1mils

METALLIZATION:

Type: Si - Al

Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO

2

Thickness: 8kÅ ± 1kÅ

DIE ATTACH:

Material: Gold Silicon Eutectic Alloy

o

Temperature: Ceramic DIP - 460 C (Max)

WORST CASE CURRENT DENSITY:

4

2

3.05 x 10 A/cm

Metallization Mask Layout

HI-5700/883

26

25

4

3

2

1

28

27

D4

5

AGND

1/4R

V_DD

6

7

AGND

AV_DD

24

23

V_DD

GND

7

8

22

21

1/2R

AV_DD

AGND

8

20

3/4R

D3

9

AGND

AV_DD

19

10

11

12

13

14

15

16

17

18

Spec Number 512023

6-13

Specifications HI-5700/883

Timing Waveforms

ENCODER DATA IS

LATCHED INTO THE

OUTPUT REGISTERS

COMPARATOR DATA

IS LATCHED

SAMPLE

N-1

SAMPLE

N

SAMPLE

N+1

SAMPLE

N+2

CLOCK

N-2

AUTO

BALANCE

t_AB

AUTO

BALANCE

AUTO

BALANCE

AUTO

BALANCE

INPUT

ANALOG

INPUT

t_AP

t_H

t_AJ

t_OD

DATA

OUTPUT

DATA N-4

DATA N-3

DATA N-2

DATA N-1

DATA N

FIGURE 1. INPUT-TO-OUTPUT TIMING

CE1

CE2

t_EN

t_DIS

HIGH

D0 - D7

DATA

IMPEDANCE

HIGH

IMPEDANCE

OVF

DATA

FIGURE 2. OUTPUT ENABLE TIMING

Spec Number 512023

6-14

HI-5700/883

Burn-In Circuit

HI-5700/883 CERAMIC DIP

+5.5V

1:10 DUTY CYCLE

100kHz; 0 < V< 5 VOLTS

0.01µF

1µF

GND

TRIANGLE-WAVEFORM;

28

1

2

3

4

5

6

7

8

9

CLK

D7

VIN

f_IN= 12.5kHz

27

26

25

24

23

22

21

20

19

VREF-

AVDD

AGND

AVDD

1/2R

D6

D5

D4

1/4R

DVDD

DGND

3/4R

AVDD

AGND

10 D3

D2

AVDD 18

11

12

13

14

D1

VREF+

CE1

17

16

15

0.01µF

D0

1µF

OVF

CE2

GND

Spec Number 512023

6-15


型号：	HI-5700/883
厂家：	Intersil
描述：	8-Bit, 20 MSPS Flash A/D Converter 8位， 20 MSPS的Flash A / D转换器转换器
文件：	总8页 (文件大小：658K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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