AUIRF7309QTR [INFINEON]

Advanced Planar Technology Low On-Resistance; 高级平面技术低导通电阻
AUIRF7309QTR
型号: AUIRF7309QTR
厂家: Infineon    Infineon
描述:

Advanced Planar Technology Low On-Resistance
高级平面技术低导通电阻

文件: 总14页 (文件大小:293K)
中文:  中文翻译
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PD - 97655A  
AUTOMOTIVE GRADE  
AUIRF7309Q  
Features  
l AdvancedPlanarTechnology  
l LowOn-Resistance  
l Dual N and P Channel MOSFET  
l Dynamic dV/dT Rating  
l 150°COperatingTemperature  
l Fast Switching  
l Lead-Free,RoHSCompliant  
l AutomotiveQualified*  
HEXFET® Power MOSFET  
N-CHANNEL MOSFET  
N-CH P-CH  
1
8
D1  
D1  
S1  
2
7
G1  
V(BR)DSS  
RDS(on) max.  
ID  
30V  
0.05  
-30V  
0.10  
3
4
6
5
S2  
D2  
D2  
Ω
Ω
G2  
P-CHANNEL MOSFET  
4.7A -3.5A  
Top View  
Description  
Specifically designed for Automotive applications,  
this cellular design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve  
low on-resistance per silicon area. This benefit com-  
bined with the fast switching speed and ruggedized  
device design that HEXFET power MOSFETs are well  
known for, provides the designer with an extremely  
efficient and reliable device for use in Automotive and  
a wide variety of other applications.  
SO-8  
AUIRF7309Q  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings  
only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure  
to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings  
are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Max.  
Parameter  
Units  
N-Channel  
P-Channel  
10 Sec. Pulsed Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
4.7  
-3.5  
I @ TA = 25°C  
D
4
-3.0  
-2.4  
-12  
I @ TA = 25°C  
D
A
3.2  
16  
I @ TA = 70°C  
D
I
DM  
1.4  
W
W/°C  
V
P @TA = 25°C  
Power Dissipation  
D
0.011  
± 20  
Linear Derating Factor  
Gate-to-Source Voltage  
V
GS  
dv/dt  
6.9  
-6.0  
V/ns  
Peak Diode Recovery dv/dt  
Operating Junction and  
T
T
J
-55 to + 150  
°C  
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Junction-to-Ambient (PCB Mount, steady state)  
90  
°C/W  
–––  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
06/23/11  
AUIRF7309Q  
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min.  
30  
-30  
–––  
–––  
–––  
–––  
–––  
–––  
1.0  
Typ.  
–––  
–––  
0.032  
-0.037  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
Max.  
–––  
–––  
–––  
–––  
0.050  
0.080  
0.10  
0.16  
3.0  
-3.0  
–––  
–––  
1.0  
-1.0  
25  
Units  
V
Conditions  
VGS = 0V, ID = 250μA  
VGS = 0V, ID =-250μA  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
V/°C Reference to 25°C, ID = 1mA  
Reference to 25°C, ID = -1mA  
VGS = 10V, ID = 2.4A  
ΔV(BR)DSS/ΔTJ  
Breakdown Voltage Temp. Coefficient  
Static Drain-to-Source On-Resistance  
N-Ch  
P-Ch  
VGS = 4.5V, ID = 2.0A  
Ω
RDS(on)  
VGS = -10V, ID = 1.8A  
VGS = -4.5V, ID = 1.5A  
V
S
V
V
DS = VGS, ID = 250μA  
DS = VGS, ID = -250μA  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-P  
VGS(th)  
gfs  
Gate Threshold Voltage  
-1.0  
5.2  
2.5  
VDS = 15V, ID = 2.4A  
VDS = -24V, ID = -1.8A  
Forward Transconductance  
–––  
–––  
–––  
–––  
–––  
–––  
VDS = 24V, VGS = 0V  
VDS = -24V, VGS = 0V  
VDS = 24V, VGS = 0V, TJ = 125°C  
VDS = -24V, VGS = 0V, TJ = 125°C  
VGS = 20V  
μA  
IDSS  
Drain-to-Source Leakage Current  
-25  
-100  
100  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA  
N-P  
VGS = -20V  
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min.  
Typ.  
Max.  
Units  
Conditions  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-P  
–––  
–––  
–––  
–––  
25  
25  
N-Channel  
ID = 2.6A, VDS = 16V, VGS = 4.5V  
Qg  
Total Gate Charge  
nC  
–––  
–––  
–––  
–––  
–––  
–––  
2.9  
2.9  
7.9  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
P-Channel  
ID =-2.2A, VDS =-16V, VGS =-4.5V  
–––  
–––  
–––  
–––  
–––  
6.8  
11  
9.0  
–––  
–––  
–––  
N-Channel  
VDD= 10V, ID = 2.6A RG = 6.0Ω  
RD = 3.8Ω  
21  
ns  
–––  
–––  
–––  
–––  
17  
22  
25  
7.7  
–––  
–––  
–––  
–––  
P-Channel  
VDD=-10V, ID =-2.2A RG = 6.0Ω  
td(off)  
Turn-Off Delay Time  
RD = 4.5Ω  
tf  
Fall Time  
–––  
–––  
18  
4.0  
–––  
–––  
LD  
Internal Drain Inductance  
Between lead,  
nH  
pF  
6mm (0.25in.)  
from package  
LS  
Internal Source Inductance  
N-P  
–––  
6.0  
–––  
and center of die contact  
N-Channel  
VGS = 0V, VDS = 15V, ƒ = 1.0MHz  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
–––  
–––  
520  
440  
–––  
–––  
Ciss  
Coss  
Crss  
Input Capacitance  
–––  
–––  
–––  
180  
200  
72  
–––  
–––  
–––  
Output Capacitance  
P-Channel  
VGS = 0V, VDS = -15V, ƒ = 1.0MHz  
Reverse Transfer Capacitance  
–––  
93  
–––  
Diode Characteristics  
Parameter  
Min.  
Typ.  
Max.  
Units  
Conditions  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
–––  
–––  
1.8  
Continuous Source Current  
(Body Diode)  
IS  
–––  
–––  
–––  
–––  
–––  
–––  
-1.8  
16  
A
Pulsed Source Current  
Diode)  
(Body  
ISM  
-12  
–––  
–––  
–––  
–––  
1.0  
-1.0  
V
TJ = 25°C, IS = 1.8A, VGS = 0V  
TJ = 25°C, IS = -1.8A, VGS = 0V  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
–––  
–––  
47  
53  
71  
80  
ns  
nC  
N-Channel  
TJ = 25°C,IF =2.6A, di/dt = 100A/μs  
–––  
–––  
56  
66  
84  
99  
P-Channel  
TJ = 25°C,IF =-2.2A, di/dt = 100A/μs  
Qrr  
Reverse Recovery Charge  
Forward Turn-On Time  
t
N-P Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes:  
 Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 23 )  
‚ N-Channel ISD 2.4A, di/dt 73A/µs, VDD V(BR)DSS, TJ 150°C.  
P-Channel ISD -1.8A, di/dt 90A/µs, VDD V(BR)DSS, TJ 150°C.  
ƒ Pulse width 300µs; duty cycle 2%.  
„ When mounted on 1” square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to  
application note #AN-994.  
2
www.irf.com  
AUIRF7309Q  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive qualification. IR’s  
Industrial and Consumer qualification level is granted by extension of the  
higher Automotive level.  
Moisture Sensitivity Level  
SO-8  
MSL1  
N-CH: Class M2 (+/- 150V)†††  
Machine Model  
P-CH: Class M2 (+/- 150V)†††  
AEC-Q101-002  
N-CH: Class H1A (+/- 500V)†††  
Human Body Model  
P-CH: Class H0 (+/- 250V)†††  
ESD  
AEC-Q101-001  
N-CH: Class C5 (+/- 2000V)†††  
P-CH: Class C5 (+/- 2000V)†††  
Charged Device  
Model  
AEC-Q101-005  
Yes  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions to AEC-Q101 requirements are noted in the qualification report.  
††† Highest passing voltage.  
www.irf.com  
3
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AUIRF7309Q  
Peak Diode Recovery dv/dt Test Circuit  
+
Circuit Layout Considerations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
+
-
-
+
dv/dt controlled by RG  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
+
-
* Reverse Polarity for P-Channel  
** Use P-Channel Driver for P-Channel Measurements  
Driver Gate Drive  
P.W.  
Period  
Period  
D =  
P.W.  
V
=10V  
GS  
D.U.T. I Waveform  
SD  
Reverse  
Recovery  
Current  
Body Diode Forward  
Current  
di/dt  
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  
V
DD  
Re-Applied  
Voltage  
Body Diode  
Forward Drop  
Inductor Curent  
I
SD  
Ripple 5%  
*** VGS = 5.0V for Logic Level and 3V Drive Devices  
Fig 24. For N and P Channel HEXFETS  
10  
www.irf.com  
AUIRF7309Q  
SO-8 Package Outline  
Dimensions are shown in millimeters (inches)  
SO-8 Part Marking  
F7309Q  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
11  
AUIRF7309Q  
SO-8 Tape and Reel  
Dimensions are shown in millimeters (inches)  
TERMINAL NUMBER 1  
12.3 ( .484 )  
11.7 ( .461 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
NOTES:  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
330.00  
(12.992)  
MAX.  
14.40 ( .566 )  
12.40 ( .488 )  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
12  
www.irf.com  
AUIRF7309Q  
Ordering Information  
Base part  
number  
Package Type  
Standard Pack  
Complete Part Number  
Form  
Tube  
Quantity  
95  
AUIRF7309Q  
SO-8  
AUIRF7309Q  
Tape and Reel  
4000  
AUIRF7309QTR  
www.irf.com  
13  
AUIRF7309Q  
IMPORTANT NOTICE  
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the  
right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time  
and to discontinue any product or services without notice. Part numbers designated with the “AU” prefix follow automotive industry  
and / or customer specific requirements with regards to product discontinuance and process change notification. All products are  
sold subject to IR’s terms and conditions of sale supplied at the time of order acknowledgment.  
IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with IR’s  
standard warranty. Testing and other quality control techniques are used to the extent IR deems necessary to support this warranty.  
Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
IR assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using IR components. To minimize the risks with customer products and applications, customers should provide  
adequate design and operating safeguards.  
Reproduction of IR information in IR data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alterations is  
an unfair and deceptive business practice. IR is not responsible or liable for such altered documentation. Information of third parties  
may be subject to additional restrictions.  
Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for that product or service  
voids all express and any implied warranties for the associated IR product or service and is an unfair and deceptive business  
practice. IR is not responsible or liable for any such statements.  
IR products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,  
or in other applications intended to support or sustain life, or in any other application in which the failure of the IR product could  
create a situation where personal injury or death may occur. Should Buyer purchase or use IR products for any such unintended  
or unauthorized application, Buyer shall indemnify and hold International Rectifier and its officers, employees, subsidiaries,  
affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,  
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim  
alleges that IR was negligent regarding the design or manufacture of the product.  
IR products are neither designed nor intended for use in military/aerospace applications or environments unless the IR products  
are specifically designated by IR as military-grade or “enhanced plastic.” Only products designated by IR as military-grade meet  
military specifications. Buyers acknowledge and agree that any such use of IR products which IR has not designated as military-  
grade is solely at the Buyer’s risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless the specific IR products  
are designated by IR as compliant with ISO/TS 16949 requirements and bear a part number including the designation “AU”. Buyers  
acknowledge and agree that, if they use any non-designated products in automotive applications, IR will not be responsible for any  
failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLD HEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
14  
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