STB20NE06T4 [ETC]

TRANSISTOR | MOSFET | N-CHANNEL | 60V V(BR)DSS | 20A I(D) | TO-263AB ; 晶体管| MOSFET | N沟道| 60V V( BR ) DSS | 20A I( D) | TO- 263AB\n
STB20NE06T4
型号: STB20NE06T4
厂家: ETC    ETC
描述:

TRANSISTOR | MOSFET | N-CHANNEL | 60V V(BR)DSS | 20A I(D) | TO-263AB
晶体管| MOSFET | N沟道| 60V V( BR ) DSS | 20A I( D) | TO- 263AB\n

晶体 晶体管 开关 脉冲
文件: 总8页 (文件大小:87K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
STB20NE06  
2
N-CHANNEL 60V - 0.06- 20A D PAK  
STripFET POWER MOSFET  
V
R
DS(on)  
I
TYPE  
DSS  
D
STB20NE06  
60 V  
<0.080 Ω  
20 A  
TYPICAL RDS(on) = 0.06 Ω  
EXCEPTIONAL dv/dt CAPABILITY  
100% AVALANCHE TESTED  
o
LOW GATE CHARGE 100 C  
3
1
APPLICATION ORIENTED  
CHARACTERIZATION  
2
D PAK  
TO-263  
(suffix“T4”)  
FOR THROUGH-HOLEVERSION CONTACT  
SALES OFFICE  
DESCRIPTION  
This Power Mosfet is the latest development of  
STMicroelectronis unique “Single Feature Size  
strip-based process. The resulting transistor  
shows extremely high packing density for low on-  
resistance, rugged avalance characteristics and  
less critical alignment steps therefore a remark-  
able manufacturing reproducibility.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
DC MOTOR CONTROL  
DC-DC & DC-AC CONVERTERS  
SYNCHRONOUS RECTIFICATION  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
Unit  
V
V
Drain-source Voltage (V = 0)  
60  
DS  
GS  
V
Drain-gate Voltage (R = 20 k)  
60  
±20  
20  
V
DGR  
GS  
V
Gate- source Voltage  
V
GS  
I
Drain Current (continuos) at T = 25°C  
A
D
D
C
I
Drain Current (continuos) at T = 100°C  
14  
A
C
I
()  
DM  
Drain Current (pulsed)  
80  
A
P
Total Dissipation at T = 25°C  
70  
W
tot  
C
Derating Factor  
0.47  
7
W/°C  
V/ns  
°C  
°C  
(1)  
Peak Diode Recovery voltage slope  
Storage Temperature  
dv/dt  
T
stg  
–60 to 175  
175  
T
Max. Operating Junction Temperature  
j
()Pulse width limited by safe operating area.  
(1)I  
20A, di/dt 300A/µs, V V  
, T T  
(BR)DSS j JMAX.  
SD  
DD  
December 2000  
1/8  
STB20NE06  
THERMAL DATA  
R
Thermal Resistance Junction-case  
Max  
Max  
Typ  
2.14  
62.5  
0.5  
°C/W  
°C/W  
°C/W  
°C  
thj-case  
R
Thermal Resistance Junction-ambient  
Thermal Resistance Case-sink  
thj-amb  
thc-sink  
R
T
Maximum Lead Temperature For Soldering Purpose  
300  
j
AVALANCHE CHARACTERISTICS  
Symbol  
Parameter  
Max Value  
Unit  
I
Avalanche Current, Repetitive or Not-Repetitive  
AR  
20  
A
(pulse width limited by T max)  
j
E
Single Pulse Avalanche Energy  
AS  
100  
mJ  
(starting T = 25 °C, I = I , V = 25 V)  
j
D
AR  
DD  
ELECTRICAL CHARACTERISTICS (T  
= 25 °C unless otherwise specified)  
case  
OFF  
Symbol  
Parameter  
Drain-source  
Test Conditions  
= 250 µA = 0  
Min.  
Typ.  
Max.  
Unit  
V
I
V
GS  
60  
V
(BR)DSS  
D
Breakdown Voltage  
I
Zero Gate Voltage  
V
V
= Max Rating  
1
10  
µA  
µA  
DSS  
DS  
DS  
Drain Current (V = 0)  
= Max Rating T = 125 °C  
GS  
C
I
Gate-body Leakage  
V
= ± 20 V  
±100  
nA  
GSS  
GS  
Current (V = 0)  
DS  
(*)  
ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
3
Max.  
4
Unit  
V
V
Gate Threshold Voltage  
V
V
= V  
I
I
= 250 µA  
2
GS(th)  
DS(on)  
DS  
GS  
GS  
D
D
I
Static Drain-source On Resis-  
tance  
= 10 V  
= 10 A  
0.060  
0.080  
I
On State Drain Current  
V
V
> I  
x R  
DS(on)max  
20  
A
D(on)  
DS  
GS  
D(on)  
= 10 V  
DYNAMIC  
Symbol  
Parameter  
Test Conditions  
x R I =10A  
Min.  
Typ.  
Max.  
Unit  
(*)  
g
fs  
Forward Transconductance  
V
V
>I  
5
9
S
DS D(on)  
DS(on)max D  
C
oss  
Input Capacitance  
Output Capacitance  
Reverse Transfer  
Capacitances  
= 25V f = 1 MHz  
V = 0  
GS  
900  
125  
35  
pF  
pF  
pF  
iss  
DS  
C
C
rss  
2/8  
STB20NE06  
ELECTRICAL CHARACTERISTICS (continued)  
SWITCHING ON  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
t
Turn-on Delay Time Rise Time  
V
= 30 V  
I
D
GS  
= 10 A  
= 10 V  
20  
45  
ns  
ns  
d(on)  
DD  
t
R
G
= 4.7 Ω  
V
r
(see test circuit, Figure 3)  
Q
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
V
=48V I =20A  
V =10V  
GS  
25  
10  
6
34  
nC  
nC  
nC  
g
DD  
D
Q
gs  
Q
gd  
SWITCHING OFF  
Symbol  
Parameter  
Test Conditions  
= 48 V  
Min.  
Min.  
Typ.  
Max.  
Unit  
t
Off-voltage Rise Time  
Fall Time  
Cross-over Time  
V
I
= 20 A  
V = 10 V  
GS  
8
25  
37  
ns  
ns  
ns  
r(Voff)  
DD  
D
t
t
R
G
= 4.7  
r
c
(see test circuit, Figure 5)  
SOURCE DRAIN DIODE  
Symbol  
Parameter  
Test Conditions  
Typ.  
Max.  
Unit  
I
Source-drain Current  
Source-drain Current (pulsed)  
20  
80  
A
A
SD  
()  
I
SDM  
V
(*)  
Forward On Voltage  
I
I
= 20 A  
=20 A  
V = 0  
GS  
1.5  
V
SD  
SD  
SD  
t
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
di/dt = 100 A/µs  
T = 150 °C  
50  
115  
4.5  
ns  
µC  
A
rr  
Q
V
= 30 V  
rr  
RRM  
DD  
j
I
(see test circuit, Figure 5)  
(*)Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.  
()Pulse width limited by safe operating area.  
Safe Operating Area  
Thermal Impedance  
3/8  
STB20NE06  
Output Characteristics  
Transfer Characteristics  
Transconductance  
Static Drain-source On Resistance  
Gate Charge vs Gate-source Voltage  
Capacitance Variations  
4/8  
STB20NE06  
Normalized Gate Threshold Voltage vs  
Temperature  
Normalized On Resistance vs Temperature  
Source-drain Diode Forward Characteristics  
5/8  
STB20NE06  
Fig. 1: Unclamped Inductive Load Test Circuit  
Fig. 2: Unclamped Inductive Waveform  
Fig. 3: Switching Times Test Circuits ForResistive  
Fig. 4: Gate Charge test Circuit  
Load  
Fig. 5: Test Circuit For Inductive Load Switching  
And Diode Recovery Times  
6/8  
STB20NE06  
2
D PAK MECHANICAL DATA  
mm.  
inch  
DIM.  
MIN.  
4.4  
TYP  
MAX.  
4.6  
MIN.  
0.173  
0.098  
0.001  
0.027  
0.044  
0.017  
0.048  
0.352  
TYP.  
MAX.  
0.181  
0.106  
0.009  
0.036  
0.067  
0.023  
0.053  
0.368  
A
A1  
A2  
B
2.49  
0.03  
0.7  
2.69  
0.23  
0.93  
1.7  
B2  
C
1.14  
0.45  
1.23  
8.95  
0.6  
C2  
D
1.36  
9.35  
D1  
E
8
0.315  
0.334  
10  
10.4  
0.393  
E1  
G
8.5  
4.88  
15  
5.28  
15.85  
1.4  
0.192  
0.590  
0.050  
0.055  
0.094  
0.208  
0.625  
0.055  
0.068  
0.126  
L
L2  
L3  
M
1.27  
1.4  
1.75  
3.2  
2.4  
R
0.4  
0.015  
V2  
0º  
8º  
7/8  
STB20NE06  
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences  
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted  
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject  
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not  
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.  
The ST logo is registered trademark of STMicroelectronics  
2000 STMicroelectronics - All Rights Reserved  
All other names are the property of their respective owners.  
STMicroelectronics GROUP OF COMPANIES  
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -  
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.  
http://www.st.com  
8/8  

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