DMN3020UFDF-13 [DIODES]

Small Signal Field-Effect Transistor,;
DMN3020UFDF-13
型号: DMN3020UFDF-13
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Small Signal Field-Effect Transistor,

文件: 总7页 (文件大小:435K)
中文:  中文翻译
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DMN3020UFDF  
30V N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
0.6mm Profile Ideal for Low Profile Applications  
PCB Footprint of 4mm2  
ID Max  
BVDSS  
RDS(ON) Max  
TC = +25°C  
Low Gate Threshold Voltage  
19m@ VGS = 4.5V  
25mΩ @ VGS = 2.5V  
40mΩ @ VGS = 1.8V  
120mΩ @ VGS = 1.5V  
15A  
14A  
10A  
6A  
Fast Switching Speed  
ESD Protected Gate  
30V  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Mechanical Data  
Description  
Case: U-DFN2020-6 (Type F)  
This MOSFET is designed to minimize the on-state resistance  
(RDS(ON)) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Case Material: Molded Plastic, ―Green‖ Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish NiPdAu over Copper Leadframe.  
Battery Management Application  
Power Management Functions  
DC-DC Converters  
e4  
Solderable per MIL-STD-202, Method 208  
Weight: 0.007 Grams (Approximate)  
U-DFN2020-6 (Type F)  
D
S
G
ESD PROTECTED  
Gate Protection  
Diode  
Pin Out  
Bottom View  
Top View  
Bottom View  
Internal Schematic  
Ordering Information (Note 4)  
Part Number  
DMN3020UFDF-7  
DMN3020UFDF-13  
Case  
Packaging  
3,000/Tape & Reel  
10,000/Tape & Reel  
U-DFN2020-6 (Type F)  
U-DFN2020-6 (Type F)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.  
Marking Information  
2F = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: D = 2016)  
2F  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2015  
2016  
2017  
2018  
2019  
2020  
2021  
2022  
Code  
C
D
E
F
G
H
I
J
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 7  
www.diodes.com  
February 2016  
© Diodes Incorporated  
DMN3020UFDF  
Datasheet number: DS38208 Rev. 2 - 2  
DMN3020UFDF  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
30  
Unit  
V
Gate-Source Voltage  
±12  
V
VGSS  
Steady  
State  
TC = +25°C  
15  
13  
A
A
ID  
TC = +70°C  
TA = +25°C  
TA = +70°C  
Continuous Drain Current (Note 6) VGS = 4.5V  
10.4  
8.3  
t<5s  
ID  
Pulsed Drain Current (380μs Pulse, Duty Cycle = 1%)  
Continuous Source-Drain Diode Current (Note 6)  
Avalanche Current (Note 7) L = 0.1mH  
40  
2.2  
17  
15  
A
A
IDM  
TA = +25°C  
IS  
IAS  
A
Avalanche Energy (Note 7) L = 0.1mH  
mJ  
EAS  
Thermal Characteristics  
Characteristic  
Symbol  
Value  
0.73  
Unit  
TA = +25°C  
Total Power Dissipation (Note 5)  
W
PD  
RθJA  
PD  
0.47  
171  
112  
2.03  
1.30  
63  
TA = +70°C  
Steady State  
t<5s  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
TA = +25°C  
TA = +70°C  
Steady State  
t<5s  
Thermal Resistance, Junction to Ambient (Note 6)  
RθJA  
40  
18  
°C/W  
°C  
Thermal Resistance, Junction to Case  
Steady State  
RθJC  
Operating and Storage Temperature Range  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
30  
1
V
BVDSS  
IDSS  
VGS = 0V, ID = 250μA  
VDS = 30V, VGS = 0V  
VGS = ±10V, VDS = 0V  
µA  
µA  
Zero Gate Voltage Drain Current TJ = +25°C  
Gate-Source Leakage  
±10  
IGSS  
ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
0.4  
0.6  
16  
19  
26  
32  
0.6  
1.0  
19  
V
mΩ  
V
VGS(TH)  
RDS(ON)  
VSD  
VDS = VGS, ID = 250μA  
VGS = 4.5V, ID = 4.5A  
VGS = 2.5V, ID = 3.5A  
VGS = 1.8V, ID = 2.0A  
VGS = 1.5V, ID = 1.0A  
VGS = 0V, IS = 1.0A  
25  
Static Drain-Source On-Resistance  
40  
120  
1.2  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
1304  
87  
Ciss  
Coss  
Crss  
Rg  
VDS = 15V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
80  
Reverse Transfer Capacitance  
Gate Resistance  
1.3  
15  
VDS = 0V, VGS = 0V, f = 1MHz  
Total Gate Charge (VGS = 4.5V)  
Total Gate Charge (VGS = 8V)  
Gate-Source Charge  
Qg  
27  
Qg  
nC  
ns  
VDS = 15V, ID = 4.5A  
2.0  
2.1  
4.1  
4.8  
20.5  
3.2  
7.1  
1.7  
Qgs  
Qgd  
tD(ON)  
tR  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
VDS = 15V, VGS = 4.5V,  
RG = 1, ID = 4.5A  
Turn-Off Delay Time  
tD(OFF)  
tF  
Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
tRR  
IF = 1.0A, di/dt = 100A/μs  
nC  
QRR  
Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. I and E ratings are based on low frequency and duty cycles to keep T = +25°C.  
AS AS  
J
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
2 of 7  
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February 2016  
© Diodes Incorporated  
DMN3020UFDF  
Datasheet number: DS38208 Rev. 2 - 2  
DMN3020UFDF  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
25  
20  
15  
10  
5
VDS = 5V  
VGS = 4.5V  
VGS = 3.0V  
VGS = 2.5V  
VGS = 1.8V  
VGS = 1.5V  
85oC  
25oC  
125oC  
150oC  
VGS = 1.2V  
-55oC  
0
0.0  
0.5  
0.8  
1.1  
1.4  
1.7  
2
0
0.5  
1
1.5  
2
2.5  
3
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.022  
0.02  
0.1  
0.08  
0.06  
0.04  
0.02  
0
ID = 4.5A  
VGS = 2.5V  
0.018  
0.016  
0.014  
0.012  
ID = 2.0A  
VGS = 4.5V  
0
5
10  
15  
20  
25  
30  
0
2
4
6
8
ID, DRAIN-SOURCE CURRENT (A)  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
Figure 4. Typical Transfer Characteristic  
0.04  
0.035  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
1.8  
1.6  
1.4  
1.2  
1
VGS = 4.5V  
VGS = 4.5V, ID = 4.5A  
150oC  
125oC  
85oC  
25oC  
VGS = 2.5V, ID = 3.5A  
-55oC  
0.8  
0.6  
0
5
10  
15  
20  
25  
30  
-50 -25  
TJ, JUNCTION TEMPERATURE ()  
Figure 6. On-Resistance Variation with Temperature  
0
25  
50  
75 100 125 150  
ID, DRAIN CURRENT (A)  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
3 of 7  
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February 2016  
© Diodes Incorporated  
DMN3020UFDF  
Datasheet number: DS38208 Rev. 2 - 2  
DMN3020UFDF  
0.035  
0.03  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
ID = 1mA  
0.025  
0.02  
VGS = 2.5V, ID = 3.5A  
ID = 250µA  
0.015  
0.01  
VGS = 4.5V, ID = 4.5A  
-50 -25  
0
25  
50  
75 100 125 150  
-50 -25  
0
25  
50  
75 100 125 150  
TJ, JUNCTION TEMPERATURE ()  
TJ, JUNCTION TEMPERATURE ()  
Figure 7. On-Resistance Variation with Temperature  
Figure 8. Gate Threshold Variation vs. Temperature  
30  
25  
20  
15  
10  
5
100000  
10000  
1000  
100  
VGS = 0V  
150oC  
125oC  
85oC  
TA = 85oC  
10  
TA = 25oC  
TA = -55oC  
TA = 125oC  
TA = 150oC  
1
25oC  
0
0.1  
0
0.3  
0.6  
0.9  
1.2  
1.5  
0
4
8
12  
16  
20  
VDS, DRAIN-SOURCE VOLTAGE (V)  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 10. Typical Drain-Source Leakage Current vs.  
Voltage  
Figure 9. Diode Forward Voltage vs. Current  
10000  
1000  
100  
8
6
4
2
0
f=1MHz  
Ciss  
Coss  
Crss  
VDS = 15V, ID = 4.5A  
10  
0
4
8
12  
16  
20  
24  
28  
0
5
10  
15  
20  
25  
30  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 11. Typical Junction Capacitance  
Qg (nC)  
Figure 12. Gate Charge  
4 of 7  
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February 2016  
© Diodes Incorporated  
DMN3020UFDF  
Datasheet number: DS38208 Rev. 2 - 2  
DMN3020UFDF  
100  
10  
PW =100µs  
RDS(ON) Limited  
1
PW =1ms  
PW =10ms  
PW =100ms  
TJ(Max) = 150  
TA = 25℃  
0.1  
0.01  
PW =1s  
PW =10s  
Single Pulse  
DUT on 1*MRP Board  
VGS= 4.5V  
DC  
10  
0.01  
0.1  
1
100  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 13. SOA, Safe Operation Area  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
RθJA(t) = r(t) * RθJA  
RθJA = 171/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 14. Transient Thermal Resistance  
5 of 7  
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February 2016  
© Diodes Incorporated  
DMN3020UFDF  
Datasheet number: DS38208 Rev. 2 - 2  
DMN3020UFDF  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
U-DFN2020-6 (Type F)  
U-DFN2020-6  
(Type F)  
Min Max  
0.570.63  
0.00 0.05  
A3  
A1  
Dim  
A
A1  
A3  
b
Typ  
0.60  
0.03  
0.15  
0.30  
2.00  
0.95  
0.38  
2.00  
1.15  
0.70  
A
Seating Plane  
-
-
0.25 0.35  
1.95 2.05  
0.85 1.05  
D
D
D2  
e3  
k2  
e4  
D2a 0.33 0.43  
E
E2  
E2a  
e
1.95 2.05  
1.05 1.25  
0.65 0.75  
0.65 BSC  
D2a  
E2a  
z2  
e2  
e3  
e4  
k
0.863 BSC  
0.70 BSC  
0.325 BSC  
0.37 BSC  
D2  
E
E2  
k1  
k2  
L
0.15 BSC  
0.36 BSC  
0.225 0.325 0.275  
0.20 BSC  
k1  
e2  
L
k
z1  
z
z1  
z2  
0.110 BSC  
0.20 BSC  
e
b
All Dimensions in mm  
z( 4x)  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
U-DFN2020-6 (Type F)  
X3  
Y
C
X
Value  
Dimensions  
(in mm)  
C
X
0.650  
0.400  
0.480  
0.950  
1.700  
0.425  
0.800  
1.150  
1.450  
2.300  
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y2  
Y1 Y4  
X1  
Pin1  
X2  
6 of 7  
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February 2016  
© Diodes Incorporated  
DMN3020UFDF  
Datasheet number: DS38208 Rev. 2 - 2  
DMN3020UFDF  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2016, Diodes Incorporated  
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February 2016  
© Diodes Incorporated  
DMN3020UFDF  
Datasheet number: DS38208 Rev. 2 - 2  

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