AOD402_08 [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOD402_08
型号: AOD402_08
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:250K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOD402  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
TheꢀAOD402ꢀusesꢀadvancedꢀtrenchꢀtechnologyꢀand  
designꢀtoꢀprovideꢀexcellentꢀRDS(ON)ꢀwithꢀlowꢀgate  
charge.ꢀThisꢀdeviceꢀisꢀsuitableꢀforꢀuseꢀinꢀPWM,ꢀlaod  
switchingꢀandꢀgeneralꢀpurposeꢀapplications.  
VDSꢀ(V)ꢀ=ꢀ30V  
IDꢀ=ꢀ18ꢀAꢀꢀ(VGSꢀ=ꢀ20V)  
RDS(ON)ꢀ<ꢀ15ꢀmꢀ(VGSꢀ=ꢀ20V)  
RDS(ON)ꢀ<ꢀ18ꢀmꢀ(VGSꢀ=ꢀ10V)  
RDS(ON)ꢀ<ꢀ44ꢀmꢀ(VGSꢀ=ꢀ4.5V)  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ 100% UIS Tested!  
ꢀꢀꢀꢀꢀꢁRoHSꢀCompliant  
ꢀꢀꢀꢀꢀꢁHalogenꢀFree*  
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
100% Rg Tested!  
TO-252  
D-PAK  
Bottom View  
Top View  
D
D
G
S
G
S
S
G
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
DrainꢁSourceꢀVoltage  
GateꢁSourceꢀVoltage  
VDS  
30  
±25  
18  
V
V
VGS  
TC=25°C  
ContinuousꢀDrain  
CurrentꢀG  
TC=100°C  
ID  
12  
A
PulsedꢀDrainꢀCurrentꢀC  
AvalancheꢀCurrentꢀC  
RepetitiveꢀavalancheꢀenergyꢀL=0.1mHꢀC  
IDM  
IAR  
EAR  
40  
18  
A
40  
mJ  
TC=25°C  
PowerꢀDissipationꢀB  
TC=100°C  
60  
PD  
W
30  
TA=25°C  
2.5  
PDSM  
W
PowerꢀDissipationꢀA  
1.6  
TA=70°C  
JunctionꢀandꢀStorageꢀTemperatureꢀRange  
TJ,ꢀTSTG  
ꢁ55ꢀtoꢀ175  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
16.7  
40  
Max  
25  
50  
Units  
°C/W  
°C/W  
°C/W  
MaximumꢀJunctionꢁtoꢁAmbientꢀA  
tꢀꢀ≤ꢀ10s  
SteadyꢁState  
SteadyꢁState  
RθJA  
MaximumꢀJunctionꢁtoꢁAmbientꢀA  
MaximumꢀJunctionꢁtoꢁCaseꢀB  
RθJC  
1.9  
2.5  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOD402  
Electrical Characteristics (T=25°C unless otherwise noted)  
J
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
30  
V
VDS=24V, VGS=0V  
1
IDSS  
Zero Gate Voltage Drain Current  
µA  
5
TJ=55°C  
V
DS=0V, VGS=±25V  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
100  
3
nA  
V
VDS=VGS, ID=250µA  
VGS=10V, VDS=5V  
VGS=20V, ID=18A  
VGS(th)  
ID(ON)  
1
2.4  
40  
A
12  
17.4  
15  
15  
21  
18  
44  
mΩ  
TJ=125°C  
RDS(ON)  
Static Drain-Source On-Resistance  
VGS=10V, ID=18A  
VGS=4.5V, ID=6A  
VDS=5V, ID=18A  
IS=18A, VGS=0V  
36  
mΩ  
S
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
24  
0.8  
1
V
Maximum Body-Diode Continuous Current  
18  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
769  
185  
131  
0.7  
pF  
pF  
pF  
VGS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
VGS=0V, VDS=0V, f=1MHz  
VGS=10V, VDS=10V, ID=18A  
SWITCHING PARAMETERS  
Qg(10V)  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
15.9  
2.44  
4.92  
6.2  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
VGS=10V, VDS=15V, ID=18A,  
10.9  
16  
RL=0.82, RGEN=3Ω  
tD(off)  
tf  
4.8  
IF=18A, dI/dt=100A/µs  
IF=18A, dI/dt=100A/µs  
trr  
18  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
Qrr  
8.1  
nC  
A: The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any a given application  
depends on the user's specific board design, and the maximum temperature fo 175°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA  
curve provides a single pulse rating.  
G. The maximum current rating is limited by bond-wires.  
*This device is guaranteed green after data code 8X11 (Sep 1ST 2008).  
Rev4: Oct 2008  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOD402  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
40  
30  
10V  
6V  
7V  
35  
30  
25  
20  
15  
10  
5
25  
20  
15  
10  
5
VDS=5V  
5V  
125°C  
4.5V  
VGS=4V  
25°C  
4.5  
3.5V  
0
0
2
2.5  
3
3.5  
4
5
5.5  
0
1
2
3
4
5
VGS(Volts)  
V
DS (Volts)  
Figure 2: Transfer Characteristics  
Fig 1: On-Region Characteristics  
60  
1.8  
50  
40  
30  
20  
10  
0
1.6  
1.4  
1.2  
1
VGS=10V, 18A  
VGS=4.5V  
VGS=20V,18A  
VGS=10V  
VGS=20V  
0
5
10  
15  
20  
25  
30  
0.8  
0
25  
50  
75  
100  
125  
150  
175  
ID (A)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction  
Temperature  
60  
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
50  
40  
30  
20  
10  
0
ID=18A  
125°C  
125°C  
25°C  
25°C  
4
8
12  
16  
20  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
VSD (Volts)  
Figure 6: Body-Diode Characteristics  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOD402  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1200  
10  
8
VDS=15V  
ID=18A  
1000  
800  
600  
400  
200  
0
Ciss  
6
Coss  
4
2
Crss  
0
0
4
8
12  
16  
20  
0
5
10  
15  
DS (Volts)  
20  
25  
30  
Qg (nC)  
V
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
100.0  
10.0  
1.0  
60  
50  
40  
30  
20  
10  
0
TJ(Max)=150°C, TA=25°C  
TJ(Max)=150°C  
TA=25°C  
RDS(ON)  
limited  
1ms  
10ms  
0.1s  
100µs  
1s  
10s  
DC  
10  
0.1  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.1  
1
100  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
VDS (Volts)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.Rθ  
JA  
RθJA=50°C/W  
0.1  
PD  
0.01  
Single Pulse  
Ton  
T
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOD402  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
10%  
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  

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