AOD405L [ETC]

P-Channel Enhancement Mode Field Effect Transistor; P沟道增强型场效应晶体管
AOD405L
型号: AOD405L
厂家: ETC    ETC
描述:

P-Channel Enhancement Mode Field Effect Transistor
P沟道增强型场效应晶体管

晶体 晶体管 场效应晶体管
文件: 总4页 (文件大小:140K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Rev 3: Sept 2004  
AOD405, AOD405L (Green Product)  
P-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOD405 uses advanced trench technology to  
provide excellent RDS(ON), low gate charge and low  
gate resistance. With the excellent thermal resistance  
of the DPAK package, this device is well suited for  
high current load applications. AOD405L (Green  
Product) is offered in a lead-free package.  
VDS (V) = -30V  
ID = -18A  
RDS(ON) < 32m(VGS = -10V)  
RDS(ON) < 60m(VGS = -4.5V)  
TO-252  
D-PAK  
D
Top View  
Drain Connected to  
Tab  
G
S
G
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
V
VDS  
Drain-Source Voltage  
-30  
VGS  
Gate-Source Voltage  
Continuous Drain  
Current B,G  
±20  
-18  
-18  
V
TA=25°C G  
TA=100°C G  
ID  
A
IDM  
IAR  
EAR  
Pulsed Drain Current  
-40  
-18  
40  
60  
Avalanche Current C  
A
mJ  
Repetitive avalanche energy L=0.1mH C  
TC=25°C  
PD  
W
Power Dissipation B  
TC=100°C  
30  
TA=25°C  
TA=70°C  
2.5  
1.6  
PDSM  
W
Power Dissipation A  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
16.7  
40  
Max  
25  
50  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
Steady-State  
Steady-State  
RθJA  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Case C  
RθJL  
1.9  
2.5  
Alpha & Omega Semiconductor, Ltd.  
AOD405, AOD405L  
Electrical Characteristics (T =25°C unless otherwise noted)  
J
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=-250µA, VGS=0V  
-30  
V
VDS=-24V, VGS=0V  
-0.003  
-1  
-5  
IDSS  
Zero Gate Voltage Drain Current  
µA  
TJ=55°C  
IGSS  
VGS(th)  
ID(ON)  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS=±20V  
VDS=VGS ID=-250µA  
VGS=-10V, VDS=-5V  
VGS=-10V, ID=-18A  
±100  
-2.4  
nA  
V
A
-1.2  
-40  
-2  
24.5  
36  
41  
32  
43  
60  
mΩ  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
VGS=-4.5V, ID=-10A  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
Maximum Body-Diode Continuous Current  
V
DS=-5V, ID=-18A  
17  
-0.76  
S
V
A
IS=-1A,VGS=0V  
-1  
-18  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
920  
190  
122  
3.6  
1100  
4.5  
pF  
pF  
pF  
VGS=0V, VDS=-15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
VGS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V)  
Total Gate Charge (10V)  
Total Gate Charge (4.5V)  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
18.7  
9.7  
2.54  
5.4  
9
25  
20  
12  
23  
11.7  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Qg(4.5V)  
VGS=-10V, VDS=-15V, ID=-18A  
Qgs  
Qgd  
tD(on)  
tr  
13  
35  
30  
18  
V
GS=-10V, VDS=-15V, RL=0.82,  
GEN=3Ω  
R
tD(off)  
tf  
trr  
Qrr  
IF=-18A, dI/dt=100A/µs  
IF=-18A, dI/dt=100A/µs  
21.4  
13  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
26  
16  
ns  
nC  
A: The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The  
Power dissipation PDSM is based on steady-state R θJA and the maximum allowed junction temperature of 150°C. The value in any a given  
application depends on the user's specific board design, and the maximum temperature fo 175°C may be used if the PCB or heatsink allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA  
curve provides a single pulse rating.  
G. The maximum current rating is limited by the package current capability.  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE  
Alpha & Omega Semiconductor, Ltd.  
AOD405, AOD405L  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
-4.5V  
-10V  
-6V  
-5V  
VDS=-5V  
-4V  
-3.5V  
125°C  
VGS=-3V  
3
25°C  
3.5  
0
0
0
1
2
4
5
0
0.5  
1
1.5  
2
2.5  
3
4
4.5  
5
-VDS (Volts)  
Fig 1: On-Region Characteristics  
-VGS(Volts)  
Figure 2: Transfer Characteristics  
70  
1.60  
1.40  
1.20  
1.00  
0.80  
65  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
10  
VGS=-4.5V  
ID=-10A  
VGS=-4.5V  
VGS=-10V  
ID=-18A  
VGS=-10V  
0
25  
50  
75  
100  
125  
150  
175  
0
5
10  
15  
20  
25  
Temperature (°C)  
-ID (A)  
Figure 4: On-Resistance vs. Junction  
Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
1.0E-06  
ID=-18A  
125°C  
125°C  
25°C  
25°C  
0.0  
0.2  
0.4  
-VSD (Volts)  
Figure 6: Body-Diode Characteristics  
0.6  
0.8  
1.0  
3
4
5
6
7
8
9
10  
-VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AOD405, AOD405L  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1500  
1.00E+01  
8.00E+00  
6.00E+00  
4.00E+00  
2.00E+00  
0.00E+00  
VDS=-15V  
ID=-18A  
1250  
1000  
750  
500  
250  
0
Ciss  
Coss  
Crss  
0
4
8
12  
-Qg (nC)  
Figure 7: Gate-Charge Characteristics  
16  
20  
0
5
10  
15  
-VDS (Volts)  
20  
25  
30  
Figure 8: Capacitance Characteristics  
100.0  
TJ(Max)=150°C, TA=25°C  
40  
30  
20  
10  
0
TJ(Max)=150°C  
TA=25°C  
10µs  
RDS(ON)  
limited  
1ms  
10.0  
1.0  
100µs  
10ms  
0.1s  
1s  
10s  
DC  
0.1  
0.1  
1
10  
100  
0.001  
0.01  
0.1  
1
10  
100  
1000  
-VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
RθJA=50°C/W  
1
0.1  
P
D  
Ton  
Single Pulse  
T
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Alpha & Omega Semiconductor, Ltd.  

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