AOD406 [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOD406
型号: AOD406
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:114K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOD406  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOD406 uses advanced trench technology to provide  
excellent RDS(ON), shoot-through immunity and body diode  
characteristics. This device is ideally suited for use as a low  
side switch in CPU core power conversion. Standard  
Product AOD406 is Pb-free (meets ROHS & Sony 259  
specifications). AOD406L is a Green Product ordering  
option. AOD406 and AOD406L are electrically identical.  
VDS (V) = 30V  
ID = 85A (VGS = 10V)  
R
DS(ON) < 5.0m(VGS = 10V)  
DS(ON) < 5.7m(VGS = 4.5V)  
R
TO-252  
D-PAK  
D
S
Top View  
Drain Connected  
to Tab  
G
G
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current B,G  
±12  
85  
V
A
TC=25°C G  
TC=100°C B  
ID  
75  
IDM  
IAR  
EAR  
Pulsed Drain Current  
Avalanche Current C  
200  
30  
A
Repetitive avalanche energy L=0.1mH C  
140  
100  
50  
mJ  
TC=25°C  
PD  
W
Power Dissipation B  
TC=100°C  
TA=25°C  
2.5  
PDSM  
W
Power Dissipation A  
TA=70°C  
1.6  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Lead C  
Symbol  
Typ  
14.2  
40  
Max  
20  
Units  
°C/W  
°C/W  
°C/W  
t 10s  
RθJA  
Steady-State  
Steady-State  
50  
RθJL  
0.56  
1.5  
Alpha & Omega Semiconductor, Ltd.  
AOD406  
Electrical Characteristics (T =25°C unless otherwise noted)  
J
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
30  
V
V
DS=24V, VGS=0V  
0.005  
1
IDSS  
Zero Gate Voltage Drain Current  
µA  
5
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±12V  
VDS=VGS ID=250µA  
VGS=4.5V, VDS=5V  
VGS=10V, ID=20A  
100  
1.5  
nA  
V
VGS(th)  
ID(ON)  
0.8  
1.1  
100  
A
4
5
7
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
TJ=125°C  
5.8  
mΩ  
S
V
V
GS=4.5V, ID=20A  
DS=5V, ID=20A  
4.6  
5.7  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
102  
0.64  
IS=1A,VGS=0V  
1
V
Maximum Body-Diode Continuous Current  
85  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
9130 10500  
pF  
pF  
pF  
V
GS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
625  
387  
VGS=0V, VDS=0V, f=1MHz  
0.4  
0.5  
85  
SWITCHING PARAMETERS  
Qg(4.5V)  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
72.4  
13.4  
16.8  
14.7  
14.2  
105.5  
23.5  
30.5  
21  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V
GS=4.5V, VDS=15V, ID=20A  
22  
21  
VGS=10V, VDS=15V, RL=0.75,  
RGEN=3Ω  
tD(off)  
tf  
150  
35  
trr  
IF=20A, dI/dt=100A/µs  
IF=20A, dI/dt=100A/µs  
40  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
nC  
Qrr  
33  
A: The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on steady-state RθJA and the maximum allowed junction temperature of 150°C. The value in any given  
application depends on the user's specific board design, and the maximum temperature fo 175°C may be used if the PCB or heatsink allows it.  
B. The power dissipation P is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
D
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA  
curve provides a single pulse rating.  
G. The maximum current rating is limited by the package current capability. Rev 1: Sept 2005  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE  
Alpha & Omega Semiconductor, Ltd.  
AOD406  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
60  
50  
40  
30  
20  
10  
0
10V  
VDS=5V  
4.5V  
3.0V  
2.5V  
VGS=2V  
125°C  
25°C  
2
0
1
2
3
4
5
0
0.5  
1
1.5  
2.5  
V
DS (Volts)  
VGS(Volts)  
Figure 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
5.0  
4.5  
4.0  
3.5  
3.0  
1.8  
1.6  
1.4  
1.2  
1
VGS=4.5V  
ID=20A  
VGS=4.5V  
VGS=10V  
VGS=10V  
0.8  
0
20  
40  
60  
80  
100  
0
25  
50  
75  
100  
125  
150  
175  
ID (A)  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction  
Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
16  
12  
8
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
ID=20A  
125°C  
125°C  
25°C  
4
25°C  
0
0.0  
0.2  
0.4  
SD (Volts)  
Figure 6: Body-Diode Characteristics  
0.6  
0.8  
1.0  
0
2
4
6
8
10  
V
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AOD406  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
12000  
5
4
3
2
1
0
VDS=15V  
ID=20A  
10000  
8000  
6000  
4000  
2000  
0
Ciss  
Coss  
Crss  
0
10  
20  
30  
40  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
50  
60  
70  
80  
90  
0
5
10  
15  
VDS (Volts)  
20  
25  
30  
Figure 8: Capacitance Characteristics  
1000  
100  
10  
100  
TJ(Max)=150°C  
TA=25°C  
RDS(ON)  
limited  
10µs  
100µs  
80  
60  
40  
20  
0
10ms  
0.1s  
1ms  
1s  
10s  
TJ(Max)=150°C  
TA=25°C  
1
DC  
0.1  
0.01  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
Pulse Width (s)  
VDS (Volts)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=50°C/W  
1
0.1  
PD  
0.01  
Ton  
Single Pulse  
0.001  
T
0.001  
0.00001  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Alpha & Omega Semiconductor, Ltd.  
AOD406  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
120  
100  
80  
60  
40  
20  
0
120  
100  
80  
60  
40  
20  
0
TA=25°C  
LID  
tA  
=
BV VDD  
0.00001  
0.0001  
Time in avalanche, tA (s)  
Figure 12: Single Pulse Avalanche capability  
0.001  
0.01  
0
25  
50  
75  
CASE (°C)  
Figure 13: Power De-rating (Note B)  
100  
125  
150  
175  
T
100  
80  
60  
40  
20  
0
0
25  
50  
75  
CASE (°C)  
Figure 14: Current De-rating (Note B)  
100  
125  
150  
175  
T
Alpha & Omega Semiconductor, Ltd.  

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