AO4494 [AOS]

30V N-Channel MOSFET; 30V N沟道MOSFET
AO4494
型号: AO4494
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

30V N-Channel MOSFET
30V N沟道MOSFET

文件: 总6页 (文件大小:192K)
中文:  中文翻译
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AO4494  
30V N-Channel MOSFET  
General Description  
Product Summary  
VDS (V) = 30V  
ID = 18A  
The AO4494 combines advanced trench MOSFET  
technology with a low resistance package to provide  
extremely low RDS(ON). This device is for PWM  
applications.  
(VGS = 10V)  
(VGS = 10V)  
(VGS = 4.5V)  
RDS(ON) < 6.5m  
RDS(ON) < 9.5mΩ  
100% UIS Tested  
100% Rg Tested  
SOIC-8  
D
Top View  
Bottom View  
D
D
D
D
G
G
S
S
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
30  
±20  
18  
V
V
VGS  
TC=25°C  
TC=70°C  
Continuous Drain  
Current  
ID  
14  
A
Pulsed Drain Current C  
Avalanche Current C  
Repetitive avalanche energy L=0.1mH C  
IDM  
IAR  
130  
32  
A
EAR  
51  
mJ  
TC=25°C  
3.1  
Power Dissipation B  
TC=70°C  
PD  
W
°C  
2
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 150  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
28  
59  
Max  
40  
75  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
Steady-State  
Steady-State  
RθJA  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Lead  
RθJL  
16  
24  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AO4494  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
ID=250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
30  
V
VDS=30V, VGS=0V  
1
5
IDSS  
Zero Gate Voltage Drain Current  
µA  
TJ=125°C  
TJ=125°C  
VDS=0V, VGS= ±20V  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
VGS=10V, ID=18A  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
±100  
2.5  
nA  
V
VGS(th)  
ID(ON)  
1.5  
2
130  
A
5.4  
8.4  
7.5  
70  
6.5  
10.1  
9.5  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
VGS=4.5V, ID=16A  
VDS=5V, ID=18A  
IS=1A,VGS=0V  
mΩ  
S
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
0.75  
1
3
V
Maximum Body-Diode Continuous Current  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1270  
170  
87  
1590  
240  
145  
1.5  
1900  
310  
200  
2.3  
pF  
pF  
pF  
VGS=0V, VDS=15V, f=1MHz  
GS=0V, VDS=0V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
V
0.8  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
Qg(4.5V) Total Gate Charge  
24  
12  
30  
15  
36  
18  
6.2  
11  
nC  
nC  
nC  
nC  
ns  
VGS=10V, VDS=15V, ID=18A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
4.2  
4.7  
5.2  
7.8  
6.7  
3.5  
22.5  
4
V
GS=10V, VDS=15V, RL=0.83,  
ns  
RGEN=3Ω  
tD(off)  
tf  
ns  
ns  
trr  
IF=18A, dI/dt=500A/µs  
IF=18A, dI/dt=500A/µs  
22  
19  
28  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
34  
30  
ns  
Qrr  
24  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends  
on the user's specific board design.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initial  
TJ =25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming  
a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.  
Rev1: Nov. 2010  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AO4494  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
140  
120  
100  
80  
100  
80  
60  
40  
20  
0
10V  
5V  
VDS=5V  
6V  
7V  
4.5V  
4V  
60  
3.5V  
VGS=3V  
4
40  
125°C  
25°C  
4
20  
0
0
1
2
3
5
6
0
1
2
3
5
VGS(Volts)  
VDS (Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
12  
10  
8
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
ID=18A  
VGS=4.5V  
6
VGS=4.5V  
ID=16A  
VGS=10V  
4
0.8  
2
0
25  
50  
75  
100  
125  
150  
175  
0
5
10  
15  
20  
25  
30  
ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage (Note E)  
Figure 4: On-Resistance vs. Junction  
Temperature (Note E)  
25  
20  
15  
10  
5
1.0E+02  
1.0E+01  
ID=18A  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
125°C  
25°C  
25°C  
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
2
4
6
8
10  
V
SD (Volts)  
VGS (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AO4494  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
2200  
2000  
1800  
1600  
1400  
1200  
1000  
800  
10  
Ciss  
VDS=15V  
ID=18A  
8
6
4
600  
Coss  
2
400  
200  
Crss  
0
0
0
5
10  
15  
Qg (nC)  
20  
25  
30  
0
5
10  
15  
VDS (Volts)  
20  
25  
30  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
90.00  
80.00  
70.00  
60.00  
50.00  
40.00  
30.00  
20.00  
1000.0  
100.0  
10.0  
1.0  
TA=25°C  
RDS(ON)  
limited  
10µs  
TA=100°C  
100µs  
TA=150°C  
1ms  
TA=125°C  
10ms  
100ms  
10s  
TJ(Max)=150°C  
TA=25°C  
0.1  
DC  
0.0  
0.1  
1
10  
100  
0.000001  
0.00001  
0.0001  
0.001  
Time in avalanche, tA (s)  
VDS (Volts)  
Figure 12: Single Pulse Avalanche capability  
(Note C)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F  
)
1000  
TA=25°C  
100  
10  
1
0.00001  
0.0001  
0.001  
0.01  
0.1  
Pulse Width (s)  
Figure 15: Single Pulse Power Rating Junction-to-Ambient (Note F)  
1
10  
100  
1000  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AO4494  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
In descending order  
D=Ton/T  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=40°C/W  
1
0.1  
PD  
0.01  
0.001  
Single Pulse  
Ton  
T
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note F)  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AO4494  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  

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