AO4455 [AOS]
Plastic Encapsulated Device; 塑料封装的器件
| 型号： | AO4455 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Plastic Encapsulated Device |
| 文件： | 总3页 (文件大小：78K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOS Semiconductor
Product Reliability Report
AO4455, rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AO4455.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AO4455
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
Product Description
II.
III.
IV.
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AO4455 uses advanced trench technology to provide excellent RDS(ON), and ultra-low low
gate charge with a 25V gate rating. This device is suitable for use as a load switch or in PWM
applications.
-RoHS Compliant
-Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AO4455
Process
Standard sub-micron
30V P-Channel MOSFET
Package Type
Lead Frame
Die Attach
SO8
Cu
Ag epoxy
Bonding
Cu wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO4455
Test Item
Test Condition
Time
Point
Lot
Total
Number
of
Standard
Attribution Sample
size
Failures
0
168hr 85°c
/85%RH +3 cycle
reflow@260°c
-
33 lots
5489pcs
693pcs
JESD22-
A113
MSL
Precondition
168hrs
500 hrs
1000 hrs
0
0
JESD22-
A108
Temp = 150 c,
Vgs=100% of
Vgsmax
HTGB
HTRB
6 lot
3 lot
(Note A*)
77pcs / lot
693pcs
168hrs
500 hrs
1000 hrs
JESD22-
A108
Temp = 150 c,
Vds=80% of
Vdsmax
6 lot
3 lot
(Note A*)
77pcs / lot
1100pcs
96 hrs
20 lots
0
0
0
JESD22-
A110
130c, 85%RH,
33.3 psi, Vgs =
100% of Vgs max
HAST
(Note A*)
24lots
55 pcs / lot
1848pcs
96 hrs
JESD22-
A102
121c, 29.7psi,
RH=100%
Pressure Pot
(Note A*)
33 lots
77 pcs / lot
2541pcs
250 / 500
cycles
JESD22-
A104
-65c to 150c,
air to air
Temperature
Cycle
(Note A*)
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3.82
MTTF = 29919 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AO4455). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)]
= 1.83 x 109 / [2 x (12x77x500 +6x77x1000) x 259] = 3.82
MTTF = 109 / FIT = 2.62 x 108hrs = 29919 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C )
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
32
100 deg C
13
115 deg C
5.64
130 deg C
2.59
150 deg C
1
Af
259
87
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
K = Boltzmann’s constant, 8.617164 X 10-5eV / K
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