AO4456 [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AO4456
型号: AO4456
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 小信号场效应晶体管 开关 光电二极管
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中文:  中文翻译
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AO4456  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AO4456 uses advanced trench technology with a  
monolithically integrated Schottky diode to provide  
excellent RDS(ON),and low gate charge. This device is  
suitable for use as a low side FET in SMPS, load  
switching and general purpose applications. Standard  
Product AO4456 is Pb-free (meets ROHS & Sony  
259 specifications). AO4456 is a Green Product  
ordering option. AO4456 and AO4456 are electrically  
identical.  
VDS (V) = 30V  
ID =20A (VGS = 10V)  
R
DS(ON) < 4.6m(VGS = 10V)  
DS(ON) < 5.6m(VGS = 4.5V)  
R
D
S
S
S
G
D
D
D
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
30  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current A  
±12  
20  
V
TA=25°C  
TA=70°C  
A
IDSM  
IDM  
16  
Pulsed Drain Current B  
120  
TA=25°C  
TA=70°C  
3.1  
PDSM  
W
Power Dissipation  
2.0  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 150  
°C  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Lead C  
Symbol  
Typ  
31  
Max  
40  
Units  
°C/W  
°C/W  
°C/W  
t 10s  
RθJA  
Steady-State  
Steady-State  
59  
75  
RθJL  
16  
24  
Alpha & Omega Semiconductor, Ltd.  
AO4456  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Parameter  
Conditions  
Symbol  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=1mA, VGS=0V  
VDS=24V, VGS=0V  
30  
V
0.008  
9
0.1  
20  
IDSS  
Zero Gate Voltage Drain Current  
mA  
TJ=125°C  
TJ=125°C  
µA  
V
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±12V  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
0.1  
2.4  
VGS(th)  
ID(ON)  
1.4  
1.8  
120  
A
V
GS=10V, ID=20A  
3.8  
5.9  
4.6  
7.4  
5.6  
mΩ  
RDS(ON)  
Static Drain-Source On-Resistance  
mΩ  
S
VGS=4.5V, ID=20A  
VDS=5V, ID=20A  
IS=1A,VGS=0V  
4.5  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
112  
0.37  
0.5  
V
Maximum Body-Diode + Schottky Continuous Current  
5
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
6430  
756  
352  
0.9  
7716  
1.4  
pF  
pF  
pF  
V
GS=0V, VDS=15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
VGS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V)  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
96  
44  
115  
53  
Qg(4.5V)  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
VGS=10V, VDS=15V, ID=20A  
Qgs  
Qgd  
tD(on)  
tr  
17  
13  
17.5  
10  
VGS=10V, VDS=15V, RL=0.75,  
R
GEN=3Ω  
tD(off)  
tf  
56  
10.5  
20  
trr  
IF=20A, dI/dt=300A/µs  
IF=20A, dI/dt=300A/µs  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
25  
ns  
Qrr  
26  
nC  
A: The value of R  
is measured with the device in a still air environment with TA =25°C. The power dissipation PDSM and current rating IDSM are  
θJA  
based on TJ(MAX)=150°C, using t 10s junction-to-ambient thermal resistance.  
B: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.  
C. The R θJA is the sum of the thermal impedence from junction to lead R qJL and lead to ambient.  
D. The static characteristics in Figures 1 to 6 are obtained using <300 ms pulses, duty cycle 0.5% max.  
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA  
curve provides a single pulse rating.  
Rev1: June 2006  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
AO4456  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
150  
120  
90  
60  
30  
0
30  
25  
20  
15  
10  
5
6V  
VDS=5V  
10V  
4.5V  
125°  
VGS=3.5V  
25°C  
0
0
1
2
3
4
5
1
1.5  
2
2.5  
3
3.5  
4
V
DS (Volts)  
V
GS(Volts)  
Fig 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
6
5
4
3
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
ID=20A  
VGS=4.5V  
VGS=4.5V  
VGS=10V  
2
0
0.8  
5
10  
15  
20  
25  
30  
0
30  
60  
90  
120  
150  
180  
ID (A)  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction  
Temperature  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
10  
8
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
ID=20A  
125°C  
125°C  
25°C  
6
4
25°C  
2
0.0  
0.2  
0.4  
SD (Volts)  
Figure 6: Body-Diode Characteristics  
0.6  
0.8  
1.0  
2
4
6
8
10  
V
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AO4456  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
12000  
10  
8
10000  
8000  
6000  
4000  
2000  
0
VDS=15V  
ID=20A  
Ciss  
6
4
Crss  
2
Coss  
0
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
VDS (Volts)  
Figure 8: Capacitance Characteristics  
1000.0  
100.0  
10.0  
1.0  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
10µs  
TJ(Max)=150°C  
TA=25°C  
100µ  
1ms  
RDS(ON)  
limited  
0.1s  
10ms  
DC  
TJ(Max)=150°C  
TA=25°C  
0.1  
0.0  
0.1  
1
10  
100  
0.0001 0.001  
0.01  
0.1  
1
10  
100  
V
DS (Volts)  
Pulse Width (s)  
Figure10: Single Pulse Power Rating Junction-to-  
Ambient (Note E)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note E)  
10  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
1
0.1  
PD  
D=Ton/T  
0.01  
T
J,PK=TA+PDM.ZθJA.RθJA  
Ton  
T
Single Pulse  
RθJA=40°C/W  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note E)  
1
10  
100  
1000  
Alpha & Omega Semiconductor, Ltd.  
AO4456  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1.0E-01  
0.9  
0.8  
20A  
1.0E-02  
10A  
0.7  
VDS=24V  
0.6  
1.0E-03  
VDS=12V  
0.5  
5A  
0.4  
1.0E-04  
0.3  
0.2  
0.1  
0
1.0E-05  
1.0E-06  
IS=1A  
0
50  
100  
150  
200  
0
50  
100  
Temperature (°C)  
150  
200  
Temperature (°C)  
Figure 12: Diode Reverse Leakage Current vs.  
Junction Temperature  
Figure 13: Diode Forward voltage vs. Junction  
Temperature  
70  
60  
50  
40  
30  
20  
10  
8
25  
3
di/dt=800A/us  
125ºC  
di/dt=800A/us  
125ºC  
2.5  
2
20  
15  
10  
5
7
6
5
4
25ºC  
trr  
25ºC  
Qrr  
Irm  
1.5  
1
125ºC  
125ºC  
S
25ºC  
25  
0.5  
0
25ºC  
0
0
0
0
5
10  
15  
20  
25  
30  
5
10  
15  
20  
30  
Is (A)  
Is (A)  
Figure 15: Diode Reverse Recovery Time and  
Soft Coefficient vs. Conduction Current  
Figure 14: Diode Reverse Recovery Charge and  
Peak Current vs. Conduction Current  
60  
8
7
6
5
4
3
2
1
0
35  
30  
25  
20  
15  
10  
5
3
2
1
0
125ºC  
25ºC  
Is=20A  
Is=20A  
50  
40  
30  
20  
10  
0
125ºC  
25ºC  
125ºC  
25ºC  
25ºC  
trr  
Qrr  
S
125ºC  
Irm  
0
0
200  
400  
600  
800  
1000  
0
200  
400  
600  
800  
1000  
di/dt (A)  
di/dt (A)  
Figure 16: Diode Reverse Recovery Charge and  
Peak Current vs. di/dt  
Figure 17: Diode Reverse Recovery Time and Soft  
Coefficient vs. di/dt  
Alpha & Omega Semiconductor, Ltd.  

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