ICS-40181 [TDK]
MEMS麦克风(麦克风);
| 型号： | ICS-40181 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | MEMS麦克风(麦克风) |
| 文件： | 总14页 (文件大小：808K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICS‐40181
RF‐Hardened, Low‐Noise Microphone with Top Port and Analog Output
GENERAL DESCRIPTION
APPLICATIONS
The ICS‐40181 is an analog MEMS microphone with high SNR
and enhanced RF immunity. The ICS‐40181 includes a MEMS
microphone element, an impedance converter, and an output
amplifier.
Smartphones
Tablet Computers
Wearable Devices
Still and Video Cameras
Bluetooth Headsets
Notebook PCs
Other high‐performance specification include a linear
response up to 124 dB SPL, tight ±1 dB sensitivity tolerance
and enhanced immunity to both radiated and conducted RF
interference.
Security and Surveillance
FEATURES
High 65 dBA SNR
−38 dBV Sensitivity
±1 dB Sensitivity Tolerance
Noninverted Signal Output
Omnidirectional Response
Extended Frequency Response from 60 Hz to 20 kHz
Enhanced RF Immunity
124 dB SPL Acoustic Overload Point
Low Current Consumption of 180 µA
Single‐Ended Analog Output
This microphone’s electro‐acoustic performance matches the
bottom port ICS‐40180, making this pair of microphones
suitable to use together in applications requiring both top
and bottom port devices.
The ICS‐40181 is available in a small 3.5 mm × 2.65 mm ×
0.98 mm surface‐mount package.
High −78 dBV PSR
3.5 × 2.65 × 0.98 mm Surface‐Mount Package
Compatible with Sn/Pb and Pb‐Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
ICS‐40181
TEMP RANGE
−40°C to +85°C
PACKAGING
13” Tape and Reel
EV_ICS‐40181‐FX
—
OUTPUT
AMPLIFIER
OUTPUT
POWER
ICS‐40181
VDD GND
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
Document Number: DS‐000028
Revision: 1.3
Rev Date: 4/6/2016
www.invensense.com
ICS‐40181
TABLE OF CONTENTS
General Description..................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Features....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................ 1
Ordering Information................................................................................................................................................................... 1
Table of Contents.................................................................................................................................................................................... 2
Specifications.......................................................................................................................................................................................... 3
Table 1. Electrical Characteristics ................................................................................................................................................ 3
Absolute Maximum Ratings.................................................................................................................................................................... 4
Table 2. Absolute Maximum Ratings ........................................................................................................................................... 4
ESD Caution ................................................................................................................................................................................. 4
Soldering Profile........................................................................................................................................................................... 5
Table 3. Recommended Soldering Profile*.................................................................................................................................. 5
Pin Configurations And Function Descriptions ....................................................................................................................................... 6
Table 4. Pin Function Descriptions............................................................................................................................................... 6
Typical Performance Characteristics....................................................................................................................................................... 7
Applications Information ........................................................................................................................................................................ 8
Codec Connection........................................................................................................................................................................ 8
Supporting Documents ........................................................................................................................................................................... 9
Evaluation Board User Guide....................................................................................................................................................... 9
Application Notes ........................................................................................................................................................................ 9
PCB Design And Land Pattern Layout ................................................................................................................................................... 10
PCB Material And Thickness ...................................................................................................................................................... 10
Handling Instructions............................................................................................................................................................................ 11
Pick And Place Equipment ......................................................................................................................................................... 11
Reflow Solder............................................................................................................................................................................. 11
Board Wash ............................................................................................................................................................................... 11
Outline Dimensions............................................................................................................................................................................... 12
Ordering Guide .......................................................................................................................................................................... 13
Revision History ......................................................................................................................................................................... 13
Compliance Declaration Disclaimer...................................................................................................................................................... 14
Page 2 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = −40 to 85°C, VDD = 1.5 to 3.63 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
PERFORMANCE
Directionality
Omni
Output Polarity
Sensitivity
Non‐Inverted
−38
1 kHz, 94 dB SPL
−39
−37
dBV
1
NORMAL MODE PERFORMANCE
Signal‐to‐Noise Ratio (SNR)
Equivalent Input Noise (EIN)
20 Hz to 20 kHz, A‐weighted
20 Hz to 20 kHz, A‐weighted
Derived from EIN and maximum
acoustic input
65
29
dBA
dBA SPL
Dynamic Range
95
dB
Low frequency −3 dB point
High frequency −3 dB point
105 dB SPL
217 Hz, 100 mVp‐p square wave
superimposed on VDD = 1.8 V
1 kHz, 100 mV p‐p sine wave
superimposed on VDD = 1.8 V
10% THD
60
>20
0.2
Hz
kHz
%
Frequency Response
2
Total Harmonic Distortion (THD)
Power‐Supply Rejection (PSR)
1
−78
dBV
Power Supply Rejection Ratio (PSRR)
−46
dB
Acoustic Overload Point
POWER SUPPLY
124
dB SPL
Supply Voltage (VDD)
Supply Current (IS)
Normal Mode
VDD = 1.8 V
VDD = 3.3 V
1.5
3.63
220
250
V
µA
µA
180
210
OUTPUT CHARACTERISTICS
Output Impedance
350
0.7
Ω
V
Output DC Offset
Maximum Output Voltage
Noise Floor
124 dB SPL input
0.398
−103
V rms
dBV
20 Hz to 20 kHz, A‐weighted, rms
Note 1: The sensitivity shall not deviate more than 1.5 dB from its initial value after reliability tests.
Note 2: See Figure 3 and Figure 4 .
Page 3 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD)
Sound Pressure Level
Mechanical Shock
Vibration
−0.3 V to +3.63 V
160 dB
10,000 g
Per MIL‐STD‐883 Method 2007, Test Condition B
Temperature Range
Biased
Storage
−40°C to +85°C
−55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb‐Free
Average Ramp Rate (TL to TP)
1.25°C/sec max
1.25°C/sec max
Minimum Temperature
(TSMIN
Minimum Temperature
(TSMIN
100°C
100°C
200°C
)
Preheat
150°C
)
Time (TSMIN to TSMAX), tS 60 sec to 75 sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp‐Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
1.25°C/sec
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
3°C/sec max
5 min max
Ramp‐Down Rate
Time +25°C (t25°C) to Peak Temperature 5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are
also compatible with the J‐STD‐020 profile
Page 5 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
3
2
1
GND
GND
GND
OUTPUT GND
VDD
6
4
5
Figure 2. Pin Configuration (Top View, Terminal Side Down)
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME
FUNCTION
1
2
3
4
GND
Ground
GND
Ground
GND
Ground
OUTPUT
Analog Output Signal
5
6
GND
VDD
Ground
Power Supply. Decouple to GND pin with 0.1 μF capacitor
Page 6 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
TYPICAL PERFORMANCE CHARACTERISTICS
20
15
20
15
10
5
10
5
0
0
–5
–5
–10
–15
–20
–10
–15
10
100
1k
10k
10
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 3. Frequency Response Mask
Figure 4. Typical Frequency Response (Measured)
–40
–41
–42
–43
–44
–45
–46
–47
–48
–49
–50
10
1
0.1
90
100
110
120
130
100
1k
10k
INPUT (dB SPL)
FREQUENCY (Hz)
Figure 6. Total Harmonic Distortion + Noise (THD+N) vs. Input SPL
Figure 5. PSR vs. Frequency, 100 mV p‐p Swept Sine Wave
1.4
1.2
1.0
0.8
0.6
-5
-10
-15
-20
-25
-30
-35
-40
-45
0.4
120dB SPL
0.2
0
124dB SPL
128dB SPL
132dB SPL
0
0.5
TIME (ms)
1.0
90
100
110
120
130
INPUT AMPLITUDE (dB SPL)
Figure 7. Linearity
Figure 8. Clipping Characteristics
Page 7 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
APPLICATIONS INFORMATION
CODEC CONNECTION
The ICS‐40181 output can be connected to a dedicated codec microphone input (see Figure 9) or to a high input impedance gain
stage. A 0.1 µF ceramic capacitor placed close to the ICS‐40181 supply pin is used for testing and is recommended to adequately
decouple the microphone from noise on the power supply. A DC blocking capacitor is required at the output of the microphone. This
capacitor creates a high‐pass filter with a corner frequency at
fC = 1/(2π × C × R)
where, R is the input impedance of the codec.
A minimum value of 2.2 μF is recommended in Figure 9 because the input impedance of some codecs can be as low as 2 kΩ at their
highest PGA gain setting, which results in a high‐pass filter corner frequency at 37 Hz. Figure 10 shows the ICS‐40181 connected to
an op amp configured as a noninverting preamplifier.
MICBIAS
0.1 µF
ADC
OR
CODEC
VDD
2.2 µF
MINIMUM
ICS‐40181
INPUT
OUTPUT
GND
Figure 9. ICS‐40181 Connected to a Codec
1.8‐3.3 V
GAIN = (R1 + R2)/R1
R1 R2
V
REF
0.1µF
VDD
V
AMP
OUT
1µF
MINIMUM
ICS‐40181
OUTPUT
GND
10kΩ
V
REF
Figure 10. ICS‐40181 Connected to an Op Amp
Page 8 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG‐325, Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES
AN‐100, MEMS Microphone Handling and Assembly Guide
AN‐1003, Recommendations for Mounting and Connecting the InvenSense Bottom‐Ported MEMS Microphones
AN‐1112, Microphone Specifications Explained
AN‐1124, Recommendations for Sealing InvenSense Bottom‐Port MEMS Microphones from Dust and Liquid Ingress
AN‐1140, Microphone Array Beamforming
AN‐1165, Op Amps for Microphone Preamp Circuits
AN‐1181, Using a MEMS Microphone in a 2‐Wire Microphone Circuit
Page 9 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS‐40181 at a 1:1 ratio to the solder pads on the microphone package (see Figure 11.) Figure 12
shows a suggested solder paste stencil pattern layout.
0.240
0.792
1.178
1.032
0.622
0.500
0.323
0.622
0.323
Figure 11. Recommended PCB Land Pattern Layout
0.211
0.721
1.278
0.932
0.400
0.522
0.522
0.423
0.423
Figure 12. Recommended Solder Paste Stencil Pattern Layout
PCB MATERIAL AND THICKNESS
The ICS‐40181 can be mounted on either a rigid or flexible PCB. A microphone’s lid can be attached directly to the device housing
with an adhesive layer. This mounting method offers a reliable seal around the sound port while providing the shortest acoustic path
for good sound quality. The sound port can also be routed to the device housing through a port in a rubber boot. This boot should be
designed to seal the connection between the microphone’s lid and the rubber completely.
Page 10 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick‐and‐place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the top of the package, the pickup
tool should not be placed over the microphone port.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow‐off procedures or
ultrasonic cleaning.
Page 11 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
OUTLINE DIMENSIONS
(4X)
C
d
0.10
A
0.500X1.032 (2x)
2.65
f
0.10
C
C
j
j
0.10 m
0.05 m
C
C
A B
0.884
PIN 1
CORNER
PIN1
CORNER
(1.325)
C(0.34)
(0.980)
3.50
(1.18)
2.21
0.325 PORTHOLE
(
0.48) SRO
0.13
0.13
B
0.98±0.10
0.622X1.032 (4x)
1.768
j
j
0.10 m
0.05 m
C
C
A B
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Figure 13. 6‐Terminal Chip Array Small Outline No‐Lead Cavity
3.50 mm × 2.65 mm × 0.98 mm Body
Dimensions shown in millimeters
2.650 mm
ø 0.325 mm
3.500 mm
1.325 mm
0.980 mm
1.750 mm
PICK UP AREA
Figure 14. Recommended Vacuum Pick‐up Area
SOUND PORT
PIN 1 INDICATION
PART NUMBER
DATE CODE
181
XXXX
Figure 15. Package Marking Specification (Top View)
Page 12 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
ORDERING GUIDE
PART
ICS‐40181
TEMP RANGE
−40°C to +85°C 6‐Terminal LGA_CAV
PACKAGE
QUANTITY
10,000
PACKAGING
13” Tape and Reel
EV_ICS‐40181‐FX
—
Flexible Evaluation Board
—
REVISION HISTORY
REVISION DATE
REVISION DESCRIPTION
3/23/2015
4/27/2015
07/15/2015
04/06/2016
1.0
1.1
1.2
1.3
Initial Version
Updated Figures 3 and 4
Added Note 1 to Table 1
Updated Sensitivity condition in Table 1; updated Figure 7.
Page 13 of 14
Document Number: DS‐000028
Revision: 1.3
ICS‐40181
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass‐destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2016 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, Digital Motion Processor, AAR and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product
names may be trademarks of the respective companies with which they are associated.
©2016 InvenSense, Inc. All rights reserved.
Page 14 of 14
Document Number: DS‐000028
Revision: 1.3
相关型号：
©2020 ICPDF网 联系我们和版权申明