ICS-40618 [TDK]
MEMS麦克风(麦克风);
| 型号： | ICS-40618 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | MEMS麦克风(麦克风) 商用集成电路 |
| 文件： | 总16页 (文件大小：847K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICS‐40618
High Dynamic Range Microphone with Differential Output and Low Power
GENERAL DESCRIPTION
APPLICATIONS
The ICS‐40618 is an analog MEMS microphone with very high
dynamic range and a low‐power AlwaysOn mode. The ICS‐
40618 includes a MEMS microphone element, an impedance
converter, and a differential output amplifier.
Smartphones
“AlwaysOn” listening
Wearable devices
Still and video cameras
IoT devices
This microphone features a low‐power mode, which is active
when the supply voltage is <2.0 V. In this mode, the
ICS‐40618 operates with 55 µA.
FEATURES
SPEC
HIGH PERFORMANCE
MODE
LOW‐POWER
MODE
67 dBA
55 µA
129 dB SPL
Other high‐performance specifications include 132 dB SPL
acoustic overload point in high performance mode, tight
±1 dB sensitivity tolerance and enhanced immunity to both
radiated and conducted RF interference.
SNR
Current
AOP
67 dBA
165 µA
132 dB SPL
The ICS‐40618’s electro‐acoustic performance matches the
top port ICS‐40619, making this pair of microphones suitable
to use together in applications requiring both top and bottom
port devices.
Differential non‐inverting analog output
−38 dBV sensitivity (differential)
±1 dB sensitivity tolerance
Extended frequency response from 50 Hz to 20 kHz
Enhanced RF immunity
The ICS‐40618 is available in a small 3.50 mm × 2.65 mm ×
0.98 mm bottom port surface‐mount package.
−85 dB PSRR
3.50 × 2.65 × 0.98 mm surface‐mount package
Compatible with Sn/Pb and Pb‐free solder processes
RoHS/WEEE compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
ICS‐40618
TEMP RANGE
−40°C to +85°C
PACKAGING
13” Tape and Reel
EV_ICS‐40618‐FX
—
OUTPUT+
OUTPUT
AMPLIFIER
OUTPUT−
LOW-POWER
MODE SWITCHING
POWER
ICS-40618
VDD GND
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
Document Number: DS‐000044
Revision: 1.0
Release Date: 3/21/2016
www.invensense.com
ICS‐40618
TABLE OF CONTENTS
General Description..................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Features....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................ 1
Ordering Information................................................................................................................................................................... 1
Table of Contents.................................................................................................................................................................................... 2
Specifications.......................................................................................................................................................................................... 3
Table 1. Electrical Characteristics ................................................................................................................................................ 3
Absolute Maximum Ratings.................................................................................................................................................................... 5
Table 2. Absolute Maximum Ratings ........................................................................................................................................... 5
ESD Caution ................................................................................................................................................................................. 5
Soldering Profile........................................................................................................................................................................... 6
Table 3. Recommended Soldering Profile*.................................................................................................................................. 6
Pin Configurations And Function Descriptions ....................................................................................................................................... 7
Table 4. Pin Function Descriptions............................................................................................................................................... 7
Typical Performance Characteristics....................................................................................................................................................... 8
Theory Of Operation............................................................................................................................................................................... 9
Low‐Power Mode......................................................................................................................................................................... 9
Balanced Output.......................................................................................................................................................................... 9
Applications Information ...................................................................................................................................................................... 10
Codec Connection...................................................................................................................................................................... 10
Supporting Documents ......................................................................................................................................................................... 11
Evaluation Board User Guide..................................................................................................................................................... 11
Application Notes ...................................................................................................................................................................... 11
PCB Design And Land Pattern Layout ................................................................................................................................................... 12
PCB Material And Thickness ...................................................................................................................................................... 12
Handling Instructions............................................................................................................................................................................ 13
Pick And Place Equipment ......................................................................................................................................................... 13
Reflow Solder............................................................................................................................................................................. 13
Board Wash ............................................................................................................................................................................... 13
Outline Dimensions............................................................................................................................................................................... 14
Ordering Guide .......................................................................................................................................................................... 14
Revision History ......................................................................................................................................................................... 15
Compliance Declaration Disclaimer...................................................................................................................................................... 16
Page 2 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
TA = 25°C, VDD = 1.52 to 3.63 V, unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS NOTES
PERFORMANCE
Directionality
Output Polarity
Sensitivity
Omni
Non‐Inverted
−38
1 kHz, 94 dB SPL, differential
−39
−37
dBV
HIGH PERFORMANCE MODE
Signal‐to‐Noise Ratio (SNR)
Equivalent Input Noise (EIN)
20 kHz bandwidth, A‐weighted
20 kHz bandwidth, A‐weighted
Derived from EIN and acoustic
overload point
67
27
dBA
dBA
Dynamic Range
105
0.2
dB
%
Total Harmonic Distortion (THD)
Power Supply Rejection Ratio (PSRR)
105 dB SPL
1 kHz, 100 mV p‐p sine wave
superimposed on VDD = 2.75 V
217 Hz, 100 mVp‐p square wave
superimposed on VDD = 2.75 V
10% THD
−85
dB
Power Supply Rejection (PSR)
−112
dBV
Acoustic Overload Point
LOW‐POWER MODE
132
dB SPL
Signal‐to‐Noise Ratio (SNR)
Equivalent Input Noise (EIN)
20 kHz bandwidth, A‐weighted
20 kHz bandwidth, A‐weighted
Derived from EIN and acoustic
overload point
67
27
dBA
dBA
Dynamic Range
101
0.2
dB
%
Total Harmonic Distortion (THD)
Power Supply Rejection Ratio (PSRR)
105 dB SPL
1 kHz, 100 mV p‐p sine wave
superimposed on VDD = 1.8 V
217 Hz, 100 mVp‐p square wave
superimposed on VDD = 1.8 V
10% THD, VDD = 1.8 V
−85
dB
Power Supply Rejection (PSR)
−112
dBV
Acoustic Overload Point
POWER SUPPLY
129
dB SPL
Supply Voltage (VDD)
Low‐power mode
High performance mode
VDD = 1.8 V
1.52
2.2
2.0
3.63
65
V
V
µA
µA
Supply Current (IS)
55
165
VDD = 2.75 V
190
Page 3 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
OUTPUT CHARACTERISTICS
Differential Output Impedance
Output Common Mode Voltage
High‐performance mode
Low‐power mode
355
5.5
1.0
Ω
kΩ
V
OUTPUT+ and OUTPUT−, high‐
performance mode
OUTPUT+ and OUTPUT−, low‐
power mode
0.8
10
V
Output Differential Offset
Between OUTPUT+ and
OUTPUT−, high‐performance
mode
mV
Between OUTPUT+ and
OUTPUT−, low‐power mode
10
15
mV
ms
ms
ms
Startup Time
Output to within ±0.5 dB of
stable sensitivity
20
1
Mode Switching Time
High performance mode to
low‐power mode
Low‐power mode to high
1
performance mode
Maximum Output Voltage
Noise Floor
132 dB SPL input
1.0
V rms
dBV
20 Hz to 20 kHz, A‐weighted,
−105
rms, high performance mode
Page 4 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
Supply Voltage (VDD)
Sound Pressure Level
Mechanical Shock
Vibration
−0.3 V to +3.63 V
160 dB
10,000 g
Per MIL‐STD‐883 Method 2007, Test Condition B
Temperature Range
Biased
Storage
−40°C to +85°C
−55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 5 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb‐Free
Average Ramp Rate (TL to TP)
1.25°C/sec max
1.25°C/sec max
Minimum Temperature
(TSMIN
Minimum Temperature
(TSMIN
100°C
100°C
200°C
)
Preheat
150°C
)
Time (TSMIN to TSMAX), tS 60 sec to 75 sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp‐Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
1.25°C/sec
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
3°C/sec max
5 min max
Ramp‐Down Rate
Time +25°C (t25°C) to Peak Temperature 5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are
also compatible with the J‐STD‐020 profile
Page 6 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
3
GND
OUTPUT−
GND
4
5
2
OUTPUT+
VDD
1
Figure 2. Pin Configuration (Top View, Terminal Side Down)
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME
FUNCTION
1
2
OUTPUT+
OUTPUT−
Analog Output Signal+
Analog Output Signal−
3
4
5
GND
GND
VDD
Ground
Ground
Power Supply
Page 7 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
TYPICAL PERFORMANCE CHARACTERISTICS
20
HIGH PERFORMANCE MODE
10
1
LOW‐POWER MODE
10
0
0.1
0.01
‐10
‐20
90
100
110
120
130
140
10
100
1000
10000
INPUT AMPLITUDE (dB SPL)
FREQUENCY (Hz)
Figure 4. THD + N vs. Input Amplitude
Figure 3. Typical Frequency Response (Measured)
0
‐20
10
HIGH PERFORMANCE MODE
0
‐10
‐20
‐30
‐40
‐50
LOW‐POWER MODE
‐40
‐60
‐80
‐100
100
1000
10000
90
100
110
120
130
FREQUENCY (Hz)
INPUT AMPLITUDE (dB SPL)
Figure 5. Power‐Supply Rejection Ratio (PSRR) vs. Frequency
Figure 6. Linearity
Page 8 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
THEORY OF OPERATION
LOW‐POWER MODE
The ICS‐40618 will enter a low‐power mode when the supply voltage VDD falls below 2.0 V. In this mode, the microphone will operate
with 55 µA supply current. While the microphone is switched between the two modes, the output signals should be muted for a
short time.
BALANCED OUTPUT
The ICS‐40618 has a balanced differential output with 355 Ω output impedance in high performance mode and 5.5 kΩ in low‐power
mode. This configuration is compatible with a fully‐differential codec input and provides the benefits of a balanced signal between
the microphone and codec. A balanced analog audio signal provides rejection of common‐mode noise that is present on both the
positive and negative signals.
Page 9 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
APPLICATIONS INFORMATION
CODEC CONNECTION
The ICS‐40618 output can be connected to a dedicated codec microphone input (see Figure 7) or to a high input impedance gain
stage. A 0.1 µF ceramic capacitor placed close to the ICS‐40618 supply pin is used for testing and is recommended to adequately
decouple the microphone from noise on the power supply. A dc blocking capacitor is required at the output of the microphone. This
capacitor creates a high‐pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 2.2 μF is recommended in Figure 7 for codecs, which may have a very low input impedance at some PGA gain
settings.
MICBIAS
0.1µF
CODEC
VDD
2.2µF
MINIMUM
ICS-40618
IN+
IN−
OUTPUT+
OUTPUT−
GND
Figure 7. ICS‐40618 Connected to a Differential‐Input Codec
Page 10 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
AN‐000012, Differential Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES
AN‐100, MEMS Microphone Handling and Assembly Guide
AN‐1003, Recommendations for Mounting and Connecting the InvenSense Bottom‐Ported MEMS Microphones
AN‐1112, Microphone Specifications Explained
AN‐1124, Recommendations for Sealing InvenSense Bottom‐Port MEMS Microphones from Dust and Liquid Ingress
AN‐1140, Microphone Array Beamforming
AN‐1165, Op Amps for Microphone Preamp Circuits
Page 11 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS‐40618 at a 1:1 ratio to the solder pads on the microphone package (see Figure 8.) Take care
to avoid applying solder paste to the sound hole in the PCB. Figure 9 shows a suggested solder paste stencil pattern layout.
The response of the ICS‐40618 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro‐
phone (0.375 mm in diameter). A 0.5 mm to 1 mm diameter for the hole is recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
0.522x0.725(4X)
Ø1.625
Ø1.025
1.675
0.838
0.822
1.252
Figure 8. Recommended PCB Land Pattern Layout
0.422x0.625(4X)
Ø1.625
Ø1.125
1.675
0.1(4x)
0.822
1.252
Figure 9. Recommended Solder Paste Stencil Pattern Layout
PCB MATERIAL AND THICKNESS
The performance of the ICS‐40618 is not affected by PCB thickness. The ICS‐40618 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 12 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick‐and‐place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow‐off procedures or
ultrasonic cleaning.
Page 13 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
OUTLINE DIMENSIONS
d
0.10
(4X)
0.522X0.725 (4x)
j
0.10 m C A B
3.50
A
0.125
PIN 1
CORNER
PIN 1
CORNER
0.82
Ø1.625
Ø1.025
Ø0.375
1
5
2
4
(2.45)
2.65
2.650
0.950
1.675
1.33
3
0.300
0.125
B
(3.30)
1.040
1.513
3.500
BOTTOM VIEW
TOP VIEW
f
0.10 C
0.98
C
(0.254)
SIDE VIEW
Figure 10. 5‐Terminal Chip Array Small Outline No Lead Cavity
3.50 mm × 2.65 mm × 0.98 mm Body
Dimensions shown in millimeters
PART NUMBER
PIN 1 INDICATION
618
YYXXX
DATE CODE
LOT TRACEABILITY CODE
Figure 11. Package Marking Specification (Top View, not to scale)
ORDERING GUIDE
PART
TEMP RANGE
PACKAGE
QUANTITY
PACKAGING
ICS‐40618
−40°C to +85°C 5‐Terminal LGA_CAV
10,000
13” Tape and Reel
EV_ICS‐40618‐FX
—
Flexible Evaluation Board
—
Page 14 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
REVISION HISTORY
REVISION DATE
REVISION DESCRIPTION
1.0 Initial Version
3/21/2016
Page 15 of 16
Document Number: DS‐000044
Revision: 1.0
ICS‐40618
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass‐destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2016 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, Digital Motion Processor, AAR and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product
names may be trademarks of the respective companies with which they are associated.
©2016 InvenSense, Inc. All rights reserved.
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Document Number: DS‐000044
Revision: 1.0
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