ICS-40730 [TDK]
MEMS麦克风(麦克风);
| 型号： | ICS-40730 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | MEMS麦克风(麦克风) 商用集成电路 |
| 文件： | 总15页 (文件大小：642K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICS-40730
Ultra-Low Noise Microphone with Differential Output
APPLICATIONS
GENERAL DESCRIPTION
•
•
•
•
•
•
Smart Home Devices
The ICS-40730 is an ultra-low noise, differential analog
output, bottom-ported MEMS microphone. The ICS-40730
includes a MEMS microphone element, an impedance
converter, a differential output amplifier and an enhanced RF
package. The ICS-40730’s 74 dB SNR and ±2 dB sensitivity
tolerance make it an excellent choice for microphone arrays
and far field voice control applications.
Smartphones
Teleconferencing Systems
Security and Surveillance
Microphone Arrays
Voice Control and Activation
FEATURES
The ICS-40730 has a linear response up to 123 dB SPL with a
differential output sensitivity specification of −32 dBV. It can
be used in a single-ended mode with −38 dBV sensitivity and
the same high SNR.
•
•
Ultra-High 74 dBA SNR
−32 dBV Differential Sensitivity, −38 dBV Single-
Ended Sensitivity
•
•
•
•
•
•
•
•
•
•
±2 dB Sensitivity Tolerance
4.72 × 3.76 × 3.5 mm Surface-Mount Package
Non-Inverted Signal Output
The ICS-40730 is available in a 4.72 mm × 3.76 mm × 3.50 mm
surface-mount package.
Extended Frequency Response from 20 Hz to 20 kHz
Enhanced RF Performance
285 µA Current Consumption
123 dB SPL Acoustic Overload Point
−77 dBV PSR
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
ICS-40730
EV_ICS-40730-FX
TEMP RANGE
−40°C to +85°C
PACKAGING
13” Tape and Reel
—
OUTPUT+
OUTPUT
—
AMPLIFIER
OUTPUT−
POWER
ICS-40730
VDD GND
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
InvenSense, Inc. reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
Document Number: DS-000139
Revision: 1.1
Rev Date: 05/19/2020
+1(408) 988–7339
www.invensense.com
ICS-40730
TABLE OF CONTENTS
General Description..................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Features....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................ 1
Ordering Information................................................................................................................................................................... 1
Table of Contents.................................................................................................................................................................................... 2
Specifications.......................................................................................................................................................................................... 3
Table 1. Electrical Characteristics ................................................................................................................................................ 3
Absolute Maximum Ratings.................................................................................................................................................................... 4
Table 2. Absolute Maximum Ratings ........................................................................................................................................... 4
ESD Caution ................................................................................................................................................................................. 4
Soldering Profile........................................................................................................................................................................... 5
Table 3. Recommended Soldering Profile*.................................................................................................................................. 5
Pin Configurations And Function Descriptions ....................................................................................................................................... 6
Table 4. Pin Function Descriptions............................................................................................................................................... 6
Typical Performance Characteristics....................................................................................................................................................... 7
Theory Of Operation............................................................................................................................................................................... 8
Balanced Output.......................................................................................................................................................................... 8
Single-Ended Operation............................................................................................................................................................... 8
Applications Information ........................................................................................................................................................................ 9
Codec Connection........................................................................................................................................................................ 9
Supporting Documents ......................................................................................................................................................................... 10
Evaluation Board User Guide..................................................................................................................................................... 10
Application Notes ...................................................................................................................................................................... 10
PCB Design And Land Pattern Layout ................................................................................................................................................... 11
PCB Material And Thickness ...................................................................................................................................................... 11
Handling Instructions............................................................................................................................................................................ 12
Pick And Place Equipment ......................................................................................................................................................... 12
Reflow Solder............................................................................................................................................................................. 12
Board Wash ............................................................................................................................................................................... 12
Outline Dimensions............................................................................................................................................................................... 13
Ordering Guide .......................................................................................................................................................................... 13
Revision History ......................................................................................................................................................................... 14
Compliance Declaration Disclaimer ...................................................................................................................................................... 15
Page 2 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
TA = 25°C, VDD = 1.5 to 3.63 V, unless otherwise noted. Typical specifications are not guaranteed.
PARAMETER
PERFORMANCE
Directionality
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
Omni
−32
−38
1 kHz, 94 dB SPL, differential
1 kHz, 94 dB SPL, single-ended
20 Hz to 20 kHz, A-weighted,
differential
20 Hz to 20 kHz, A-weighted,
single-ended
−34
−40
−30
−36
dBV
dBV
Sensitivity
74
dBA
Signal-to-Noise Ratio (SNR)
74
dBA
Equivalent Input Noise (EIN)
Dynamic Range
20 Hz to 20 kHz, A-weighted
Derived from EIN and maximum
acoustic input
20
dBA SPL
dB
103
Low frequency -3 dB point
High frequency -3 dB point
105 dB SPL
20
>20
Hz
kHz
%
Frequency Response
Total Harmonic Distortion (THD)
0.6
217 Hz, 100 mVp-p square wave
superimposed on VDD = 1.8 V,
A-weighted
Power-Supply Rejection (PSR)
−77
dBV
1 kHz, 100 mV p-p sine wave
superimposed on VDD = 1.8 V
10% THD
Power Supply Rejection Ratio (PSRR)
−45
dB
Acoustic Overload Point
POWER SUPPLY
123
dB SPL
Supply Voltage (VDD)
Supply Current (IS)
1.5
3.63
V
VDD = 1.8 V
VDD = 3.3 V
285
350
375
µA
µA
OUTPUT CHARACTERISTICS
Output Impedance
Differential
430
180
250
Ω
Ω
Ω
Single-Ended, OUTPUT+
Single-Ended, OUTPUT−
Output DC Offset
Maximum Output Voltage
Noise Floor
OUTPUT+
0.72
0.66
0.79
0.40
−106
V
OUTPUT−
V
Differential, 123 dB SPL input
Single-Ended, 123 dB SPL input
20 Hz to 20 kHz, A-weighted, rms
V rms
V rms
dBV
Page 3 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
−0.3 V to +3.63 V
Supply Voltage (VDD)
160 dB
Sound Pressure Level
Mechanical Shock
Vibration
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
Temperature Range
Biased
−40°C to +85°C
Storage
−55°C to +150°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
1.25°C/sec max
1.25°C/sec max
Minimum Temperature
(TSMIN
Maximum Temperature
(TSMAX
Time (TSMIN to TSMAX), tS
100°C
100°C
)
Preheat
150°C
200°C
)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
20 sec to 30 sec
3°C/sec max
Ramp-Down Rate
3°C/sec max
5 min max
Time +25°C (t25°C) to Peak Temperature
5 min max
*Note: The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J-STD-020 profile
Page 5 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
4
GND
VDD
1
OUTPUT+ OUTPUT-
2
3
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
Figure 2. Pin Configuration
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME
FUNCTION
1
2
VDD
OUTPUT+
Power Supply
Noninverting analog output signal relative to the acoustic input
3
4
OUTPUT-
GND
Inverting analog output signal relative to the acoustic input
Ground
Page 6 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
TYPICAL PERFORMANCE CHARACTERISTICS
20
15
10
5
10
1
0
-5
0.1
0.01
-10
-15
-20
10
100
1000
FREQUENCY (Hz)
10000
90
100
110
120
130
INPUT (dB SPL)
Figure 3. Typical Frequency Response (Measured)
Figure 4. THD + N vs. Input Level
0
-5
-40
-41
-42
-43
-44
-45
-46
-47
-48
-49
-50
-10
-15
-20
-25
-30
-35
-40
100
1000
10000
90
100
110
120
130
FREQUENCY (Hz)
INPUT AMPLITUDE (dB SPL)
Figure 5. Power-Supply Rejection Ratio (PSRR) vs. Frequency
Figure 6. Linearity
Page 7 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
THEORY OF OPERATION
BALANCED OUTPUT
The ICS-40730 has a balanced differential output with 430 Ω output impedance. This configuration is compatible with a fully-
differential codec input and provides the benefits of a balanced signal between the microphone and codec. A balanced analog audio
signal provides rejection of common-mode noise that is present on both the positive and negative signals.
SINGLE-ENDED OPERATION
The ICS-40730 can be used as a single-ended microphone by using the signal from only one of the two output pins. In this
configuration, the sensitivity will be 6 dB lower than the differential output, but with the same high SNR performance. Pin OUTPUT+
will output the non-inverted signal, relative to the acoustic input, while the OUTPUT− pin will output an inverted signal. The unused
output pin should be left disconnected when the mic is used in single-ended mode; do not connect the unused pin to ground.
Page 8 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
APPLICATIONS INFORMATION
CODEC CONNECTION
The ICS-40730 output can be connected to a dedicated codec microphone input (see Figure 7) or to a high input impedance gain
stage. A 0.1 µF ceramic capacitor placed close to the ICS-40730 supply pin is used for testing and is recommended to adequately
decouple the microphone from noise on the power supply. DC blocking capacitors are required at the outputs of the microphone.
These capacitors create a high-pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 2.2 μF is recommended in Figure 7 because the input impedance of some codecs can be as low as 2 kΩ at their
highest PGA gain setting, which results in a high-pass filter corner frequency at 37 Hz.
MICBIAS
0.1µF
CODEC
VDD
2.2µF
MINIMUM
ICS-40730
IN+
IN−
OUTPUT+
OUTPUT−
GND
Figure 7. ICS-40730 Connected to a Differential-Input Codec
Page 9 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
AN-000012, Differential Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES
AN-100, MEMS Microphone Handling and Assembly Guide
AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
AN-1165, Op Amps for Microphone Preamp Circuits
AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit
Page 10 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS-40730 at a 1:1 ratio to the solder pads on the microphone package (see Figure 8.) Take care
to avoid applying solder paste to the sound hole in the PCB. Figure 9 shows a suggested solder paste stencil pattern layout.
The response of the ICS-40730 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the
microphone (1.5 mm, or 0.059 inch, in diameter). A 2 mm (0.080 inch) diameter for the hole is recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
Figure 8. Suggested PCB Land Pattern Layout
Figure 9. Suggested Solder Paste Stencil Pattern Layout
PCB MATERIAL AND THICKNESS
The performance of the ICS-40730 is not affected by PCB thickness. The ICS-40730 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 11 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
HANDLING INSTRUCTIONS
The ICS-40730 has a large sound hole, allowing for exposure of the diaphragm to the outside world. Care should be taken to any prevent
any particulate or objects from contaminating or impacting the diaphragm.
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
•
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
•
•
•
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force (>1 kg) to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 12 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
OUTLINE DIMENSIONS
Figure 10. 4-Terminal Chip Array Small Outline No Lead Cavity
4.72 mm × 3.76 mm × 3.5 mm
Dimensions shown in millimeters
DATE CODE
TRACEABILITY CODE
YYXXXX
730
PART NUMBER
PIN 1 INDICATON
Figure 11. Package Marking Specification (Top View)
ORDERING GUIDE
PART
TEMP RANGE
−40°C to +85°C 4-Terminal LGA_CAV
PACKAGE
QUANTITY
2,000
PACKAGING
13” Tape and Reel
ICS-40730
EV_ICS-40730-FX
Flex Evaluation Board
Page 13 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
REVISION HISTORY
REVISION DATE
REVISION DESCRIPTION
07/06/2017
05/19/2020
1.0
1.1
Initial Release
Corrected typos and updated pin polarity; updated Figure 2,
Table 4, and Figure 10 caption
Page 14 of 15
Document Number: DS-000139
Revision: 1.1
ICS-40730
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use,
or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves
the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes
no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any
claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to,
claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any
patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the
property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or
mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2020 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense
logo are trademarks of InvenSense, Inc. The InvenSense logo is a trademark of InvenSense Corporation. Other company and product names may be trademarks of the
respective companies with which they are associated.
©2020 InvenSense. All rights reserved.
Page 15 of 15
Document Number: DS-000139
Revision: 1.1
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