ICS-40310 [TDK]
MEMS麦克风(麦克风);
| 型号： | ICS-40310 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | MEMS麦克风(麦克风) |
| 文件： | 总14页 (文件大小：431K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICS-40310
Ultra-low Current, Low-Noise Microphone with Analog Output
GENERAL DESCRIPTION
APPLICATIONS
The ICS-40310* is a high-performance MEMS microphone
with a combination of very low power consumption, high SNR,
and a tiny package. Running from a 1 V supply, the ICS-40310
consumes only 16 µA of current while providing a 64 dB SNR
with an analog 4.5 kΩ impedance output. These features,
combined with the benefits of MEMS technology, reflow
solder compatibility, and a highly stable response over time
and temperature, make the ICS-40310 an ideal microphone
choice for always-on power-sensitive mobile devices.
The ICS-40310 is pin-compatible with the INMP504 and
INMP510.
•
•
•
•
•
Dedicated “AlwaysOn” Microphone
Smartphones
Wearable Computing Devices
Tablet Computers
Bluetooth Headsets
FEATURES
•
•
•
•
•
•
•
•
Low Current Consumption: 16 µA
Small Surface-Mount Package: 3.35 × 2.5 × 0.98 mm
High SNR of 64 dBA
Sensitivity of −37 dBV
0.9 V to 1.3 V Supply
Single-Ended Analog Output
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
ICS-40310
EV_ICS-40310-FX
TEMP RANGE
0°C to +70°C
—
PACKAGING
13” Tape and Reel
OUTPUT
AMPLIFIER
OUTPUT
POWER
ICS-40310
VDD GND
BOTTOM VIEW
TOP VIEW
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
InvenSense reserves the right to change the detail
specifications as may be required to permit improvements
in the design of its products.
Document Number: DS-ICS-40310-00
Revision: 1.2
Rev Date: 10/27/2014
www.invensense.com
ICS-40310
TABLE OF CONTENTS
General Description ..................................................................................................................................................................... 1
Applications ................................................................................................................................................................................. 1
Features ....................................................................................................................................................................................... 1
Functional Block Diagram ............................................................................................................................................................ 1
Ordering Information................................................................................................................................................................... 1
Table of Contents.................................................................................................................................................................................... 2
Specifications .......................................................................................................................................................................................... 3
Table 1. Electrical Characteristics ................................................................................................................................................ 3
Absolute Maximum Ratings.................................................................................................................................................................... 4
Table 2. Absolute Maximum Ratings ........................................................................................................................................... 4
ESD Caution ................................................................................................................................................................................. 4
Soldering Profile........................................................................................................................................................................... 5
Table 3. Recommended Soldering Profile*.................................................................................................................................. 5
Pin Configurations And Function Descriptions ....................................................................................................................................... 6
Table 4. Pin Function Descriptions............................................................................................................................................... 6
Typical Performance Characteristics....................................................................................................................................................... 7
Applications Information ........................................................................................................................................................................ 8
Output Impedance Consideration ............................................................................................................................................... 8
Codec and Amplifier Connections................................................................................................................................................ 8
Supporting Documents ........................................................................................................................................................................... 9
Evaluation Board User Guide....................................................................................................................................................... 9
Application Notes ........................................................................................................................................................................ 9
PCB Design And Land Pattern Layout ................................................................................................................................................... 10
PCB Material And Thickness ...................................................................................................................................................... 10
Handling Instructions............................................................................................................................................................................ 11
Pick And Place Equipment ......................................................................................................................................................... 11
Reflow Solder............................................................................................................................................................................. 11
Board Wash................................................................................................................................................................................ 11
Outline Dimensions............................................................................................................................................................................... 12
Ordering Guide .......................................................................................................................................................................... 13
Revision History ......................................................................................................................................................................... 13
Compliance Declaration Disclaimer........................................................................................................................................... 14
Page 2 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
SPECIFICATIONS
TABLE 1. ELECTRICAL CHARACTERISTICS
(TA = 0 to 70°C, VDD = 0.9 to 1.3 V, unless otherwise noted. All minimum and maximum specifications are guaranteed across
temperature and voltage and are specified in Table 1, unless otherwise noted. Typical specifications are not guaranteed.)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
PERFORMANCE
Directionality
Sensitivity
Signal-to-Noise Ratio (SNR)
Equivalent Input Noise (EIN)
Omni
−37
64
1 kHz, 94 dB SPL
−40
−34
dBV
dBA
20 Hz to 20 kHz, A-weighted
20 Hz to 20 kHz, A-weighted
Derived from EIN and maximum
acoustic input
30
dBA SPL
Dynamic Range
82
dB
Low frequency −3 dB point
High frequency −3 dB point
105 dB SPL
90
16
1.3
Hz
kHz
%
Frequency Response
1
Total Harmonic Distortion (THD)
2.5
217 Hz, 100 mVp-p square wave
superimposed on VDD = 1.0 V (A-
weighted)
Power Supply Rejection (PSR)
-81
dBV
1 kHz, 100 mVp-p sine wave
superimposed on VDD
10% THD
Power-Supply Rejection Ratio (PSRR)
−53
dB
Acoustic Overload Point
112
dB SPL
POWER SUPPLY
Supply Voltage (VDD
)
0.9
1.3
23
V
µA
VDD = 0.9 V
VDD = 1.3 V
16
Supply Current (IS)
19.5
25
µA
OUTPUT CHARACTERISTICS
Output Impedance
2.9
4.5
10.5
650
kΩ
Output DC Offset Voltage
Startup Time
500
570
mV
Output to within 0.2 dB of final
sensitivity
0.8
sec
μA
Output Current Limit
25
Maximum Output Voltage
mV
112 dB SPL input, RMS
112
Noise Floor
20 Hz to 20 kHz, A-weighted, RMS
−101
dBV
Note 1: See Figure 3 and Figure 4.
Page 3 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
ABSOLUTE MAXIMUM RATINGS
Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
TABLE 2. ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
−0.3 V to +1.45 V
Supply Voltage (VDD
)
160 dB SPL
Sound Pressure Level
Mechanical Shock
Vibration
10,000 g
Per MIL-STD-883 Method 2007, Test Condition B
Temperature Range
Biased
0°C to +70°C
−55°C to +150°C
Storage
ESD CAUTION
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can
discharge without detection. Although this
product features patented or proprietary
protection circuitry, damage may occur on
devices subjected to high energy ESD.
Therefore proper ESD precautions should be
taken to avoid performance degradation or
loss of functionality.
Page 4 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
1.25°C/sec max
1.25°C/sec max
Minimum Temperature
(TSMIN
Minimum Temperature
(TSMIN
100°C
100°C
200°C
)
Preheat
150°C
)
Time (TSMIN to TSMAX), tS 60 sec to 75 sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
1.25°C/sec
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
20 sec to 30 sec
3°C/sec max
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
3°C/sec max
5 min max
Ramp-Down Rate
Time +25°C (t25°C) to Peak Temperature 5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones
are also compatible with the J-STD-020 profile.
Page 5 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
GND
OUTPUT
3
VDD
TOP VIEW
(TERMINAL SIDE DOWN)
Not to Scale
Figure 2. Pin Configuration
TABLE 4. PIN FUNCTION DESCRIPTIONS
PIN NAME
FUNCTION
1
2
3
OUTPUT
GND
Analog Output Signal
Ground
VDD
Power Supply. Bypass to GND with a 0.1 µF capacitor.
Page 6 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
TYPICAL PERFORMANCE CHARACTERISTICS
15
10
5
15
10
5
0
0
-5
-5
-10
-10
-15
-20
-15
-20
-25
10
100
1k
10k
10
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 4. Typical Frequency Response (Measured)
Figure 3. Frequency Response Mask
0
-10
10
-20
-30
-40
1
-50
-60
0.1
100
1k
10k
90
95
100
105
110
115
120
FREQUENCY (Hz)
INPUT (dB SPL)
Figure 5. Power-Supply Rejection Ratio (PSRR) vs. Frequency
Figure 6. THD + N vs. Input Level
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
90
95
100
105
110
115
120
INPUT AMPLITUDE (dB SPL)
Figure 7. Linearity
Page 7 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
APPLICATIONS INFORMATION
OUTPUT IMPEDANCE CONSIDERATION
The ICS-40310 has an output impedance of 4.5 kΩ, which is significantly higher than the impedance of many other MEMS
microphones. This higher output impedance enables the microphone to operate with a very low supply current, but also needs to be
considered in the design of the signal chain following the microphone. The input impedance of the device to which the microphone’s
output is connected should be much higher than 4.5 kΩ to ensure no loss of signal amplitude through the signal chain. A minimum
input impedance of 47 kΩ is recommended for the device connected to the ICS-40310’s output. An input with this impedance will
reduce the microphone’s output signal level by only 0.8 dB.
CODEC AND AMPLIFIER CONNECTIONS
The ICS-40310 output can be connected to a dedicated codec microphone input (see Figure 8), or to a high input impedance gain
stage (see Figure 9). A 0.1 µF ceramic capacitor placed close to the ICS-40310 supply pin is used for testing and is recommended to
adequately decouple the microphone from noise on the power supply. An AC-coupling capacitor is required at the output of the
microphone. This capacitor creates a high-pass filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec or amplifier.
A codec input connected to the ICS-40310’s output should be high impedance, as described above in the Output Impedance
Consideration section. The size of the AC-coupling capacitor should be chosen such that the high-pass filter that it forms at the
codec’s input does not affect the microphone’s low frequency performance. For high-impedance (>47 kΩ) inputs, a 100 nF or larger
AC-coupling capacitor will be sufficient. See Figure 8 for a schematic of this connection.
Figure 9 shows the ICS-40310 connected to an op amp configured as a noninverting preamplifier.
MICBIAS
0.1 µF
ADC
OR
CODEC
VDD
0.1 µF
MINIMUM
ICS-40310
INPUT
OUTPUT
GND
Figure 8. ICS-40310 Connected to an ADC or Codec
0.9-1.3 V
GAIN = (R1 + R2)/R1
R1 R2
V
REF
0.1 µF
VDD
V
OUT
AMP
0.1 µF
ICS-40310
MINIMUM
OUTPUT
GND
47 kΩ
V
REF
Figure 9. ICS-40310 Connected to an Op Amp
Page 8 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
SUPPORTING DOCUMENTS
For additional information, see the following documents.
EVALUATION BOARD USER GUIDE
UG-325, Analog Output MEMS Microphone Flex Evaluation Board
APPLICATION NOTES
AN-1003, Recommendations for Mounting and Connecting the InvenSense Bottom-Ported MEMS Microphones
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing InvenSense Bottom-Port MEMS Microphones from Dust and Liquid Ingress
AN-1140, Microphone Array Beamforming
AN-1165, Op Amps for Microphone Preamp Circuits
AN-1181, Using a MEMS Microphone in a 2-Wire Microphone Circuit
Page 9 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
PCB DESIGN AND LAND PATTERN LAYOUT
It is recommended that the PCB land pattern for the ICS-40310 be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 10. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil
pattern layout is shown in Figure 11. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port
of the microphone. A minimum diameter of 0.5 mm is recommended.
1.52
0.68
1.22
0.61
0.61
Ø1.55
1.90
Ø0.95
0.90
Figure 10. PCB Land Pattern Layout (Dimensions shown in millimeters)
1.52
45° TYP
0.225
0.6
0.61
0.8
Ø1.55
1.22
Ø1.05
0.61
0.6
0.8
45° TYP
Figure 11. Suggested Solder Paste Stencil Pattern Layout (Dimensions shown in millimeters)
PCB MATERIAL AND THICKNESS
The performance of the ICS-40130 is not affected by PCB thickness. The ICS-40310 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 10 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
•
•
•
Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 1 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 11 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
OUTLINE DIMENSIONS
Figure 12. 3-Terminal Chip Array Small Outline No Lead Cavity
3.35 mm × 2.5 mm × 0.98 mm Body
Dimensions shown in millimeters
PIN 1 INDIC ATION
PART NUMBER
310
YYXXX
DATE CODE
LOT TR ACEABILITY
Figure 13. Package Marking Specification (Top View)
Page 12 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
ORDERING GUIDE
PART
TEMP RANGE
PACKAGE
QUANTITY
PACKAGING
ICS-40310
0°C to +70°C
3-Terminal LGA_CAV
10,000
13” Tape and Reel
EV_ICS-40310-FX
Flex Evaluation Board
REVISION HISTORY
REVISION DATE
REVISION DESCRIPTION
05/15/2014
06/04/2014
10/27/2014
1.0
1.1
1.2
Initial Release
Replaced Figure 12
Updated Package Drawing
Page 13 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
ICS-40310
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2014 InvenSense, Inc. All rights reserved.
Page 14 of 14
Document Number: DS-ICS-40310-00
Revision: 1.2
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