BU99022NUX-3 [ROHM]
I2C BUS 2kbit 2kbit 2ports serial EEPROM;
| 型号： | BU99022NUX-3 |
| 厂家： | 
ROHM |
| 描述： | I2C BUS 2kbit 2kbit 2ports serial EEPROM 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
| 文件： | 总26页 (文件大小：585K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
I2C BUS
2kbit + 2kbit 2ports serial EEPROM
BU99022NUX-3
●Description
BU99022NUX-3 series is 2kbit + 2kbit 2ports serial EEPROM of I2C BUS interface method.
●FEATURES
・ 2kbit + 2kbit 2ports serial EEPROM
・ Other devices than EEPROM can be connected to the same port, saving microcontroller port
・ 1.7V～5.5V single power source action most suitable for battery use
・ 1.7V～5.5Ｖwide limit of action voltage, possible FAST MODE 400KHz action
・ Page write mode useful for initial value write at factory shipment
・ Auto erase and auto end function at data write
・ Low current consumption
・ Write mistake prevention function
Write (write protect) function added (only port2 EEPROM)
Write mistake prevention function at low voltage
・ VSON008X2030 small package
・ Data rewrite up to 1,000,000 times
・ Data kept for 40 years
・ Noise filter built in SCL / SDA terminal
・ Shipment data all address FFh
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
1/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Absolute maximum rating (Ta=25℃)
●Memory cell characteristics (Ta=25℃, Vcc=1.7～5.5V)
Parameter
symbol
Limits
Unit
V
Parameter
Limits
Typ.
Unit
Impressed voltage
Permissible
VCC
-0.3～+6.5
Min.
1,000,000
40
Max
－
300 *1
mW
Write/Erase cycle *1
Data retention *1
cycles
Years
Pd
－
dissipation
Storage temperature range
ction temperature range
Terminal voltage
Tstg
Topr
‐
－65～+150
－40～+85
－0.3～Vcc+1.0*2
150
℃
℃
V
－
－
*
1
Not 100% TESTED
●Recommended operating condition
Junction Temperature *3
Tjmax
℃
Parameter
Power source voltage
Input voltage
Symbol
Vcc
Limits
1.7～5.5
0～Vcc
Unit
*1 When using at Ta=25℃ or higher, 3.0mW to be reduced per 1℃.
*2 The Max value of Terminal Voltage is not over 6.5V. When the pulse width is
50ns or less, the Min value of Terminal Voltage is not under -0.8V.
*3 Junction temperature at the storage condition.
V
VIN
●DC operating characteristics
(
Unless otherwise specified, Ta=－40～+85℃、VCC=1.7～5.5V)
Specification
Typ.
Parameter
Symbol
Unit
Test Condition
Min.
Max.
“H”input
voltage1
VIH1
VIL1
0.7Vcc
－
－
Vcc+1.0
0.3Vcc
V
V
“L”input
voltage1
－0.3*1
“L”output
voltage1
I
OL=3.0mA, 2.5V≦Vcc≦5.5V
VOL1
－
－
0.4
V
(SDA1,SDA2)
“L”output
voltage2
IOL=0.7mA, 1.7V≦Vcc＜2.5V
VOL2
ILI
－
－
－
－
0.2
1
V
(SDA1,SDA2)
Input leak
current
－1
－1
μA
μA
VIN=0～Vcc
Output leak
current
ILO
1
VOUT=0～Vcc (SDA1,SDA2)
Vcc1=5.5V,fSCL=400kHz, tWR=5ms,
Bytewrite Pagewrite
ICCw1
－
－
2.0
mA
mA
Vcc2=5.5V,fSCL=400kHz, tWR=5ms,
Bytewrite Pagewrite
ICCw2
ICCr1
ICCr2
－
－
－
－
－
－
2.0
0.5
0.5
Operating
Current
Vcc1=5.5V,fSCL=400kHz
Random read, current read, sequential read
Vcc2=5.5V,fSCL=400kHz
Random read, current read, sequential read
ISB1
－
－
－
－
2.0
2.0
Vcc1=5.5V, SDA1・SCL1=Vcc
Standby
current
μA
Vcc2=5.5V, SDA2・SCL2=Vcc
WP2=GND
ISB2
○This product is not designed for protection against radio active rays.
*1 When the pulse width is 50ns or less, it is -0.8V.
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
2/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●AC operating characteristic
(Unless otherwise specified, Ta=－40～+85℃, VCC=1.7～5.5V)
Limit
Typ.
－
Parameter
Symbol
Unit
Min.
－
Max.
400
－
SCL frequency
fSCL
tHIGH
tLOW
tR
kHz
μs
μs
μs
μs
μs
μs
ns
Data clock “HIGH“ time
Data clock “LOW“ time
SDA, SCL rise time *1*2
SDA, SCL fall time *1*2
Start condition hold time
Start condition setup time
Input data hold time
0.6
1.2
－
－
－
－
－
1.0
1.0
－
tF
－
－
tHD:STA
tSU:STA
tHD:DAT
tSU:DAT
tPD
0.6
0.6
0
－
－
－
－
－
Input data setup time
Output data delay time
Output data hold time
Stop condition setup time
100
0.1
0.1
0.6
1.2
－
－
－
ns
－
0.9
－
μs
μs
μs
μs
ms
μs
μs
μs
μs
tDH
－
tSU:STO
tBUF
－
－
Bus release time before
transfer start
－
－
Internal write cycle time
tWR
－
5
Noise removal valid period
(SDA, SCL terminal)
tI
－
－
0.1
－
WP hold time
tHD:WP
tSU:WP
tHIGH:WP
1.0
0.1
1.0
－
WP setup time
－
－
WP valid time
－
－
*1 Not 100% TESTED.
*2 It is recommended that tR/tF is less than 300ns fundamentally.
When tR/tF is more than 300ns and less than 1us, it is possible that other device on the
same bus are entered unintended start/stop condition. For prevent it, note in designing
the AC timing.
Condition
Input data level:VIL=0.2×Vcc VIH=0.8×Vcc
Input data timing refarence level: 0.3×Vcc/0.7×Vcc
Output data timing refarence level: 0.3×Vcc/0.7×Vcc
Rise/Fall time : ≦20ns
●Sync data input / output timing
tR
tF
tHIGH
70%
70%
30%
SCL
70% 70%
70%
30%
30%
30%
tLOW
tHD:DAT
tSU:DAT
DATA(n)
DATA(1)
70%
70%
70%
70%
70%
30%
ACK
D0 ACK
D1
SDA
(input)
tWR
tPD
tDH
tBUF
30%
30%
70%
30%
70%
30%
SDA
(output)
tSU:WP
tHD:WP
STOP CONDITION
○Input read at the rise edge of SCL
○Data output in sync with the fall of SCL
Fig.2 WP timing at write execution
Fig.1-(a) Sync data input / output timing
70%
70%
70%
DATA(n)
DATA(1)
70%
D1
ACK
ACK
D0
tSU:STA
tHD:STA
tSU:STO
tWR
tHIGH:WP
70%
30%
30%
70%
70%
STOP CONDITION
START CONDITION
Fig.1-(b) Start-stop bit timing
Fig.3 WP timing at write cancel
70%
70%
ACK
D0
write data
(n-th address)
tWR
STOP CONDITION START CONDITION
Fig.1-(c) Write cycle timing
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
3/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Block diagram
Vcc1 1
8
Vcc2
2Kbit EEPROM array
2Kbit EEPROM array
8bit
8bit
Data
register
Word
Address
decorder
Word
8bit
Data
register
Address
decorder
8bit
GND 2
7
6
5
WP2
SCL2
SDA2
Address register
Address register
start
start
stop
Control logic
stop
Control logic
SCL1 3
SDA1 4
Vcc level detect
High voltage gen.
High voltage gen.
Vcc level detect
Port1 EEPROM
Port2 EEPROM
Fig.4 Block Diagram
●Pin assignment and description
Function
Pin No.
Pin Name
Input/output
Connect the power source
－
－
1
2
3
4
5
6
7
8
Vcc1
GND
SCL1
SDA1
SDA2
SCL2
WP2
Reference voltage of all input/output,0V
Serial clock input for port1
Input
input/output
input/output
input
Serial data input /serial data output for port1 EEPROM
Serial data input /serial data output for port2 EEPROM
Serial clock input for port2 EEPROM
input
Write protect terminal for port2 EEPROM
Connect the power source
－
Vcc2
●Operating condition of port1 and port2 EEPROM
Vcc1
Vcc2
port1
port2
0V
0V
0V
Vcc
open
0V
×
×
×
○
○
○
×
×
×
×
○
×
×
○
×
×
○
×
0V
Vcc
Vcc
Vcc
open
open
open
Vcc
open
0V
Vcc
open
○ : operating possible
×: operating impossible
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
4/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Characteristic data (The following values are Typ. ones.)
6
5
4
3
2
1
0
6
5
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
4
3
SPEC
2
1
0
SPEC
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.6ꢀ'L' input voltage VIL1
Fig.5ꢀ'H' input voltage VIH1
(SCL1,SCL2,SDA1,SDA2,WP2)
(SCL1,SCL2,SDA1,SDA2,WP2)
1
1
0.8
0.6
0.4
0.2
0
Ta=-40℃
Ta=25℃
Ta=85℃
0.8
0.6
0.4
0.2
0
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
SPEC
0
1
2
3
4
5
6
0
1
2
3
4
5
6
L OUTPUT CURRENT : IOL(mA)
L OUTPUT CURRENT : IOL(mA)
Fig.8ꢀ'L' output voltage VOL2-IOL(Vcc=2.5V)
Fig.7 'L' output voltage VOL1-IOL(Vcc=1.7V)
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
5/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Characteristic data (The following values are Typ. ones.)
1.2
1.2
1
SPEC
SPEC
1
Ta=-40℃
Ta=25℃
Ta=85℃
0.8
0.8
0.6
0.4
0.2
0
Ta=-40℃
Ta=25℃
Ta=85℃
0.6
0.4
0.2
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLYVOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
ꢀ
Fig.9 Input leak current ILI
Fig.10ꢀOutput leak current ILO
(SCL1,SCL2,SDA1,SDA2,WP2)
(SDA1,SDA2)
0.6
2.5
2
SPEC
0.5
0.4
0.3
0.2
0.1
0
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
1.5
1
0.5
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.12 Current consumption at READ operation ICC
2
Fig.11 Current consumption at WRITE operation ICC
1
(fscl=400kHz)
(fscl=400kHz )
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
6/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Characteristic data (The following values are Typ. ones.)
10000
1000
100
10
2.5
SPEC
2
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
1.5
Ta=-40℃
Ta=25℃
Ta=85℃
1
0.5
0
1
0.1
0
1
2
3
4
SUPPLY VOLTAGE : Vcc(V)
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.13ꢀStanby operation ISB
Fig.14ꢀSCL frequency fSCL
1
0.8
0.6
0.4
0.2
0
1.5
1.2
0.9
0.6
0.3
0
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
0
1
2
3
4
5
6
0
1
2
3
4
SUPPLY VOLTAGE : Vcc（V）
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.16 Data clock Low PeriodꢀtLOW
Fig.15 Data clock High Period tHIGH
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
7/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Characteristic data (The following values are Typ. ones.)
1
1.1
0.9
Ta=-40℃
Ta=25℃
Ta=85℃
0.8
0.7
SPEC
SPEC
0.6
0.5
Ta=-40℃
Ta=25℃
Ta=85℃
0.4
0.3
0.2
0
0.1
-0.1
0
1
2
3
4
5
6
0
1
2
3
4
SUPPLY VOLTAGE : Vcc(V)
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.18ꢀStart Condition Setup TimeꢀtSU : STA
Fig.17 Start Condition Hold Time tHD : STA
50
0
50
0
SPEC
SPEC
-50
-50
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
-100
-150
-200
-100
-150
-200
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.20ꢀInput Data Hold Time ｔHD : DAT(LOW）
Fig.19ꢀInput Data Hold Time tHD : DAT（HIGH）
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
8/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Characteristic data (The following values are Typ. ones.)
300
200
300
200
100
0
SPEC
SPEC
100
0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
-100
-100
-200
-200
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig.21ꢀInput Data Setup Time ｔSU: DAT(HIGH)
Fig.22ꢀInput Data setup time tSU : DAT(LOW)
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
SPEC
SPEC
SPEC
0
1
2
3
4
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
SUPPLY VOLTAGE : Vcc(V)
Fig..23ꢀ'L' Data output delay time tPD
0
Fig.24 'H' Data output delay time ｔPD1
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
9/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Characteristic data (The following values are Typ. ones.)
2
1.5
1
2.0
1.5
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
1.0
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
0.5
0.5
0.0
-0.5
0
0
1
2
3
4
SUPPLY VOLTAGE : Vcc(V)
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.25 Stop condition setup time
Fig.26 BUS open time before transmissionꢀｔBUF
ꢀｔSU:STO
0.6
0.5
0.4
0.3
0.2
0.1
0
6
5
4
3
2
1
0
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
0
1
2
3
4
SUPPLY VOLTAGE : Vcc(V)
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.27 Internal writing cycle timeꢀｔWR
Fig.28 Noise reduction efection time tl（SCL
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
10/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Characteristic data (The following values are Typ. ones.)
0.6
0.5
0.6
0.5
0.4
0.3
0.2
0.1
0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
0.4
0.3
0.2
SPEC
SPEC
0.1
0
0
1
2
3
4
SUPPLY VOLATGE : Vcc(V)
5
6
0
1
2
3
4
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.30ꢀNoise resuction efecctive timeꢀｔｌ（SDA H）
Fig.29ꢀNoise reduction efective timeꢀtl（SCL L）
0.6
0.5
0.4
0.3
0.2
0.1
0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
SPEC
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC
0
1
2
3
4
SUPPLY VOLTAGE : Vcc(V)
5
6
0
1
2
3
4
5
6
SUPPLYVOLTAGE : Vcc(V)
Fig.31 Noise reduction efective time tl（SDA L）
Fig.32 WP data hold time tHD:WP
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
11/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●Characteristic data (The following values are Typ. ones.)
0.2
1.2
1.0
0.8
0.6
0.4
0.2
0.0
SPEC
0.1
SPEC
0.0
Ta=-40℃
Ta=25℃
Ta=85℃
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
Ta=-40℃
Ta=25℃
Ta=85℃
0
1
2
3
4
5
6
0
1
2
3
4
SUPPLYVOLTAGE : Vcc(V)
5
6
SUPPLY VOLTAGE : Vcc(V)
Fig.34 WP efective time tHIGH : WP
Fig.33 WP setup time tSU : WP
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© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
12/23
TSZ22111・14・001
Datasheet
BU99022NUX-3
●I2C BUS communication
○I2C BUS data communication
I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, and
acknowledge is always required after each byte. I2C BUS carries out data transmission with plural devices connected by 2
communication lines of serial data (SDA) and serial clock (SCL).
Among devices, there are “master” that generates clock and control communication start and end, and “slave” that is
controlled by address peculiar to devices. EEPROM becomes “slave”. And the device that outputs data to bus during data
communication is called “transmitter”, and the device that receives data is called “receiver”.
SDA
1-7
1-7
1-7
8
9
8
9
8
9
SCL
S
P
START ADDRESS R/W
condition
ACK
DATA
ACK
DATA
ACK
STOP
condition
Fig.35 Data transfer timing
○Start condition (Start bit recognition)
・Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL is
'HIGH' is necessary.
・This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this confdition is
satisfied, any command is executed.
○Stop condition (stop bit recongnition)
・Each command can be ended by SDA rising from 'LOW' to 'HIGH' when stop condition (stop bit), namely, SCL is 'HIGH'
○Acknowledge (ACK) signal
・This acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In
master and slave, the device (μ-COM at slave address input of write command, read command, and this IC at data
output of read command) at the transmitter (sending) side releases the bus after output of 8bit data.
・The device (this IC at slave address input of write command, read command, and μ-COM at data output of read
command) at the receiver (receiving) side sets SDA 'LOW' during 9 clock cycles, and outputs acknowledge signal (ACK
signal) showing that it has received the 8bit data.
・This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW'.
・Each write action outputs acknowledge signal (ACK signal) 'LOW', at receiving 8bit data (word address and write data).
・Each read action outputs 8bit data (read data), and detects acknowledge signal (ACK signal) 'LOW'. When acknowledge
signal (ACK signal) is detected, and stop condition is not sent from the master (μ-COM) side, this IC continues data
output. When acknowledge signal (ACK signal) is not detected, this IC stops data transfer, and recognizes stop cindition
(stop bit), and ends read action. And this IC gets in status.
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TSZ22111・14・001
Datasheet
BU99022NUX-3
●Write Command
○Write cycle
・Arbitrary data is written to EEPROM. When to write only 1 byte, byte write is normally used, and when to write continuous data of 2 bytes
or more, simultaneous write is possible by page write cycle. The maximum number of write bytes is up to 8.
S
T
A
R
T
W
R
I
T
E
S
T
O
P
SLAVE
AD D R ES S
W O R D
AD D R ES S
D A TA
SD A
LIN E
W A
7
W A
0
1
0
1
0
0
0
0
D 7
D 0
A
C
K
A
C
K
R
/
W
A
C
K
Fig.36 Byte write cycle (port1 EEPROM)
S
T
A
R
T
W
R
I
T
E
S
T
O
P
SLAVE
AD D R ES S
W O R D
AD D R ES S
D A TA
SD A
LIN E
W A
7
W A
0
1
0
1
0
＊
＊
＊
D 7
D 0
A
C
K
A
C
K
R
/
W
A
C
K
Fig.37 Byte write cycle (port2 EEPROM)
* D on’t C are
W
R
I
T
E
S
T
A
R
T
S
T
O
P
SLAVE
ADDRESS
DATA(n)
WORD
ADDRESS(n)
DATA(n+15)
SDA
LINE
1
D0
0
1
D0
D7
0
0
0 0
WA
7
WA
0
A
C
K
A
C
K
A
C
K
R
/
W
A
C
Fig.38 Page writKe cycle (port1 EEPROM)
*Don’t Care
S
W
S
T
A
R
T
R
I
T
O
P
DATA(n)
WORD
ADDRESS(n)
DATA(n+15)
SLAVE
ADDRESS
T
E
SDA
LINE
1
D0
0
1
D0
D7
0
WA
7
WA
0
* * *
A
C
K
R
/
W
A
C
K
A
C
K
A
C
K
*Don’t Care
Fig.39 Page write cycle (port2 EEPROM)
・During internal write execution, all input commands are ignored, therefore ACK is not sent back.
・Data is written to the address designated by word address (n-th address)
・By issuing stop bit after 8bit data input, write to memory cell inside starts.
・When internal write is started, command is not accepted for tWR (5ms at maximum).
・By page write cycle, the following can be written in bulk :
And when data of the maximum bytes or higher is sent, data from the first byte is overwritten.
・As for page write cycle , after the significant 5 bits of word address are designated arbitrarily, by continuing data input of
2 bytes or more, the address of insignificant 3 bits is incremented internally, and data up to 8 bytes can be written.
○Write protect (WP2) terminal
・Write protect (WP2) function
When WP2 terminal is set Vcc (H level), data rewrite of all addresses is prohibited (only port2 EEPROM).
When it is set GND (L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND,
or control it to H level or L level. Do not use it open.
In the case of use it as an ROM, it is recommended to connect it to pull up or Vcc.
At extremely low voltage at power ON / OFF, by setting the WP terminal 'H', mistake write can be prevented.
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TSZ22111・14・001
Datasheet
BU99022NUX-3
●Read Command
○Read cycle
Data of EEPROM is read. In read cycle, there are random read cycle and current read cycle.
Random read cycle is a command to read data by designating address, and is used generally.
Current read cycle is a command to read data of internal address register without designating address, and is used when to verify just
after write cycle. In both the read cycles, sequential read cycle is available, and the next address data can be read in succession.
W
R
I
T
E
S
T
A
R
T
S
T
A
R
T
R
E
A
D
S
T
O
S L A V E
A D D R E S S
S L A V E
A D D R E S S
W O R D
A D D R E S S (n)
D A T A (n)
P
S D A
L IN E
W A
7
W A
0
1
0
1
0
0
0
0
1
0
1
0
0
0
0
D 7
D 0
A
C
K
R
/
W
A
C
K
A
C
K
R
/
W
A
C
K
Fig.40 Random read cycle (port1 EEPROM)
It is necessary to input 'H' to
the last ACK.
W
R
I
T
E
S
T
A
R
T
S
R
E
A
D
S
T
O
T
A
R
T
S LA V E
A D D R E S S
S L A V E
A D D R E S S
W O R D
A D D R E S S (n)
D A T A (n)
P
S D A
L IN E
W A
7
W A
0
1
0
1
0
＊
＊ ＊
1
0
1
0
＊
＊ ＊
D 7
D 0
A
C
K
R
/
W
A
C
K
A
C
K
R
/
W
A
C
K
*Don’t Care
It is necessary to input 'H' to
the last ACK.
Fig.41 Random read cycle (port2 EEPROM)
S
S
T
A
R
T
R
E
A
D
S
T
O
T
A
R
T
R
E
S
T
O
SLAVE
ADDRESS
A
D
S LA V E
A D D R E S S
DATA(n)
P
D A TA (n)
P
SDA
LINE
S D A
LIN E
1
0
1
0
0
0
0
D7
D0
1
0
1
0
＊ ＊ ＊
D 7
D 0
A
C
K
R
/
W
A
C
K
A
C
R
/
W
A
C
K
K
*Don’t Care
Fig.42 Current read cycle (port1 EEPROM)
Fig.43 Current read cycle (port2 EEPROM)
S
T
A
R
R
E
A
D
S
T
O
SLAVE
ADDRESS
DATA(n)
DATA(n+x)
P
T
SDA
LINE
1
0
1
0
0
0
0
D7
D0
D7
D0
R
/
W
A
C
K
A
C
K
A
C
K
A
C
K
It is necessary to input 'H' to
the last ACK.
Fig.44 Sequential read cycle (port1 EEPROM)
S
R
E
A
S
T
O
P
T
A
R
T
SLAVE
ADDRESS
DATA(n)
DATA(n+x)
D
SDA
LINE
＊
＊ ＊
1
0
1
0
D7
D0
D7
D0
*Don’t Care
R
/
W
A
C
K
A
C
K
A
C
K
A
C
K
Fig.45 Sequential read cycle (port2 EEPROM)
・In random read cycle, data of designated word address can be read.
・When the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle),
data of incremented last read address (n)-th address, i.e., data of the (n+1)-th address is output.
・When ACK signal 'LOW' after D0 is detected, and stop condition is not sent from master (μ-COM) side, the next address data can be
read in succession.
・Read cycle is ended by stop condition where 'H' is input to ACK signal after D0 and SDA signal is started at SCL signal 'H' .
・When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output.
Therefore, read command cycle cannot be ended. When to end read command cycle, be sure input stop condition to input 'H' to ACK
signal after D0, and to start SDA at SCL signal 'H'.
・Sequential read is ended by stop condition where 'H' is input to ACK signal after arbitrary D0 and SDA is started at SCL signal 'H'.
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TSZ22111・14・001
Datasheet
BU99022NUX-3
●Software reset
Software reset is executed when to avoid malfunction after power on, and to reset during command input. Software reset has several kinds,
and 3 kinds of them are shown in the figure below. (Refer to Fig.46, Fig.47, Fig.48.) In dummy clock input area, release the SDA bus ('H'
by pull up). In dummy clock area, ACK output and read data '0' (both 'L' level) may be output from EEPROM, therefore, if 'H' is input forcibly,
output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices.
Dummy clock×14
13
Start×2
SCL
SDA
Normal command
Normal command
1
2
14
Fig.46 The case of dummy clock +START+START+ command input
Start
Dummy clock×9
Start
SCL
SDA
Normal command
Normal command
1
2
8
9
Fig.47 The case of START +9 dummy clocks +START+ command input
Start×9
SCL
Normal command
Normal command
1
2
3
7
8
9
SDA
Fig.48 START×9+ command input
※Start command from START input.
●Acknowledge polling
During internal write execution, all input commands are ignored, therefore ACK is not sent back. During internal automatic write execution
after write cycle input, next command (slave address) is sent, and if the first ACK signal sends back 'L', then it means end of write action,
while if it sends back 'H', it means now in writing. By use of acknowledge polling, next command can be executed without waiting for tWR =
5ms.
When to write continuously, R/W = 0, when to carry out current read cycle after write, slave address R/W = 1 is sent, and if ACK signal
sends back 'L', then execute word address input and data output and so forth.
During internal write,
ACK = HIGH is sent back.
First write command
S
T
A
R
T
S
T
A
R
T
S
S
T
A
C
K
H
A
T
A
R
T
Slave
Slave
C
K
H
Write command
O
…
address
address
P
tWR
Second write command
S
T
A
R
T
S
T
A
R
T
S
T
O
P
A
C
K
L
A
C
K
L
A
A
C
K
L
Slave
Word
Slave
C
…
Data
K
address
address
address
H
tWR
After completion of internal write,
ACK=LOW is sent back, so input
next word address and data in
succession.
Fig.49 Case to continuously write by acknowledge polling
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TSZ22111・14・001
Datasheet
BU99022NUX-3
●WP valid timing (write cancel)
WP2 is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP valid timing.
During write cycle execution, in cancel valid area, by setting WP2='H', write cycle can be cancelled. In both byte write cycle and page write
cycle, the area from the first start condition of command to the rise of clock to taken in D0 of data(in page write cycle, the first byte data) is
cancel invalid area.
WP input in this area becomes Don't care. The area from the rise of SCL to take in D0 to input the stop condition is cancel valid area. And,
after execution of forced end by WP, standby status gets in.
・Rise of D0 taken clock
・Rise of SDA
SCL
SCL
SDA
D1
D0 ACK
SDA D0
ACK
Enlarged view
Enlarged view
S
A
A
C
K
L
A
C
K
L
A
C
K
L
S
T
O
P
tWR
T
A
R
T
Slave
Word
SDA
WP2
D7 D6 D5
D2 D1 D0
D4 D3
C
K
L
Data
address
address
WP cancel invalid area
WP cancel valid area
Data is not written.
WP cancel invalid area
Fig.50 WP valid timing
●Command cancel by start condition and stop condition
During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Fig.51)
However, in ACK output area and during data read, SDA bus may output 'L', and in this case, start condition and stop condition cannot be
input, so reset is not available. Therefore, execute software reset. And when command is cancelled by start, stop condition, during random
read cycle, sequential read cycle, or current read cycle, internal setting address is not determined, therefore, it is not possible to carry out
current read cycle in succession. When to carry out read cycle in succession, carry out random read cycle.
SCL
SDA
1
0
1
0
Start condition
Stop condition
Fig.51 Case of cancel by start, stop condition during slave address input
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TSZ22111・14・001
Datasheet
BU99022NUX-3
●I/O peripheral circuit
○Pull up resistance of SDA terminal
SDA is NMOS open drain, so requires pull up resistance. As for this resistance value (RPU), select an appropriate value to this resistance
value from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, action frequency is limited. The smaller the RPU, the
larger the consumption current at action.
○Maximum value of RPU
The maximum value of RPU is determined by the following factors.
①SDA rise time to be determined by the capacitance (CBUS) of bus line of RPU and SDA should be tR or below.
And AC timing should be satisfied even when SDA rise time is late.
②The bus electric potential
A to be determined by input leak total (IL) of device connected to bus at output of 'H' to SDA bus and RPU
should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPROM including recommended noise margin 0.2Vcc.
VCC－ILRPU－0.2 VCC ≧ VIH
0.8VCC－VIH
IL
Ex.) VCC =3V IL=10μA VIH=0.7 VCC
BU99022NUX-3
SDA terminal
Microcontroller
RPU
∴
≦
RPU
from②
A
0.8×3－0.7×3
PU
R
≦
≦
10×10-6
IL
IL
Bus line
capacity
CBUS
［kΩ］
300
○ Minimum value of RPU
The minimum value of RPU is determined by the following factors.
When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA.
Fig.52 I/O circuit diagram
CC－ OL
V
V
OL
≦ I
PU
R
CC－ OL
V
V
PU
R
≧
∴
OL
I
②VOLMAX= should secure the input 'L' level (VIL) of microcontroller and EEPROM including recommended noise margin 0.1Vcc.
VOLMAX ≦ VIL－0.1 VCC
Ex.) VCC =3V、VOL=0.4V、IOL=3mA、microcontroller, EEPROM VIL=0.3Vcc
3－0.4
3×10
from①
RPU
≧
≧
-3
［Ω］
867
And
VOL=0.4［V］
VIL=0.3×3
=0.9［V］
Therefore, the condition ② is satisfied.
○Pull up resistance of SCL terminal
When SCL control is made at CMOS output port, there is no need, but in the case there is timing where SCL becomes 'Hi-Z', add a pull
up resistance. As for the pull up resistance, one of several kΩ ~ several ten kΩ is recommended in consideration of drive performance
of output port of microcontroller.
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Datasheet
BU99022NUX-3
●Cautions on microcontroller connection
○RS
In I2C BUS, it is recommended that SDA port is of open drain input/output. However, when to use CMOS input / output of tri state to SDA
port, insert a series resistance Rs between the pull up resistance Rpu and the SDA terminal of EEPROM. This is controls over current
that occurs when PMOS of the microcontroller and NMOS of EEPROM are turned ON simultaneously. Rs also plays the role of
protection of SDA terminal against surge. Therefore, even when SDA port is open drain input/output, Rs can be used.
ACK
SCL
RPU
RS
SDA
'H' output of microcontroller
'L' output of EEPROM
Over current flows to SDA line by 'H'
output of microcontroller and 'L'
output of EEPROM.
EEPROM
Microcontroller
Fig.53-(a) I/O circuit diagram
Fig.53-(b) Input / output collision timing
○Maximum value of Rs
The maximum value of Rs is determined by the following relations.
①SDA rise time to be determined by the capacity (CBUS) of bus line of Rpu and SDA should be tR or below.
And AC timing should be satisfied even when SDA rise time is late.
②The bus electric potential A to be determined by Rpu and Rs the moment when EEPROM outputs 'L' to SDA bus sufficiently secure
the input 'L' level (VIL) of microcontroller including recommended noise margin 0.1Vcc.
(VCC－
V
OL)×R
S
VCC
+
V
OL+0.1VCC≦VIL
R
PU+R
S
A
RPU
RS
V
IL－
V
OL－0.1VCC
VOL
R
S
×
R
PU
∴
≦
1.1VCC-VIL
IOL
Bus line
capacity
CBUS
Ex.）VCC=3VꢀVIL=0.3VCCꢀVOL=0.4VꢀRPU=20kΩ
0.3×3－0.4－0.1×3
20×103
R
S
×
≦
VIL
1.1×3－0.3×3
EEPROM
Micro controller
1.67［kΩ］
≦
Fig.54-(a) I/O Circuit Diagram
○Minimum value of Rs
The minimum value of Rs is determined by over current at bus collision. When over current flows, noises in power source line, and
instantaneous power failure of power source may occur. When allowable over current is defined as I, the following relation must be
satisfied. Determine the allowable current in consideration of impedance of power source line in set and so forth. Set the over current to
EEPROM 10mA or below.
CC
V
≦
≧
I
S
R
RPU
RS
'L'output
CC
V
S
∴ R
I
Over current I
Ex.) VCC=3V, I=10mA
'H' output
3
S
R
≧
≧
10×10-3
EEPROM
Microcontroller
300［Ω］
Fig.54-(b) I/O circuit diagram
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TSZ22111・14・001
Datasheet
BU99022NUX-3
●I2C BUS input / output circuit
○Input (SCL1,SCL2,WP2)
Fig.55-(a) Input pin circuit diagram
○Input / output (SDA1,SDA2)
Fig.55-(b) Input / output pin circuit diagram
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Datasheet
BU99022NUX-3
●Notes on power ON
At power on, in IC internal circuit and set, Vcc rises through unstable low voltage area, and IC inside is not completely reset, and
malfunction may occur. To prevent this, functions of POR circuit and LVCC circuit are equipped. To assure the action, observe the following
conditions at power on.
1. Set SDA = 'H' and SCL ='L' or 'H’
2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit.
tR
VCC
Recommended conditions of tR, tOFF,Vbot
tR
tOFF
Vbot
10ms or below 10ms or larger 0.3V or below
100 or below 10ms or larger 0.2V or below
tOFF
Vbot
0
Fig.56
Rise waveform diagram
3. Set SDA and SCL so as not to become 'Hi-Z'.
When the above conditions 1 and 2 cannot be observed, take the following countermeasures.
a) In the case when the above condition 1 cannot be observed. When SDA becomes 'L' at power on .
→Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'.
VCC
tLOW
SCL
SDA
After Vcc becomes stable
After Vcc becomes stable
tDH tSU:DAT
tSU:DAT
Fig.57 When SCL= 'H' and SDA= 'L'
Fig.58 When SCL='L' and SDA='L'
ｂ) In the case when the above condition 2 cannot be observed.
→After power source becomes stable, execute software reset(P15).
ｃ) In the case when the above conditions 1 and 2 cannot be observed.
→Carry out a), and then carry out b).
●Low voltage malfunction prevention function
LVCC circuit prevents data rewrite action at low power, and prevents wrong write. At LVCC voltage (Typ. =1.2V) or below, it prevent data
rewrite.
●Vcc noise countermeasures
○Bypass capacitor
When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a by
pass capacitor (0.1μF) between IC Vcc and GND. At that moment, attach it as close to IC as possible.
And, it is also recommended to attach a bypass capacitor between board Vcc and GND.
●Cautions on use
(1) Described numeric values and data are design representative values, and the values are not guaranteed.
(2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. In the
case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static
characteristics and transition characteristics and fluctuations of external parts and our LSI.
(3) Absolute maximum ratings
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI may be
destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear exceeding the absolute
maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum
ratings should not be impressed to LSI.
(4) GND electric potential
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of GND terminal.
(5) Terminal design
In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin.
(6) Terminal to terminal shortcircuit and wrong packaging
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may destruct LSI. And in
the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND owing to foreign matter, LSI may be
destructed.
(7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.
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TSZ22111・14・001
Datasheet
BU99022NUX-3
● Revision history
Date
Revision
001
Changes
19-Dec-2011
Initial Document Release
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TSZ22111・14・001
Datasheet
BU99022NUX-3
●Ordering information
TR
B U 9 9 0 2 2 N U X - 3
Package
NUX : VSON008X2030
Packaging and forming specification
TR : Embossed tape and reel
●Physical Dimantion. Tape abd Reel information
VSON008X2030
<Tape and Reel information>
2.0 0.1
Tape
Embossed carrier tape
4000pcs
Quantity
TR
1PIN MARK
S
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
0.08
S
1.5 0.1
0.5
C0.25
1
4
8
5
0.25
Direction of feed
1pin
+0.05
−0.04
0.25
Reel
Order quantity needs to be multiple of the minimum quantity.
∗
(Unit : mm)
●Marking Diagram
2.0±0.1
BU99022NUX-3
Product Name:
022
LOT NO．
1PIN MARK
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
TSZ02201-0R2R0G100010-1-2
2011.12.19 Rev.001
23/23
TSZ22111・14・001
Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
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