BU9972GU-E2 [ROHM]
Color Signal Encoder, PBGA63, 0.50 MM PITCH, ROHS COMPLIANT, VBGA-63;
| 型号： | BU9972GU-E2 |
| 厂家： | 
ROHM |
| 描述： | Color Signal Encoder, PBGA63, 0.50 MM PITCH, ROHS COMPLIANT, VBGA-63 编码器 商用集成电路 |
| 文件： | 总6页 (文件大小：266K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Digital Video Encorders
CPU bus interface
BU9972GU
No.09067EAT01
●Description
BU9972GU is a digital video encoder IC for CPU bus interface.
It allows captured images (e.g. downloaded or on mobile phones) to be viewed on a TV monitor. In addition, a digital filter is
built in for high image quality, and both multifunction and simple types are available for greater compatibility.
●Features
Video Format： NTSC-M, PAL-B/D/G/H/I standard compliant
Input Image Data Format： YCbCr 4:2:2 8 bits/16 bits, RGB 16 bits (R: 5 bits/G: 6 bits/B: 5 bits)
BUS I/F： Master / Slave mode Support
10-bit Video-DAC Built-in, PLL Built-in
Image Expansion Function, Image Display Position Adjustment Function
A
measured
value at
mounting on
● Absolute Maximum Ratings (Ta = 25℃)
Parameter
Symbol
DVDD
PVDD
AVDD
IOVDD
Pd
Ratings
-0.2 ～ 2.5
-0.2 ～ 2.5
-0.2 ～ 4.5
-0.2 ～ 4.5
570
Unit
V
a
board
Size:
Digital supply voltage
PLL supply voltage
DAC supply voltage
I/O supply voltage
（
V
114.3mm
76.2mm
x
x
V
1.6mm,
4-layer
implemented
V
）
Power dissipation (*1)
Storage temperature range
mW
Tstg
-25 ～ ＋125
℃
(*1) A measured value at mounting on a board （Size: 114.3mm x 76.2mm x 1.6mm, 4-layer） implemented
in relation to SEMI.
In the case of exceeding Ta=25℃, 5.7mW should be reduced per 1℃.
* The radiation-resistance design is not carried out.
* Operation is not guaranteed.
●Operating Conditions (Ta= -20～＋70℃)
Parameter
Min.
1.7
1.7
2.7
1.7
2.7
Typ.
1.8
Max.
1.9
1.9
3.0
1.9
3.0
Symbol
DVDD
PVDD
AVDD
Unit
V
Digital supply voltage
1.8
PLL supply voltage
DAC supply voltage
V
2.85
1.8
V
V
I/O supply voltage (*1)
IOVDD
2.85
V
(*1) Usage limitation: IOVDD = 1.8V±0.1V or 2.85V±0.15V
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.03 - Rev.A
1/5
Technical Note
BU9972GU
●Electrical characteristics
（Unless otherwise noted, Ta=25℃、DVDD=PVDD=1.8V、IOVDD=2.85V、AVDD=2.85V、DVSS=PVSS=IOVSS=AVSS=GND=0V）
Parameter
Digital Operating Current
I/O Operating Current
Digital Static Current
Symbol
IDDCO
IDDIO
Mi.
Typ.
40
5
Max.
60
10
Unit
Conditions
-
-
-
mA Ta=25℃ (*1)
mA Ta=25℃ (*1)
μA RESETB=GND、Ta=25℃
ISTDCO
10
25
RESETB=GND、Ta=25℃
Fix input terminals to GND.
I/O Static Current
H Input Voltage
L Input Voltage
ISTDIO
VIH
-
5
-
15
μA
IOVDD
*0.8
IOVDD
+0.2
IOVDD
*0.2
V
V
VIL
-0.2
-
H/L Input Leak Current
H Input Current
IIL
IIHT
-3
10
-
-
3
200
μA VIN=IOVDD/GND
μA VIN=IOVDD
IOVDD
-0.4
IOVSS
H Output Voltage
VOH
-
IOVDD
V
IOH=2mA
IOL=2mA
L Output Voltage
VOL
RES
IDDV
ISTV
IDDP
ISTP
-
-
38
1
0.5
1
0.4
10
45
5
1.5
5
V
Bits
Video DAC Resolution
Video DAC Operating Current
Video DAC Static Current
PLL Operating Current
PLL Static Current
-
-
-
-
-
mA RL=37.5Ω、RIREF=1.2kΩ
μA RESETB=GND、Ta=25℃
mA
μA RESETB=GND、Ta=25℃
(*1) A measured value at QVGA color-bar image output in expand mode.
●Block diagram
DATA[15:0]
Line Memory
CS
VS
Color-bar
Generator
Memory Control
REQ_HS
FIELD
Host
I/F
Y
Gamma
Correction
PIXCLK_WE
TRAP
LPF
Interpolation
x2
x1
Over-
Cb
Cr
10-bit
DAC
sampling
VOUT
LPF
LPF
XIN
Clock
IREF
Generator
XOUT
Subcarrier
Generator
PLL
MCLKO
Serial I/F
RESETB
PWCTL
SCLK
SDI
TEST[6:0]
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© 2009 ROHM Co., Ltd. All rights reserved.
2009.03 - Rev.A
2/5
Technical Note
BU9972GU
●Terminal functions
Term
Terminal
Description
Term
Terminal
Description
Term
Terminal
Description
Test pin.
Pixel data input.
Connect to ground.
Data request Horizontal
1
2
TEST0
N.C.
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
DATA14
DATA13
DATA12
DATA11
GND
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
GND
/
No Connection.
Test pin.
Pixel data input.
Pixel data input.
Pixel data input.
Connect to ground.
Pixel data input.
Pixel data input.
Pixel data input.
Connect to ground.
Pixel data input.
Connect to ground.
Connect to ground.
Digital power supply.
Pixel data input.
Pixel data input.
Pixel data input.
Pixel data input.
Pixel data input.
Connect to ground.
Pixel data input.
Pixel data input.
Pixel clock input.
REQ_HS
GND
synchronizing signal.
Connect to ground.
3
TEST1
TEST2
GND
Test pin.
Vertical synchronizing signal.
Digital power supply.
Connect to ground.
Connect to ground.
Connect to ground.
4
VS
Connect to ground.
Serial clock.
5
DVDD
GND
6
SCLK
SDI
DATA10
DATA9
DATA8
GND
Serial data.
7
DVSS
GND
Test pin.
8
TEST3
GND
Identify whether input pixel
data is valid or not.
Connect to ground.
PLL ground.
9
CS
Field identification signal.
Power down control input.
Test pin.
10
11
12
13
14
15
16
17
18
19
20
21
22
PVSS
GND
DATA7
DVSS
FIELD
PWCTL
TEST4
TEST5
TEST6
AVSS
IREF
Connect to ground.
Digital power supply.
PLL power supply.
System clock signal output.
DVDD
PVDD
MCLKO
XIN
GND
Test pin.
DVDD
Test pin.
DATA6
DATA5
DATA4
DATA3
DATA2
GND
PLL reference clock output /
connect to oscillator.
DAC ground.
Reference voltage output
for DAC.
Oscillator output.
I/O power supply.
Connect to ground.
Connect to ground.
Connect to ground.
System reset input.
Pixel data input.
XOUT
IOVDD
GND
DAC power supply.
Connect to ground.
Analog composite video
Connect to ground.
AVDD
GND
IOVSS
GND
VOUT
GND
DATA1
DATA0
PIXCLK_WE
RESETB
DATA15
●Package outline
●Ball assignment （Bottom View）
17
18
22
24
27
29
31
33
H
G
F
IOVDD
GND
GND
GND
DVSS
DATA15
DATA13
DATA9
30
15
16
20
21
25
32
34
BU9972
XIN
XOUT
GND
RESETB
GND
DATA12
DATA8
DATA7
13
14
19
23
26
35
36
38
PVDD
MCLKO
IOVSS
DATA14
DVDD
DATA6
DATA11
DATA4
Lot No.
11
9
10
12
28
39
37
40
E
DATA3
DATA5
GND
GND
PVSS
DVDD
DATA10
DATA2
8
5
7
60
44
42
41
43
D
C
B
A
DATA1
DATA0
TEST3
GND
SDI
IREF
PIXCLK_WE
GND
6
4
3
58
55
46
45
51
PWCTL
REQ_HS
GND
SCLK
TEST2
TEST1
TEST6
DVSS
64
62
57
53
52
48
47
GND
GND
TEST5
CS
GND
VS
GND
1
63
61
59
56
54
50
49
TEST0
VOUT
AVDD
AVSS
TEST4
FIELD
GND
DVDD
8
6
1
4
5
7
2
3
VBGA063T050 (Unit：mm)
www.rohm.com
2009.03 - Rev.A
3/5
© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BU9972GU
●Cautions on use
（１）Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making
impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed,
consideration should be given to take physical safety measures including the use of fuses, etc.
（２）Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed
under the conditions of each parameter.
（３）Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection,
such as mounting an external diode between the power supply and the IC’s power supply terminal.
（４）Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply
and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital
block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to
the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an
electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity
dropout at a low temperature, thus determining the constant.
（５）GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no
terminals are at a potential lower than the GND voltage including an actual electric transient.
（６）Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore,
if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can
break down.
（７）Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
（８）Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge
from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF
the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it
from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation
and the storage of the set PCB.
（９）Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause
interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle
the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate.
Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
（１０）Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND
pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large
current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as
well.
（１１）External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due
to DC bias and changes in the capacitance due to temperature, etc.
www.rohm.com
2009.03 - Rev.A
4/5
© 2009 ROHM Co., Ltd. All rights reserved.
Technical Note
BU9972GU
●Ordering part number
B U
9
9
7
2
G U
-
E
2
Part No.
Part No.
Package
GU
Packaging and forming specification
E2: Embossed tape and reel
VBGA063T050
VBGA063T050
<Tape and Reel information>
1PIN MARK
5.0 0.1
Tape
Embossed carrier tape (with dry pack)
Quantity
2500pcs
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
S
(
)
0.08
63- 0.3 0.05
S
P=0.5×7
0.75 0.1
0.5
φ
A
φ
M
0.05 S AB
H
G
F
B
E
D
C
B
A
1 2 3 4 5 6 7 8
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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2009.03 - Rev.A
5/5
© 2009 ROHM Co., Ltd. All rights reserved.
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
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© 2009 ROHM Co., Ltd. All rights reserved.
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