BD6519FJ-E2 [ROHM]
Buffer/Inverter Based Peripheral Driver, 1 Driver, 0.6A, PDSO8, ROHS COMPLIANT, SOP-8;
| 型号： | BD6519FJ-E2 |
| 厂家： | 
ROHM |
| 描述： | Buffer/Inverter Based Peripheral Driver, 1 Driver, 0.6A, PDSO8, ROHS COMPLIANT, SOP-8 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总24页 (文件大小：767K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
1 Channel High Side Switch ICs
1.1A Current Limit High Side Switch ICs
BD6519FJ
General Description
Key Specifications
BD6519FJ is single channel high side switch IC with
over-current protection for
Input Voltage Range:
Continuous Current Load:
ON Resistance (VDD=5V)
Over-Current Threshold:
Standby Current:
3.0V to 5.5V
0.5A
100mΩ(Typ)
Universal Serial Bus
(USB) power supply line. These are low
ON-Resistance N-Channel power MOSFETs with low
supply current. These ICs have built-in over-current
protection circuit, thermal shutdown circuit, under
voltage lockout and soft-start circuit.
0.7A (Min), 1.6A (Max)
0.01μA (Typ)
Operating Temperature Range:
-40°C to +85°C
Package
W(Typ) D(Typ) H (Max)
Features
Built-in Low ON-Resistance Nch MOSFET
(Typ = 100mΩ)
Control Input Logic: Active-Low
Soft-Start Circuit
Over-Current Protection
Thermal Shutdown
Under Voltage Lockout Function
Open Drain Error Flag Output
Reverse-Current Protection when Switch OFF
SOP-J8
4.90mm x 6.00mm x 1.65mm
Applications
USB Hub in Consumer Appliances, PC, PC Peripheral
Equipment
Typical Application Circuit
5V(Typ)
VBUS
GND
VDD
OUT
OUT
D+
+
CIN
CL
-
D-
VDD
OUT
GND
CTRL
FLAG
Lineup
Over-Current Threshold
Typ
1.1A
Control Input
Logic
Package
Orderable Part Number
Min
Max
0.7A
1.6A
Low
SOP-J8 Reel of 2500 BD6519FJ-E2
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
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BD6519FJ
Block Diagram
GND
VDD
OUT
OUT
OUT
FLAG
Charge
pump
UVLO
OCD
VDD
Gate logic
TSD
CTRL
Pin Configuration
TOP VIEW
OUT
1
2
3
4
8
7
6
5
GND
OUT
VDD
VDD
OUT
FLAG
CTRL
Pin Description
Pin No.
1
Symbol
GND
I / O
I
Pin Function
Ground pin
Power supply input.
Input terminal to power switch and power supply terminal of the internal
circuit.
When in use, connect each pin outside.
Enable input.
Power switch on at low level.
High level input > 2.5V, low level input < 0.7V.
Error flag output.
2, 3
4
VDD
I
I
CTRL
5
FLAG
OUT
O
O
Low at over-current and thermal shutdown.
Open drain output.
Power switch output.
When in use, connect each pin outside.
6, 7, 8
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BD6519FJ
Absolute Maximum Ratings
Parameter
Symbol
VDD
Limit
Unit
V
Supply Voltage
-0.3 to +6.0
-0.3 to +6.0
-0.3 to +6.0
10
CTRL Voltage
VCTRL
VFLAG
IFLAG
VOUT
Tstg
V
FLAG Voltage
V
FLAG Current
mA
V
OUT Voltage
-0.3 to +6.0
-55 to +150
0.67 (Note 1)
Storage Temperature
Power Dissipation
°C
W
Pd
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass-epoxy PCB. Derating : 5.4mW/ oC above Ta=25 oC.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Rating
Parameter
Symbol
Unit
Min
3.0
-40
0
Typ
Max
5.5
Operating Voltage
VDD
Topr
ILO
-
-
-
V
Operating Temperature
Continuous Output Current
+85
500
°C
mA
Electrical Characteristics
(Unless otherwise specified, VDD = 5.0V, Ta = 25°C)
Limit
Typ
90
Parameter
Symbol
IDD
Unit
Conditions
Min
Max
Operating Current
Standby Current
-
140
2
μA
μA
V
V
CTRL= 0V, OUT = OPEN
-
0.01
-
VCTRL= 5V, OUT = OPEN
High Input
2.5
-
CTRL Input Voltage
VCTRL
-
-
0.7
+1.0
450
1
V
Low Input
CTRL Input Current
ICTRL
RFLAG
IL_FLAG
tD_FLAG
-1.0
+0.01
180
0.01
2.5
100
140
-
μA
Ω
VCTRL = 0V or VCTRL = 5V
IFLAG = 1mA
FLAG Output Resistance
FLAG Output Leak Current
FLAG Output Delay
-
-
μA
ms
mΩ
mΩ
A
VFLAG = 5V
-
8
-
140
180
1.6
10
4
VDD = 5V, IOUT = 500mA
VDD = 3.3V, IOUT = 500mA
VDD = 5V , VOUT = 0V
VCTRL = 5V
ON-Resistance
RON
-
0.6
-
Short Circuit Output Current
Output Leak Current
ISC
ILEAK
tON1
-
μA
ms
ms
μs
μs
°C
A
Output Rise Time
-
1
Output Turn ON Delay Time
Output Fall Time
tON2
-
1.3
1
6
RL = 10Ω , CL = OPEN
Tj Increase
tOFF1
tOFF2
TTS
-
20
20
-
Output Turn OFF Delay Time
Thermal Shutdown Threshold
Over-Current Threshold
-
3
-
135
1.1
2.5
2.3
ITH
0.7
2.3
2.1
1.6
2.7
2.5
VTUVH
VTUVL
V
VDD Increasing
VDD Decreasing
UVLO Threshold
V
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BD6519FJ
Measurement Circuit
VDD
VDD
A
1μF
1μF
GND
OUT
GND
OUT
VDD
VDD
CTRL
OUT
OUT
FLAG
VDD
VDD
OUT
OUT
FLAG
RL
CL
CTRL
VCTRL
VCTRL
A. Operating Current
B. CTRL Input Voltage, Output Rise / Fall Time
VDD
VDD
VDD
DD
V
10k
1μF
1μF
GND
IFLAG
GND
VDD
OUT
OUT
OUT
VDD
VDD
OUT
VDD
OUT
OUT
CTRL
FLAG
CTRL
FLAG
CL
IOUT
VCTRL
VCTRL
C. ON-Resistance, Over-Current Detection
D. FLAG Output Low Voltage
Figure 1. Measurement Circuit
Timing Diagram
tOFF1
tON1
VOUT
90%
90%
10%
10%
tOFF2
t
ON2
VCTRL
V
CTRL
VCTRL
Figure 2. Timing Diagram
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Typical Performance Curves
120
120
100
80
60
40
20
0
Ta=25°C
VDD=5.0V
100
80
60
40
20
0
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
Supply Voltage : VDD[V]
Figure 4. Operating Current vs
Ambient Temperature
(CTRL Enable)
Figure 3. Operating Current vs
Supply Voltage
(CTRL Enable)
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
Ta=25°C
VDD=5.0V
-50
0
50
100
2
3
4
5
6
Ambient Temperature : Ta[°C]
Supply Voltage : VDD[V]
Figure 5. Standby Current vs
Supply Voltage
Figure 6. Standby Current vs
Ambient Temperature
(CTRL Disable)
(CTRL Disable)
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BD6519FJ
Typical Performance Curves – continued
2.5
2.5
2.0
1.5
1.0
0.5
0.0
VDD=5.0V
Ta=25°C
2.0
Low to High
High to Low
Low to High
1.5
High to Low
1.0
0.5
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VDD[V]
Ambient Temperature : Ta[°C]
Figure 7. CTRL Input Voltage vs
Supply Voltage
Figure 8. CTRL Input Voltage vs
Ambient Temperature
250
200
150
100
50
250
200
150
100
50
VDD=5.0V
Ta=25°C
0
0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VDD[V]
Ambient Temperature : Ta[°C]
Figure 9. FLAG Output Resistance vs
Supply Voltage
Figure 10. FLAG Output Resistance vs
Ambient Temperature
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BD6519FJ
Typical Performance Curves – continued
200
200
150
100
50
Ta=25°C
VDD=5.0V
150
100
50
0
0
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
Supply Voltage : V [V]
DD
Figure 12. ON-Resistance vs
Ambient Temperature
Figure 11. ON-Resistance vs
Supply Voltage
2.0
1.5
1.0
0.5
0.0
2.0
1.5
1.0
0.5
0.0
Ta=25°C
VDD=5.0V
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
S
u
p
p
ly
V
o
lta
g
e
: VDD[V]
Figure 13. Short Circuit Output Current vs
Supply Voltage
Figure 14. Short Circuit Output Current vs
Ambient Temperature
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BD6519FJ
Typical Performance Curves – continued
5.0
5.0
4.0
3.0
2.0
1.0
0.0
VDD=5.0V
Ta=25°C
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
Supply Voltage : VDD[V]
Figure 16. FLAG Output Delay vs
Ambient Temperature
Figure 15. FLAG Output Delay vs
Supply Voltage
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
VDD=5.0V
Ta=25°C
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
Supply Voltage : VDD[V]
Figure 17. Output Rise Time vs Supply
Voltage
Figure 18. Output Rise Time vs
Ambient Temperature
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BD6519FJ
Typical Performance Curves – continued
5.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VDD=5.0V
4.0
3.0
2.0
1.0
0.0
2
3
4
5
6
-50
0
50
100
Supply Voltage : VDD[V]
Ambient Temperature : Ta[°C]
Figure 19. Output Turn ON Delay Time vs
Supply Voltage
Figure 20. Output Turn ON Delay Time vs
Ambient Temperature
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25°C
VDD=5.0V
2
3
4
5
6
-50
0
50
100
Ambient Temperature : Ta[°C]
Supply Voltage : VDD[V]
Figure 21. Output Fall Time vs
Supply Voltage
Figure 22. Output Fall Time vs
Ambient Temperature
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BD6519FJ
Typical Performance Curves – continued
5.0
5.0
4.0
3.0
2.0
1.0
0.0
VDD=5.0V
Ta=25°C
4.0
3.0
2.0
1.0
0.0
-50
0
50
100
2
3
4
5
6
Ambient Temperature : Ta[°C]
Supply Voltage : VDD[V]
Figure 24. Output Turn OFF Delay Time vs
Ambient Temperature
Figure 23. Output Turn OFF Delay Time vs
Supply Voltage
1.0
0.8
0.6
0.4
0.2
0.0
2.7
2.6
2.5
2.4
2.3
2.2
2.1
VTUVH
VTUVL
-50
0
50
100
-50
0
50
100
Ambient Temperature : Ta[°C]
Ambient Temperature : Ta[°C]
Figure 26. UVLO Hysteresis Voltage vs
Ambient Temperature
Figure 25. UVLO Threshold Voltage vs
Ambient Temperature
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BD6519FJ
Typical Wave Forms
VCTRL
(1V/div.)
VCTRL
(1V/div.)
VDD=5V
RL=10Ω
CL=147μF
VDD=5V
RL=10Ω
CL=147μF
VOUT
(1V/div.)
VOUT
(1V/div.)
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VFLAG
(1V/div.)
VFLAG
(1V/div.)
TIME(1ms/div.)
TIME(1ms/div.)
Figure 28. Output Fall Characteristic
Figure 27. Output Rise Characteristic
VCTRL
(1V/div.)
VOUT
(1V/div.)
VDD=5V
RL=10Ω
IOUT
0.2A/div.)
IOUT
(0.2A/div.)
CL=330μF
CL=220μF
CL=147µF
CL=47μF
VFLAG
(1V/div.)
VFLAG
(1V/div.)
VDD=5V
TIME(20ms/div.)
TIME(0.5ms/div.)
Figure 29. Inrush Current Characteristic
Figure 30. Over-Current Response
Ramped Load
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BD6519FJ
Typical Wave Forms – continued
VCTRL
(1V/div.)
VOUT
(1V/div.)
VOUT
(1V/div.)
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
VFLAG
(1V/div.)
VFLAG
(1V/div.)
VDD=5V
VDD=5V
CL=100μF
TIME(2ms/div.)
TIME (1ms/div.)
Figure 31. Over-Current Response
Ramped Load
Figure 32. Over-Current Response
Enable to Short Circuit
VOUT
(1V/div.)
VOUT
(1V/div.)
VDD=5V
CL=100μF
Thermal Shutdown
IOUT
(0.5A/div.)
IOUT
(0.5A/div.)
VFLAG
(1V/div.)
VDD=5V
CL=100μF
VFLAG
(1V/div.)
TIME (200ms/div.)
TIME (1ms/div.)
Figure 34. Over-Current Response
Output Short Circuit at Enable
Figure 33. Over-Current Response
Output Short Circuit at Enable
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BD6519FJ
Typical Wave Forms – continued
VDD
(V/div.)
VDD
(V/div.)
VOUT
(1V/div.)
VOUT
(1V/div.)
IOUT
(0.2A/div.)
IOUT
(0.2A/div.)
RL=10Ω
CL=147μF
VFLAG
(1V/div.)
VFLAG
(1V/div.)
RL=10Ω
CL=147μF
TIME (10ms/div.)
TIME (10ms/div.)
Figure 36. UVLO
VDD Decreasing
Figure 35. UVLO
VDD Increasing
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BD6519FJ
Typical Application Circuit
IN
Regulator
OUT
5V(Typ)
VBUS
GND
VDD
VDD
OUT
OUT
OUT
10k to
100kΩ
D+
USB
Controller
+
-
CIN
CL
D-
GND
CTRL FLAG
Application Information
When excessive current flows due to output short circuit or so, ringing occurs by inductance of power source line and IC.
This may cause bad effects on IC operations. In order to avoid this case, a bypass capacitor should be connected across by
VDD terminal and GND terminal of IC. 1μF or higher is recommended.
Pull-up FLAG output by resistance 10kΩ to 100kΩ.
Set-up values for CL which satisfies the application.
This application circuit does not guarantee its operation. When using the circuit with changes to the external circuit
constants, it is better to have an adequate margin for the external components such as static and transient characteristics
as well as dispersion of the IC.
Functional Description
1. Switch Operation
VDD terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The VDD
terminal is also used as power source input to internal control circuit.
When the switch is turned ON by CTRL input, both the VDD and OUT terminals are connected by a 100mΩ bidirectional
switch. In on status, the switch is bidirectional. Therefore, current flows from OUT terminal to VDD terminal since the
potential of OUT terminal is higher than that of VDD terminal.
On the other hand, when the switch is turned OFF, it is possible to prevent current from flowing reversely from OUT to
VDD since a parasitic diode between the drain and the source of switch MOSFET is not activated.
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature is beyond
135°C (Typ) during the condition of over-current detection, thermal shutdown circuit operates and turns the power switch
OFF, causing the IC to output an error flag (FLAG). Then, when the junction temperature drops lower than 125°C (Typ),
power switch is turned ON and error flag (FLAG) is cancelled. This operation repeats unless the cause of the increase in
chip’s temperature is removed or the output of power switch is turned OFF.
The thermal shutdown circuit operates when the switch is ON (CTRL signal is active)
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BD6519FJ
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs error flag (FLAG) when current flowing in each switch
MOSFET exceeds a specified value. The over-current detection circuit works when the switch is ON (CTRL signal is
active). There are three types of response against over-current:
(1) When the switch is turned on while the output is in short circuit status, the switch goes into current limit status
immediately
(2) When the output short circuits or high-current load is connected while the switch is ON, very large current flows until
the over-current limit circuit reacts. When it exceeds detection value, current limitation is carried out.
(3) When the output current increases gradually, current limit circuit would not operate unless the output current
exceeds the over-current detection value. But when the output current increases gradually and it exceeds the
detection value, current limitation is carried out.
4. Under Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until VDD exceeds 2.3V(Typ). If the VDD drops below 2.3V(Typ) while
the switch is ON, then UVLO shuts off the power switch. UVLO has hysteresis of a 200mV(Typ).
Under voltage lockout circuit works when the switch is on (CTRL signal is active).
5. Error Flag (FLAG) Output
Error flag output is N-MOS open drain output. During detection of over-current and/or thermal shutdown, the output level
is low. Over-current detection has delay filter of 2.5ms(Typ). This delay filter prevents current detection flags from being
sent during instantaneous events such as inrush current at switch on or during hot plug. If error flag output is unused,
Flag pin should be connected to open or ground line.
VCTRL
VOUT
Output Short Circuit
Thermal Shutdown
I
OUT
VFLAG
Delay
Figure 37. Over-Current Detection, Thermal Shutdown Timing Diagram
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BD6519FJ
Power Dissipation
(SOP-J8)
700
600
500
400
300
200
100
0
0
25
50
75
100
125
150
Ambient Temperature: Ta[°C]
70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 38. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol
Pin No
Equivalence Circuit
CTRL
FLAG
OUT
4
5
6,7,8
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BD6519FJ
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. In rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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BD6519FJ
Operational Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 39. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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21.Aug.2014 Rev.002
18/21
BD6519FJ
Ordering Information
B D
6
5
1
9
F
J
-
E 2
Part Number
Package
FJ: SOP-J8
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP-J8 (TOP VIEW)
Part Number Marking
LOT Number
B D 6 5 1 9
1 PIN MARK
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BD6519FJ
Physical Dimension, Tape and Reel Information
Package Name
SOP-J8
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21.Aug.2014 Rev.002
20/21
BD6519FJ
Revision History
Date
Revision
Changes
11.Mar.2013
21.Aug.2014
001
002
New Release
Applied the ROHM Standard Style and improved understandability.
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21/21
Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – GE
Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – GE
Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
相关型号：
BD652-S
Power Bipolar Transistor, 8A I(C), 120V V(BR)CEO, 1-Element, PNP, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin, TO-220, 3 PIN
BOURNS
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