UPD5741T6J-E4-A [RENESAS]

UPD5741T6J-E4-A;
UPD5741T6J-E4-A
型号: UPD5741T6J-E4-A
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

UPD5741T6J-E4-A

射频 微波 光电二极管
文件: 总9页 (文件大小:194K)
中文:  中文翻译
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DATA SHEET  
MOS ANALOG INTEGRATED CIRCUIT  
μ
PD5741T6J  
LOW NOISE AND HIGH GAIN AMPLIFIER  
FOR IMPEDANCE CONVERTER OF MICROPHONE  
DESCRIPTION  
The μPD5741T6J is a silicon MOS monolithic integrated circuit designed as high gain impedance converter for  
electret condenser microphone. This device exhibits low noise and high voltage gain characteristics.  
The package is 3-pin thin-type lead-less minimold, suitable for surface mount.  
FEATURES  
Low Noise  
: NV = 101 dBV TYP. @ VDD = 2 V, Cin = 3 pF, RL = 2.2 kΩ  
: NV = 102 dBV TYP. @ VDD = 2 V, Cin = 5 pF, RL = 2.2 kΩ  
: GV = +6.5 dB TYP. @ VDD = 2 V, Cin = 3 pF, RL = 2.2 kΩ  
: GV = +8.5 dB TYP. @ VDD = 2 V, Cin = 5 pF, RL = 2.2 kΩ  
High Gain  
Low Consumption Current : IDD = 250 μA TYP. @ VDD = 2 V, RL = 2.2 kΩ  
Built-in the capacitor for RF noise immunity  
High ESD voltage  
3-pin thin-type lead-less minimold (1.2 × 1.0 × 0.33 mm)  
APPLICATIONS  
Microphone, Sensor, etc.  
ORDERING INFORMATION  
Part Number  
Order Number  
Package  
Marking  
6T  
Supplying Form  
Embossed tape 8 mm wide  
μPD5741T6J-E4  
μPD5741T6J-E4-A 3-pin thin-type lead-  
less minimold  
(Pb-Free)  
Pin 3 (GND) face the perforation side of the tape  
Qty 10 kpcs/reel  
Remark To order evaluation samples, contact your nearby sales office.  
Part number for sample order: μPD5741T6J  
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. PU10729EJ01V0DS (1st edition)  
Date Published September 2008 NS  
Printed in Japan  
2008  
μPD5741T6J  
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)  
Parameter  
Input Voltage (IN-GND)  
Input Current (IN-GND)  
Output Voltage (OUT-GND)  
Output Current (OUT-GND)  
Channel Temperature  
Symbol  
Vin  
Ratings  
0.5 to +0.5  
0.5  
Unit  
V
Iin  
mA  
V
Vout  
Iout  
0 to +5  
0.5  
mA  
°C  
°C  
°C  
Tch  
130  
Operating Ambient Temperature  
Storage Temperature  
TA  
40 to +85  
65 to +150  
Tstg  
RECOMMENDED OPERATING CONDITIONS (TA = +25°C)  
Parameter  
Supply VoltageNote  
Symbol  
MIN.  
1.0  
TYP.  
2.0  
MAX.  
5.0  
Unit  
V
VDD  
Note RL = 2.2 kΩ  
2
Data Sheet PU10729EJ01V0DS  
μPD5741T6J  
ELECTRICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)  
Parameter  
Circuit Current  
Symbol  
IDD  
Test Conditions  
MIN.  
150  
TYP.  
250  
1.5  
MAX.  
350  
Unit  
μA  
pF  
VDD = 2 V, Vin = 0 V, RL = 2.2 kΩ  
VDD = 2 V, RL = 2.2 kΩ, f = 1 MHz  
Input Capacitance  
Voltage Gain  
Cinput  
GV  
VDD = 2 V, Vin = 10 mV, RL = 2.2 kΩ,  
5.0  
6.5  
8.0  
dB  
Cin = 3 pF, f = 1 kHz, see Test Circuit  
Reduced Voltage Gain Characteristics  
Frequency Characteristics  
ΔGVV  
ΔGVf  
VDD = 2 1.5 V, Vin = 10 mV,  
RL = 2.2 kΩ, Cin = 3 pF, f = 1 kHz,  
see Test Circuit  
0.5  
0
dB  
dB  
VDD = 2 V, Vin = 10 mV, RL = 2.2 kΩ,  
Cin = 3 pF, f = 1 kHz 110 Hz,  
see Test Circuit  
Output Noise Voltage  
NV  
VDD = 2 V, Vin = 0 V, RL = 2.2 kΩ,  
Cin = 3 pF, A-Curve, see Test Circuit  
101  
dBV  
%
Total Harmonic Distortion  
THD  
VDD = 2 V, Vout = 50 mV, RL = 2.2 kΩ,  
0.5  
Cin = 3 pF, f = 1 kHz, see Test Circuit  
TEST CIRCUIT (Voltage Gain, Frequency Characteristics, Output Noise Voltage, Total Harmonic Distortion)  
VDD  
2.2 kΩ  
IN OUT  
GND  
Vout  
3 pF  
33 F  
μ
V
in  
3
Data Sheet PU10729EJ01V0DS  
μPD5741T6J  
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)  
CIRCUIT CURRENT vs. SUPPLY VOLTAGE  
VOLTAGE GAIN vs. SUPPLY VOLTAGE  
10  
500  
R
L
= 2.2 kΩ  
8
6
4
2
0
400  
300  
200  
100  
0
μ
C
in = 3 pF  
= 2.2 kΩ  
in = 10 mV  
R
L
V
f = 1 kHz  
2
3
4
5
2
3
4
5
1 000  
6
0
1
0
1
Supply Voltage VDD (V)  
Supply Voltage VDD (V)  
TOTAL HARMONIC DISTORTION  
vs. OUTPUT VOLTAGE  
VOLTAGE GAIN vs. FREQUENCY  
10  
10  
8
V
C
R
DD = 2 V  
in = 3 pF  
= 2.2 kΩ  
f = 1 kHz  
V
C
R
V
DD = 2 V  
in = 3 pF  
= 2.2 kΩ  
in = 10 mV  
L
L
6
1
4
2
0.1  
10  
0
10  
100  
1 000  
10 000  
100 000  
100  
Frequency f (Hz)  
Output Voltage Vout (mV)  
VOLTAGE GAIN vs.  
INPUT CAPACITANCE  
OUTPUT NOISE VOLTAGE  
vs. INPUT CAPACITANCE  
10  
–95  
V
DD = 2 V  
R
L
= 2.2 kΩ  
Vin = 0 V  
8
6
4
2
0
–100  
–105  
V
R
V
DD = 2 V  
= 2.2 kΩ  
in = 10 mV  
L
f = 1 kHz  
5
6
5
1
2
3
4
1
2
3
4
Input Capacitance Cin (pF)  
Input Capacitance Cin (pF)  
Remark The graphs indicate nominal characteristics.  
4
Data Sheet PU10729EJ01V0DS  
μPD5741T6J  
PACKAGE DIMENSIONS  
3-PIN THIN-TYPE LEAD-LESS MINIMOLD (UNIT: mm)  
1.2 0.1  
1.0 0.1  
(Bottom View)  
(0.8)  
1
2
3
(0.2)  
(0.2)  
PIN CONNECTIONS  
1. OUT  
2. IN  
3. GND  
Remark ( ) : Reference value  
5
Data Sheet PU10729EJ01V0DS  
μPD5741T6J  
RECOMMENDED SOLDERING CONDITIONS  
This product should be soldered and mounted under the following recommended conditions. For soldering  
methods and conditions other than those recommended below, contact your nearby sales office.  
Soldering Method  
Infrared Reflow  
Soldering Conditions  
Condition Symbol  
IR260  
Peak temperature (package surface temperature)  
Time at peak temperature  
: 260°C or below  
: 10 seconds or less  
: 60 seconds or less  
: 120 30 seconds  
: 3 times  
Time at temperature of 220°C or higher  
Preheating time at 120 to 180°C  
Maximum number of reflow processes  
Maximum chlorine content of rosin flux (% mass)  
: 0.2%(Wt.) or below  
Wave Soldering  
Partial Heating  
Peak temperature (molten solder temperature)  
Time at peak temperature  
: 260°C or below  
: 10 seconds or less  
WS260  
HS350  
Preheating temperature (package surface temperature) : 120°C or below  
Maximum number of flow processes  
: 1 time  
Maximum chlorine content of rosin flux (% mass)  
: 0.2%(Wt.) or below  
Peak temperature (terminal temperature)  
Soldering time (per side of device)  
: 350°C or below  
: 3 seconds or less  
: 0.2%(Wt.) or below  
Maximum chlorine content of rosin flux (% mass)  
Caution Do not use different soldering methods together (except for partial heating).  
6
Data Sheet PU10729EJ01V0DS  
μPD5741T6J  
The information in this document is current as of September, 2008. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data  
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not  
all products and/or types are available in every country. Please check with an NEC Electronics sales  
representative for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without the prior  
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may  
appear in this document.  
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from the use of NEC Electronics products listed in this document  
or any other liability arising from the use of such products. No license, express, implied or otherwise, is  
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of a customer's equipment shall be done under the full  
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by  
customers or third parties arising from the use of these circuits, software and information.  
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,  
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To  
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC  
Electronics products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment and anti-failure features.  
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and  
"Specific".  
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-  
designated "quality assurance program" for a specific application. The recommended applications of an NEC  
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of  
each NEC Electronics product before using it in a particular application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots.  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support).  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC  
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications  
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to  
determine NEC Electronics' willingness to support a given application.  
(Note)  
(1)  
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its  
majority-owned subsidiaries.  
(2)  
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as  
defined above).  
M8E 02. 11-1  

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