M5M5W816WG-55HI [RENESAS]

8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM; 8388608 - BIT ( 524288 - WORD 16位) CMOS静态RAM
M5M5W816WG-55HI
型号: M5M5W816WG-55HI
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM
8388608 - BIT ( 524288 - WORD 16位) CMOS静态RAM

内存集成电路 静态存储器
文件: 总10页 (文件大小:155K)
中文:  中文翻译
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To all our customers  
Regarding the change of names mentioned in the document, such as Mitsubishi  
Electric and Mitsubishi XX, to Renesas Technology Corp.  
The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas  
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog  
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)  
Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi  
Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names  
have in fact all been changed to Renesas Technology Corp. Thank you for your understanding.  
Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been  
made to the contents of the document, and these changes do not constitute any alteration to the  
contents of the document itself.  
Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices  
and power devices.  
Renesas Technology Corp.  
Customer Support Dept.  
April 1, 2003  
2002.04.18  
Ver. 6.0  
MITSUBISHI LSIs  
M5M5W816WG - 55HI, 70HI, 85HI  
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM  
FEATURES  
DESCRIPTION  
The M5M5W816 is a family of low v oltage 8-Mbit static RAMs  
organized as 524288-words by 16-bit, f abricated by Mitsubishi's  
high-perf ormance 0.18µm CMOS technology .  
- Single 2.7~3.6V power supply  
- Small stand-by current: 0.1µA (2V, ty p.)  
- No clocks, No ref resh  
The M5M5W816 is suitable for memory applications where a  
simple interfacing , battery operating and battery backup are the  
important design objectiv es.  
- Data retention supply v oltage =2.0V  
- All inputs and outputs are TTL compatible.  
- Easy memory expansion by S1#, S2, BC1# and BC2#  
- Common Data I/O  
M5M5W816WG is packaged in a CSP (chip scale package),  
with the outline of 7.5mm x 8.5mm, ball matrix of 6 x 8 (48ball)  
and ball pitch of 0.75mm. It giv es the best solution f or a  
compaction of mounting area as well as f lexibility of wiring pattern  
of printed circuit boards.  
- Three-state outputs: OR-tie capability  
- OE prev ents data contention in the I/O bus  
- Process technology: 0.18µm CMOS  
- Package: 48ball 7.5mm x 8.5mm CSP  
Activ e  
A)  
Stand-by current  
Version,  
Power  
Access time  
max.  
current  
Icc1  
*(3.0V, ty p.)  
Ratings (max.@ Vcc=3.6V)  
* Ty pical(3.0V)  
25°C 40°C 25°C 40°C 70°C 85°C  
Part name  
Operating  
Supply  
temperature  
30mA  
(10MHz)  
5mA  
M5M5W816WG -55HI  
M5M5W816WG -70HI  
M5M5W816WG -85HI  
55ns  
70ns  
85ns  
I-version  
-40 ~ +85°C  
0.5  
1.0  
5.0  
8.0 20  
40  
2.7 ~ 3.6V  
(1MHz)  
* Typical parameter indicates the value for the center  
of distribution, and is not 100% tested.  
PIN CONFIGURATION  
(TOP VIEW)  
1
2
3
4
5
6
A0  
BC1#  
DQ16  
DQ14  
GND  
A1  
A2  
S2  
OE#  
A
B
C
D
E
F
A3  
A5  
A4  
DQ1  
S1#  
BC2#  
DQ15  
DQ13  
DQ12  
DQ10  
Pin  
Function  
A6  
A7  
DQ3  
VCC  
GND  
DQ2  
A0 ~ A18 Address input  
DQ1 ~ DQ16  
S1#  
Data input / output  
Chip select input 1  
Chip select input 2  
Write control input  
Output enable input  
Lower By te (DQ1 ~ 8)  
Upper By te (DQ9 ~ 16)  
Power supply  
A17  
DQ4  
DQ5  
NC or  
GND  
S2  
VCC  
A16  
A15  
A13  
W#  
DQ11  
A14  
A12  
A9  
DQ7  
DQ6  
DQ8  
N.C.  
OE#  
BC1#  
BC2#  
Vcc  
DQ9  
A18  
N.C.  
A8  
W#  
G
H
A10  
A11  
GND  
Ground supply  
Outline : 48F7Q  
NC : No Connection  
*Don't connect E3 ball to voltage level more than 0V.  
1
2002.04.18  
Ver. 6.0  
MITSUBISHI LSIs  
M5M5W816WG - 55HI, 70HI, 85HI  
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM  
FUNCTION  
When setting BC1# and BC2# at a high lev el or S1# at a high  
The M5M5W816WG is organized as 524288-words by 16-bit.  
These dev ices operate on a single +2.7~3.6V power supply ,  
and are directly TTL compatible to both input and output. Its  
fully static circuit needs no clocks and no refresh, and  
makes it useful.  
lev el or S2 at a low lev el, the chips are in a non-selectable  
mode in which both reading and writing are disabled. In this  
mode, the output stage is in a high-impedance state, allowing  
OR-tie with other chips and memory expansion by BC1#,  
BC2# and S1#, S2.  
The power supply current is reduced as low as 0.1µA(25°C,  
ty pical), and the memory data can be held at +2.0V power  
supply, enabling battery back-up operation during power  
failure or power-down operation in the non-selected mode.  
The operation mode are determined by a combination of  
the dev ice control inputs BC1# , BC2# , S1#, S2 , W# and  
OE#. Each mode is summarized in the function table.  
A write operation is executed whenev er the low lev el W#  
ov erlaps with the low lev el BC1# and/or BC2# and the low  
lev el S1# and the high lev el S2. The address(A0~A18) must  
be set up bef ore the write cycle and must be stable during  
the entire cycle.  
A read operation is executed by setting W# at a high lev el  
and OE# at a low lev el while BC1# and/or BC2# and S1# and  
S2 are in an activ e state(S1#=L,S2=H).  
When setting BC1# at the high lev el and other pins are in  
an activ e stage , upper-byte are in a selectable mode in  
which both reading and writing are enabled, and lower-byte  
are in a non-selectable mode. And when setting BC2# at a  
high lev el and other pins are in an activ e stage, lower-byte  
are in a selectable mode and upper-by te are in a non-  
selectable mode.  
FUNCTION TABLE  
S2  
OE#  
BC1# BC2#  
S1#  
W#  
DQ1~8 DQ9~16  
Icc  
Mode  
Non selection  
High-Z High-Z  
High-Z High-Z  
High-Z High-Z  
High-Z High-Z  
Standby  
Standby  
Standby  
Standby  
Activ e  
H
L
H
X
L
L
L
L
L
L
L
L
L
L
L
X
X
X
H
L
L
L
H
H
H
L
X
X
X
H
H
H
H
L
L
L
L
L
X
X
X
X
L
H
H
L
H
H
L
H
H
X
X
X
X
X
L
H
X
L
Non selection  
Non selection  
Non selection  
H
X
H
H
H
H
H
H
H
H
H
High-Z  
Write  
Read  
Din  
Dout High-Z Activ e  
High-Z High-Z Activ e  
High-Z Din  
High-Z Dout  
High-Z High-Z Activ e  
Activ e  
Activ e  
Write  
Read  
H
X
L
Din  
Din  
Activ e  
Activ e  
Write  
Read  
L
L
Dout  
Dout  
L
H
High-Z High-Z Activ e  
(note1) "H" and "L" in this table mean VIH and VIL, respectiv ely .  
(note2) "X" in this table should be "H" or "L".  
BLOCK DIAGRAM  
A0  
DQ  
1
A1  
MEMORY ARRAY  
DQ  
8
524288 WORDS  
x 16 BITS  
A17  
A18  
-
DQ  
9
CLOCK  
GENERATOR  
S1#  
DQ  
16  
S2  
BC1#  
BC2#  
W#  
Vcc  
GND  
OE #  
2
2002.04.18  
Ver. 6.0  
MITSUBISHI LSIs  
M5M5W816WG - 55HI, 70HI, 85HI  
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Units  
Conditions  
Ratings  
V
Supply v oltage  
Input v oltage  
With respect to GND  
With respect to GND  
With respect to GND  
-0.3* ~ +4.6  
cc  
VI  
-0.3* ~ Vcc + 0.3 (max. 4.6V)  
V
Output v oltage  
Power dissipation  
VO  
Pd  
0 ~ Vcc  
700  
25°C  
Ta=  
mW  
°C  
Operating  
Ta  
- 40 ~ +85  
temperature  
Storage temperature  
Tstg  
°C  
- 65 ~ +150  
* -3.0V in case of AC (Pulse width < 30ns)  
( Vcc=2.7 ~ 3.6V, unless otherwise noted)  
DC ELECTRICAL CHARACTERISTICS  
Limits  
Ty p  
Symbol  
Parameter  
Conditions  
Units  
Min  
Max  
Vcc+0.2V  
0.6  
High-lev el input v oltage  
Low-lev el input v oltage  
High-lev el output v oltage  
Low-lev el output v oltage  
Input leakage current  
2.2  
-0.2 *  
2.4  
VIH  
VIL  
VOH  
VOL  
II  
V
IOH= -0.5mA  
IOL=2mA  
0.4  
±1  
VI =0 ~ Vcc  
µA  
BC1# and BC2# =VIH or S1# =VIH or S2=VIL or OE# =VIH, VI/O=0 ~ Vcc  
Output leakage current  
IO  
±1  
BC1# and BC2# < 0.2V, S1# < 0.2V, S2 > Vcc-0.2V  
f= 10MHz  
-
-
-
-
30  
5
50  
15  
50  
15  
Activ e supply current  
( AC,MOS lev el )  
other inputs < 0.2V or  
Output - open (duty 100%)  
> Vcc-0.2V  
Icc1  
Icc2  
f= 1MHz  
f= 10MHz  
f= 1MHz  
mA  
BC1# and BC2#=VIL , S1#=VIL ,S2=VIH  
other pins =VIH or VIL  
Output - open (duty 100%)  
30  
5
Activ e supply current  
( AC,TTL lev el )  
(1)  
S1# > Vcc - 0.2V,  
~ +25°C  
~ +40°C  
0.5  
-
-
5
8
S2 > Vcc - 0.2V,  
other inputs = 0 ~ Vcc  
1.0  
(2)  
(3)  
S2 < 0.2V,  
other inputs = 0 ~ Vcc  
Stand by supply current  
( AC,MOS lev el )  
Icc3  
µA  
~ +70°C  
~ +85°C  
-
-
-
-
-
20  
40  
2
BC1# and BC2# > Vcc - 0.2V  
S1# < 0.2V, S2 > Vcc - 0.2V  
other inputs = 0 ~ Vcc  
BC1# and BC2# =VIH or S1# =VIH or S2 =VIL  
Other inputs= 0 ~ Vcc  
Stand by supply current  
( AC,TTL lev el )  
mA  
-
Icc4  
Note 1: Direction for current flowing into IC is indicated as positive (no mark).  
Note 2: Typical parameter indicates the value for the center of distribution at 3.0V, and is not 100% tested.  
* -1.0V in case of AC (Pulse width < 30ns)  
(Vcc=2.7 ~ 3.6V, unless otherwise noted)  
CAPACITANCE  
Limits  
Ty p  
Symbol  
Conditions  
Parameter  
Units  
pF  
Min  
Max  
10  
Input capacitance  
Output capacitance  
VI=GND, VI=25mVrms, f =1MHz  
VO=GND,VO=25mVrms, f =1MHz  
CI  
CO  
10  
3
2002.04.18  
Ver. 6.0  
MITSUBISHI LSIs  
M5M5W816WG - 55HI, 70HI, 85HI  
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM  
(Vcc=2.7 ~ 3.6V, unless otherwise noted)  
AC ELECTRICAL CHARACTERISTICS  
(1) TEST CONDITIONS  
1TTL  
Supply v oltage  
2.7~3.6V  
Input pulse  
VIH=2.4V, VIL=0.4V  
DQ  
Input rise time and f all time  
5ns  
CL  
Transition is measured ±200mV from  
steady state voltage.(for ten,tdis)  
Reference lev el  
Output loads  
VOH=VOL=1.5V  
Fig.1,CL=30pF  
Including scope and  
jig capacitance  
CL=5pF (for ten,tdis)  
Fig.1 Output load  
(2) READ CYCLE  
Limits  
70HI  
55HI  
85HI  
Units  
Parameter  
Read cy cle time  
Symbol  
Max  
Max  
Max  
Min  
55  
Min  
70  
Min  
85  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tCR  
ta(A)  
ta(S1)  
ta(S2)  
Address access time  
55  
55  
55  
55  
55  
30  
20  
20  
20  
20  
20  
70  
70  
70  
70  
70  
35  
25  
25  
25  
25  
25  
85  
85  
85  
85  
85  
45  
30  
30  
30  
30  
30  
Chip select 1 access time  
Chip select 2 access time  
By te control 1 access time  
By te control 2 access time  
Output enable access time  
Output disable time after S1# high  
Output disable time after S2 low  
Output disable time after BC1# high  
Output disable time after BC2# high  
Output disable time after OE# high  
Output enable time af ter S1# low  
Output enable time af ter S2 high  
Output enable time af ter BC1# low  
ta(BC1)  
ta(BC2)  
ta(OE)  
tdis(S1)  
tdis(S2)  
tdis(BC1)  
tdis(BC2)  
tdis(OE)  
ten(S1)  
ten(S2)  
ten(BC1)  
ten(BC2)  
ten(OE)  
tV(A)  
10  
10  
5
10  
10  
5
10  
10  
5
Output enable time af ter BC2# low  
Output enable time af ter OE# low  
Data v alid time after address  
5
5
5
ns  
ns  
5
10  
5
10  
5
10  
(3) WRITE CYCLE  
Limits  
Units  
70HI  
85HI  
55HI  
Symbol  
Parameter  
Max  
Max  
Min  
Min  
Max  
Min  
55  
45  
0
50  
50  
50  
50  
50  
30  
0
ns  
ns  
ns  
ns  
ns  
Write cy cle time  
Write pulse width  
70  
55  
0
65  
65  
65  
65  
65  
35  
0
85  
60  
0
70  
70  
70  
70  
70  
45  
0
tCW  
tw(W)  
tsu(A)  
tsu(A-WH)  
tsu(BC1)  
tsu(BC2)  
tsu(S1)  
tsu(S2)  
tsu(D)  
Address setup time  
Address setup time with respect to W#  
By te control 1 setup time  
By te control 2 setup time  
Chip select 1 setup time  
Chip select 2 setup time  
Data setup time  
Data hold time  
Write recov ery time  
Output disable time from W# low  
Output disable time from OE# high  
Output enable time f rom W# high  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
th(D)  
trec(W)  
tdis(W)  
tdis(OE)  
ten(W)  
ten(OE)  
0
0
0
25  
25  
30  
30  
20  
20  
5
5
5
5
5
5
ns  
ns  
Output enable time f rom OE# low  
4
2002.04.18  
Ver. 6.0  
MITSUBISHI LSIs  
M5M5W816WG - 55HI, 70HI, 85HI  
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM  
(4)TIMING DIAGRAMS  
Read cycle  
tCR  
A0~18  
tv (A)  
ta(A)  
ta(BC1)or  
ta(BC2)  
BC1#,BC2#  
(Note3)  
(Note3)  
tdis (BC1) or tdis (BC1)  
ta(S1)  
S1#  
S2  
(Note3)  
(Note3)  
(Note3)  
(Note3)  
tdis (S1)  
ta(S2)  
tdis (S2)  
ta (OE)  
OE#  
(Note3)  
(Note3)  
ten (OE)  
tdis (OE)  
W# = "H" lev el  
DQ1~16  
ten (BC1)  
ten (BC2)  
VALID DATA  
ten (S1)  
ten (S2)  
Write cycle  
( W# control mode )  
tCW  
A0~18  
tsu (BC1) or tsu(BC2)  
BC1#,BC2#  
(Note3)  
(Note3)  
tsu (S1)  
tsu (S2)  
S1#  
S2  
(Note3)  
(Note3)  
(Note3)  
(Note3)  
OE#  
tsu (A-WH)  
tw (W)  
tsu (A)  
trec (W)  
tdis (W)  
W#  
ten(OE)  
ten (W)  
tdis(OE)  
DATA IN  
STABLE  
DQ1~16  
tsu (D) th (D)  
5
2002.04.18  
Ver. 6.0  
MITSUBISHI LSIs  
M5M5W816WG - 55HI, 70HI, 85HI  
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM  
Write cycle (BC# control mode)  
tCW  
A0~18  
tsu (BC1) or  
tsu (BC2)  
trec (W)  
tsu (A)  
BC1#,BC2#  
S1#  
(Note3)  
(Note3)  
(Note3)  
(Note3)  
S2  
(Note5)  
W#  
(Note4)  
tsu (D)  
(Note3)  
(Note3)  
th (D)  
DATA IN  
STABLE  
DQ1~16  
Note 3: Hatching indicates the state is "don't care".  
Note 4: A Write occurs during S1# low, S2 high overlaps BC1# and/or BC2# low and W# low.  
Note 5: When the falling edge of W# is simultaneously or prior to the falling edge of BC1# and/or BC2# or the falling edge of S1#  
or rising edge of S2, the outputs are maintained in the high impedance state.  
Note 6: Don't apply inverted phase signal externally when DQ pin is in output mode.  
6
2002.04.18  
Ver. 6.0  
MITSUBISHI LSIs  
M5M5W816WG - 55HI, 70HI, 85HI  
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM  
Write cycle (S1# control mode)  
tCW  
A0~18  
BC1#,BC2#  
(Note3)  
(Note3)  
trec (W)  
tsu (S1)  
tsu (A)  
S1#  
S2  
(Note3)  
(Note3)  
(Note3)  
(Note3)  
(Note5)  
W#  
(Note4)  
tsu (D)  
th (D)  
DATA IN  
STABLE  
DQ1~16  
Write cycle (S2 control mode)  
tCW  
A0~18  
BC1#,BC2#  
(Note3)  
(Note3)  
trec (W)  
tsu (S2)  
tsu (A)  
S1#  
S2  
(Note3)  
(Note3)  
(Note3)  
(Note3)  
(Note5)  
W#  
(Note4)  
tsu (D)  
th (D)  
DATA IN  
STABLE  
DQ1~16  
7
2002.04.18  
Ver. 6.0  
MITSUBISHI LSIs  
M5M5W816WG - 55HI, 70HI, 85HI  
8388608-BIT (524288-WORD BY 16-BIT) CMOS STATIC RAM  
POWER DOWN CHARACTERISTICS  
(1) ELECTRICAL CHARACTERISTICS  
Limits  
Symbol  
Vcc (PD)  
VI (BC)  
Parameter  
Test conditions  
Units  
V
Ty p  
Min  
2.0  
2.2  
Max  
Power down supply voltage  
2.2V < Vcc(PD)  
Byte control input BC1# &  
BC2#  
V
2.0V < Vcc(PD) < 2.2V  
Vcc(PD)  
Vcc(PD)  
0.1  
2.2V < Vcc(PD)  
2.2  
VI (S1)  
VI (S2)  
Chip select input S1#  
Chip select input S2  
2.0V < Vcc(PD) < 2.2V  
V
0.2  
1.5  
3
Vcc=2.0V  
~ +25°C  
~ +40°C  
-
-
-
-
(1)  
(2)  
(3)  
S1# > Vcc - 0.2V,  
other inputs = 0 ~ Vcc  
S2 < 0.2V,  
0.2  
Power down  
supply current  
Icc (PD)  
other inputs = 0 ~ Vcc  
µA  
-
-
15  
30  
~ +70°C  
~ +85°C  
BC1# and BC2# > Vcc - 0.2V  
S1# < 0.2V, S2 > Vcc - 0.2V  
other inputs = 0 ~ Vcc  
Note 7: Typical parameter of Icc(PD) indicates the value for the  
center of distribution, and is not 100% tested.  
(2) TIMING REQUIREMENTS  
Limits  
Symbol  
Parameter  
Units  
Test conditions  
Ty p  
Min  
0
Max  
tsu (PD)  
trec (PD)  
Power down set up time  
ns  
ms  
5
Power down recov ery time  
(3) TIMING DIAGRAM  
BC# control mode  
Vcc  
On the BC# control mode, the lev el of S1# and S2 must be f ixed at S1#, S2 > Vcc-0.2V or S2 < 0.2V.  
2.7V  
2.7V  
tsu (PD)  
trec (PD)  
2.2V  
2.2V  
BC1#  
BC2#  
BC1# , BC2# > Vcc-0.2V  
S1# control mode  
Vcc  
On the S1# control mode, the lev el of S2 must be fixed at S2 > Vcc-0.2V or S2 < 0.2V.  
2.7V  
2.7V  
tsu (PD)  
trec (PD)  
2.2V  
2.2V  
S1# > Vcc-0.2V  
S1#  
S2 control mode  
Vcc  
2.7V  
2.7V  
S2  
trec (PD)  
tsu (PD)  
0.2V  
0.2V  
S2 < 0.2V  
8
Keep safety first in your circuit designs!  
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and more reliable, but there is always the possibility that trouble may occur with them. Trouble with  
semiconductors may lead to personal injury, fire or property damage. Remember to give due  
consideration to safety when making your circuit designs, with appropriate measures such as (i)  
placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention  
against any malfunction or mishap.  
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