BF1205C [NXP]

Dual N-channel dual gate MOS-FET; 双N沟道双栅MOS -FET
BF1205C
型号: BF1205C
厂家: NXP    NXP
描述:

Dual N-channel dual gate MOS-FET
双N沟道双栅MOS -FET

文件: 总22页 (文件大小:168K)
中文:  中文翻译
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BF1205C  
Dual N-channel dual gate MOS-FET  
Rev. 01 — 18 May 2004  
Product data sheet  
1. Product profile  
1.1 General description  
The BF1205C is a combination of two dual gate MOS-FET amplifiers with shared source  
and gate 2 leads and an integrated switch. The integrated switch is operated by the gate 1  
bias of amplifier b.  
The source and substrate are interconnected. Internal bias circuits enable  
DC stabilization and a very good cross-modulation performance during AGC. Integrated  
diodes between the gates and source protect against excessive input voltage surges. The  
transistor has a SOT363 micro-miniature plastic package.  
CAUTION  
This device is sensitive to electrostatic discharge (ESD). Therefore care should be taken  
during transport and handling.  
MSC895  
1.2 Features  
Two low noise gain controlled amplifiers in a single package; one with a fully integrated  
bias and one with a partly integrated bias  
Internal switch to save external components  
Superior cross-modulation performance during AGC  
High forward transfer admittance  
High forward transfer admittance to input capacitance ratio.  
1.3 Applications  
Gain controlled low noise amplifiers for VHF and UHF applications with 5 V supply  
voltage  
digital and analog television tuners  
professional communication equipment.  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
1.4 Quick reference data  
Table 1:  
Quick reference data  
Per MOS-FET unless otherwise specified.  
Symbol Parameter Conditions  
Min Typ Max Unit  
VDS  
ID  
drain-source voltage  
-
-
-
-
-
-
6
V
drain current (DC)  
30  
mA  
[1]  
Ptot  
yfs  
total power dissipation  
Ts 107 °C  
180 mW  
forward transfer admittance f = 1 MHz  
amplifier a; ID = 19 mA  
amplifier b; ID = 13 mA  
input capacitance at gate 1 f = 1 MHz  
26  
28  
31  
33  
41  
43  
mS  
mS  
Cig1-ss  
amplifier a  
amplifier b  
-
-
-
-
-
2.2 2.7 pF  
2.0 2.5 pF  
Crss  
NF  
reverse transfer capacitance f = 1 MHz  
20  
-
fF  
noise figure  
amplifier a; f = 400 MHz  
amplifier b; f = 800 MHz  
1.3 1.9 dB  
1.4 2.1 dB  
Xmod  
cross-modulation  
input level for k = 1% at  
40 dB AGC  
amplifier a  
amplifier b  
100 105  
100 103  
-
-
dBµV  
dBµV  
Tj  
junction temperature  
-
-
150 °C  
[1] Ts is the temperature at the soldering point of the source lead.  
2. Pinning information  
Table 2:  
Discrete pinning  
Pin  
1
Description  
gate 1 (a)  
gate 2  
Simplified outline  
Symbol  
6
5
4
2
AMP a  
g1  
(a)  
d
(a)  
3
gate 1 (b)  
drain (b)  
source  
4
s
5
g2  
1
2
3
6
drain (a)  
001aaa706  
g1  
(b)  
d
(b)  
AMP b  
sym033  
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
2 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
3. Ordering information  
Table 3:  
Ordering information  
Type number Package  
Name  
Description  
Version  
BF1205C  
-
plastic surface mounted package; 6 leads  
SOT363  
4. Marking  
Table 4:  
Marking  
Type number  
Marking code[1]  
BF1205C  
M6*  
[1] * = p or -: made in Hong Kong.  
* = t: made in Malaysia.  
* = W: made in China.  
5. Limiting values  
Table 5:  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
Per MOS-FET  
VDS  
ID  
drain-source voltage  
-
6
V
drain current (DC)  
gate 1 current  
-
30  
mA  
mA  
mA  
mW  
°C  
IG1  
IG2  
Ptot  
Tstg  
Tj  
-
±10  
±10  
180  
+150  
150  
gate 2 current  
-
[1]  
total power dissipation  
storage temperature  
junction temperature  
Ts 107 °C  
-
65  
-
°C  
[1] Ts is the temperature at the soldering point of the source lead.  
6. Thermal characteristics  
Table 6:  
Thermal characteristics  
Symbol  
Parameter  
Conditions  
Typ  
240  
Unit  
Rth(j-s)  
thermal resistance from junction  
to soldering point  
K/W  
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
3 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa551  
250  
tot  
P
(mW)  
200  
150  
100  
50  
0
0
50  
100  
150  
200  
T
(°C)  
s
Fig 1. Power derating curve.  
7. Static characteristics  
Table 7:  
Static characteristics  
Tj = 25 °C.  
Symbol  
Parameter  
Conditions  
Min Typ Max Unit  
Per MOS-FET; unless otherwise specified  
V(BR)DSS  
drain-source breakdown voltage  
VG1-S = VG2-S = 0 V; ID = 10 µA  
amplifier a  
6
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
amplifier b  
6
-
V(BR)G1-SS  
V(BR)G2-SS  
V(F)S-G1  
V(F)S-G2  
VG1-S(th)  
VG2-S(th)  
IDSX  
gate 1-source breakdown voltage VGS = VDS = 0 V; IG1-S = 10 mA  
gate 2-source breakdown voltage VGS = VDS = 0 V; IG2-S = 10 mA  
6
10  
10  
1.5  
1.5  
1.0  
1.0  
6
forward source-gate 1 voltage  
forward source-gate 2 voltage  
gate 1-source threshold voltage  
gate 2-source threshold voltage  
drain-source current  
VG2-S = VDS = 0 V; IS-G1 = 10 mA  
VG1-S = VDS = 0 V; IS-G2 = 10 mA  
0.5  
0.5  
0.3  
0.4  
VDS = 5 V; VG2-S = 4 V; ID = 100 µA  
VDS = 5 V; VG1-S = 5 V; ID = 100 µA  
VG2-S = 4 V; VDS(b) = 5 V; RG1 = 150 kΩ  
amplifier a; VDS(a) = 5 V  
amplifier b  
[1]  
[2]  
14  
9
-
-
24  
17  
mA  
mA  
IG1-S  
gate1 cut-off current  
gate 2 cut-off current  
VG2-S = VDS(a) = 0 V  
amplifier a; VG1-S(a) = 5 V; ID(b) = 0 A  
amplifier b; VG1-S(b) = 5 V; VDS(b) = 0 V  
VG2-S = 4 V;  
-
-
-
-
-
-
50  
50  
20  
nA  
nA  
nA  
IG2-S  
V
V
G1-S(a) = VDS(a) = VDS(b) = 0 V;  
G1-S(b) = 0 V;  
[1] RG1 connects gate 1 (b) to VGG = 0 V (see Figure 3).  
[2] RG1 connects gate 1 (b) to VGG = 5 V (see Figure 3).  
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
4 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa552  
20  
I
D
(mA)  
16  
(1)  
(2)  
12  
8
(3)  
g1 (a)  
g2  
d (a)  
s
(4)  
4
(6)  
(5)  
g1 (b)  
d (b)  
R
G1  
0
0
1
2
3
4
5
V
GG  
V
(V)  
001aaa553  
GG  
(1) ID(b); RG1 = 120 k.  
(2) ID(b); RG1 = 150 k.  
(3) ID(b); RG1 = 180 k.  
(4) ID(a); RG1 = 180 k.  
(5) ID(a); RG1 = 150 k.  
(6) ID(a); RG1 = 120 k.  
VGG = 5 V: amplifier a is off; amplifier b is on  
VGG = 0 V: amplifier a is on; amplifier b is off.  
Fig 2. Drain currents of MOS-FET a and b as function  
of VGG  
Fig 3. Functional diagram.  
.
8. Dynamic characteristics  
8.1 Dynamic characteristics for amplifier a  
Table 8:  
Common source; Tamb = 25 °C; VG2-S = 4 V; VDS = 5 V; ID = 19 mA.  
Dynamic characteristics for amplifier a[1]  
Symbol Parameter  
Conditions  
Tj = 25 °C  
f = 1 MHz  
f = 1 MHz  
f = 1 MHz  
Min Typ Max Unit  
yfs  
forward transfer admittance  
26  
-
31  
41  
mS  
pF  
pF  
pF  
fF  
Cig1-ss  
Cig2-ss  
Coss  
Crss  
input capacitance at gate 1  
input capacitance at gate 2  
output capacitance  
2.2 2.7  
-
3.0  
0.9  
20  
-
-
-
-
reverse transfer capacitance f = 1 MHz  
-
Gtr  
power gain  
BS = BS(opt); BL = BL(opt)  
f = 200 MHz; GS = 2 mS; GL = 0.5 mS  
f = 400 MHz; GS = 2 mS; GL = 1 mS  
f = 800 MHz; GS = 3.3 mS; GL = 1 mS  
f = 11 MHz; GS = 20 mS; BS = 0 S  
f = 400 MHz; YS = YS(opt)  
31  
26  
21  
-
35  
30  
25  
3.0  
39  
34  
29  
-
dB  
dB  
dB  
dB  
dB  
dB  
NF  
noise figure  
-
1.3 1.9  
1.4 2.1  
f = 800 MHz; YS = YS(opt)  
-
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
5 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
Table 8:  
Dynamic characteristics for amplifier a[1] …continued  
Common source; Tamb = 25 °C; VG2-S = 4 V; VDS = 5 V; ID = 19 mA.  
Symbol Parameter  
Xmod cross-modulation  
Conditions  
Min Typ Max Unit  
[2]  
input level for k = 1%; fw = 50 MHz; funw = 60 MHz  
at 0 dB AGC  
at 10 dB AGC  
at 20 dB AGC  
at 40 dB AGC  
90  
-
-
-
-
-
-
dBµV  
dBµV  
dBµV  
dBµV  
90  
99  
-
100 105  
[1] For the MOS-FET not in use: VG1-S(b) = 0 V; VDS(b) = 0 V.  
[2] Measured in Figure 33 test circuit.  
8.1.1 Graphs for amplifier a  
001aaa554  
(1)  
001aaa555  
30  
32  
I
(1)  
(2)  
D
(2)  
(3)  
I
D
(mA)  
(mA)  
(4)  
(5)  
24  
(3)  
(4)  
20  
16  
8
(5)  
(6)  
(7)  
10  
(6)  
(7)  
(8)  
(9)  
0
0
0
0.4  
0.8  
1.2  
1.6  
V
2
(V)  
0
2
4
6
V
(V)  
DS  
G1-S  
(1) VG2-S = 4 V.  
(2) VG2-S = 3.5 V.  
(3) VG2-S = 3 V.  
(4) VG2-S = 2.5 V.  
(5) VG2-S = 2 V.  
(6) VG2-S = 1.5 V.  
(7) VG2-S = 1 V.  
(1) VG1-S(a) = 1.8 V.  
(2) VG1-S(a) = 1.7 V.  
(3) VG1-S(a) = 1.6 V.  
(4) VG1-S(a) = 1.5 V.  
(5) VG1-S(a) = 1.4 V.  
(6) VG1-S(a) = 1.3 V.  
(7) VG1-S(a) = 1.2 V.  
(8) VG1-S(a) = 1.1 V.  
(9) VG1-S(a) = 1 V.  
VDS(a) = 5 V; VG1-S(b) = VDS(b) = 0 V; Tj = 25 °C.  
VG2-S = 4 V; VG1-S(b) = VDS(b) = 0 V; Tj = 25 °C.  
Fig 4. Transfer characteristics; typical values.  
Fig 5. Output characteristics; typical values.  
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
6 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa557  
001aaa556  
20  
(a)  
40  
I
D
y
fs  
(mA)  
16  
(mS)  
(1)  
(2)  
30  
12  
8
20  
10  
0
(3)  
(4)  
4
(5)  
(6)  
0
0
20  
40  
60  
0
8
16  
24  
32  
I
(b) (µA)  
I
(mA)  
D
D
(1) VG2-S = 4 V.  
VDS(a) = 5 V; VG2-S = 4 V; VDS(b) = 5 V;  
VG1-S(b) = 0 V; Tj = 25 °C.  
(2) VG2-S = 3.5 V.  
(3) VG2-S = 3 V.  
(4) VG2-S = 2.5 V.  
(5) VG2-S = 2 V.  
(6) VG2-S = 1.5 V.  
VDS(a) = 5 V; VG1-S(b) = VDS(b) = 0 V; Tj = 25 °C.  
Fig 6. Forward transfer admittance as a function of  
drain current; typical values.  
Fig 7. Drain current as a function of internal G1  
current (current in pin drain (b) if MOS-FET (b)  
is switched off); typical values.  
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
7 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa558  
001aaa559  
20  
32  
I
D
I
D
(mA)  
16  
(mA)  
24  
(1)  
12  
8
(2)  
(3)  
16  
8
(4)  
(5)  
(6)  
4
0
0
0
1
2
3
4
V
5
(V)  
0
2
4
6
V
(V)  
G2-S  
supply  
VDS(a) = VDS(b) = Vsupply, VG2-S = 4 V, Tj = 25 °C,  
RG1(b) = 150 k(connected to ground); see  
Figure 3.  
(1) VDS(b) = 5 V.  
(2) VDS(b) = 4.5 V.  
(3) VDS(b) = 4 V.  
(4) VDS(b) = 3.5 V.  
(5) VDS(b) = 3 V.  
(6) VDS(b) = 2.5 V.  
VDS(a) = 5 V; VG1-S(b) = 0 V; gate 1 (a) = open;  
Tj = 25 °C.  
Fig 8. Drain current of amplifier a as a function of  
supply voltage of a and b amplifier; typical  
values.  
Fig 9. Drain current as a function of gate 2 and drain  
supply voltage; typical values.  
001aaa560  
001aaa561  
120  
0
gain  
reduction  
V
unw  
(dBµV)  
(dB)  
10  
110  
20  
30  
40  
50  
100  
90  
80  
0
10  
20  
30  
40  
50  
0
1
2
3
4
gain reduction (dB)  
V
(V)  
AGC  
VDS(a) = VDS(b) = 5 V; VG1-S(b) = 0 V; fw = 50 MHz;  
funw = 60 MHz; Tamb = 25 °C; see Figure 33.  
VDS(a) = VDS(b) = 5 V; VG1-S(b) = 0 V; f = 50 MHz; see  
Figure 33.  
Fig 10. Unwanted voltage for 1% cross-modulation as a  
function of gain reduction; typical values.  
Fig 11. Gain reduction as a function of AGC voltage;  
typical values.  
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
8 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa562  
001aaa564  
2
32  
10  
b , g  
is is  
(mS)  
I
D
(mA)  
24  
10  
b
g
is  
16  
8
1
is  
1  
10  
2  
0
10  
2
3
0
20  
40  
60  
10  
10  
10  
gain reduction (dB)  
f (MHz)  
VDS(a) = VDS(b) = 5 V; VG1-S(b) = 0 V; f = 50 MHz;  
Tamb = 25 °C; see Figure 33.  
VDS(a) = 5 V; VG2-S(a) = 4 V; VDS(b) = VG1-S(b) = 0 V;  
ID(a) = 19 mA.  
Fig 12. Drain current as a function of gain reduction;  
typical values.  
Fig 13. Input admittance as a function of frequency;  
typical values.  
001aaa565  
001aaa566  
2
2
3
2
3
10  
10  
10  
10  
y
−ϕ  
rs  
rs  
(mS)  
(deg)  
y
−ϕ  
fs  
y
fs  
fs  
(mS)  
(deg)  
−ϕ  
rs  
2
10  
10  
10  
10  
y
rs  
−ϕ  
fs  
10  
10  
1
3
1
3
1
1
2
2
10  
10  
10  
10  
10  
10  
f (MHz)  
f (MHz)  
VDS(a) = 5 V; VG2-S(a) = 4 V; VDS(b) = VG1-S(b) = 0 V;  
ID(a) = 19 mA.  
VDS(a) = 5 V; VG2-S(a) = 4 V; VDS(b) = VG1-S(b) = 0 V;  
ID(a) = 19 mA.  
Fig 14. Forward transfer admittance and phase as a  
function of frequency; typical values.  
Fig 15. Reverse transfer admittance and phase as a  
function of frequency: typical values.  
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
9 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa567  
10  
b , g  
os os  
(mS)  
b
g
os  
1
os  
1  
10  
2  
10  
2
3
10  
10  
10  
f (MHz)  
VDS(a) = 5 V; VG2-S(a) = 4 V; VDS(b) = VG1-S(b) = 0 V; ID(a) = 19 mA.  
Fig 16. Output admittance as a function of frequency; typical values.  
8.1.2 Scattering parameters for amplifier a  
Table 9:  
Scattering parameters for amplifier a  
VDS(a) = 5 V; VG2-S = 4 V; ID(a) = 19 mA; VDS(b) = 0 V; VG-1S(b) = 0 V; Tamb = 25 °C.  
f
S11  
S21  
S12  
S22  
(MHz)  
Magnitude Angle Magnitude Angle Magnitude Angle Magnitude Angle  
ratio  
(deg) ratio  
3.91 3.07  
7.76 3.06  
15.42 3.04  
22.99 3.01  
30.52 2.96  
37.83 2.90  
45.14 2.83  
52.31 2.76  
59.47 2.69  
66.23 2.60  
73.10 2.52  
(deg) ratio  
(deg) ratio  
83.61 0.992  
83.19 0.992  
78.19 0.990  
73.75 0.988  
69.82 0.985  
66.12 0.982  
62.11 0.979  
58.86 0.975  
58.28 0.972  
50.64 0.968  
47.28 0.966  
(deg)  
50  
0.992  
0.990  
0.982  
0.971  
0.956  
0.938  
0.917  
0.893  
0.867  
0.838  
0.807  
175.56 0.0007  
171.18 0.0017  
162.42 0.0026  
153.79 0.0037  
145.22 0.0047  
136.78 0.0055  
128.46 0.0061  
120.20 0.0065  
111.98 0.0068  
103.90 0.0067  
95.875 0.0065  
1.47  
100  
200  
300  
400  
500  
600  
700  
800  
900  
1000  
2.93  
5.84  
8.71  
11.59  
14.48  
17.31  
20.14  
22.98  
25.85  
28.74  
8.1.3 Noise data for amplifier a  
Table 10: Noise data for amplifier a  
VDS(a) = 5 V; VG2-S = 4 V; ID(a) = 19 mA; VDS(b) = 0 V; VG-1S(b) = 0 V; Tamb = 25 °C.  
f
Fmin  
(dB)  
Γopt  
rn  
()  
(MHz)  
ratio  
0.718  
0.677  
(deg)  
16.06  
37.59  
400  
800  
1.3  
1.4  
0.683  
0.681  
9397 750 13005  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 01 — 18 May 2004  
10 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
8.2 Dynamic characteristics for amplifier b  
Table 11: Dynamic characteristics for amplifier b  
Common source; Tamb = 25 °C; VG2-S = 4 V; VDS = 5 V; ID = 13 mA.  
Symbol Parameter  
Conditions  
Min Typ Max Unit  
yfs  
forward transfer admittance Tj = 25 °C  
28  
-
33  
43  
mS  
Cig1-ss  
Cig2-ss  
Coss  
Crss  
input capacitance at gate 1  
input capacitance at gate 2  
output capacitance  
f = 1 MHz  
f = 1 MHz  
f = 1 MHz  
2.0  
3.4  
0.85  
20  
2.5 pF  
-
-
-
-
pF  
pF  
fF  
-
reverse transfer capacitance f = 1 MHz  
-
[1]  
Gtr  
power gain  
BS = BS(opt); BL = BL(opt)  
f = 200 MHz; GS = 2 mS; GL = 0.5 mS  
f = 400 MHz; GS = 2 mS; GL = 1 mS  
f = 800 MHz; GS = 3.3 mS; GL = 1 mS  
f = 11 MHz; GS = 20 mS; BS = 0 S  
f = 400 MHz; YS = YS(opt)  
31  
28  
24  
-
35  
32  
28  
5
39  
36  
32  
-
dB  
dB  
dB  
dB  
NF  
noise figure  
-
1.3  
1.4  
1.9 dB  
2.1 dB  
f = 800 MHz; YS = YS(opt)  
-
[2]  
Xmod  
cross-modulation  
input level for k = 1%; fw = 50 MHz; funw = 60 MHz  
at 0 dB AGC  
90  
-
-
-
-
-
-
dBµV  
at 10 dB AGC  
88  
94  
dBµV  
dBµV  
dBµV  
at 20 dB AGC  
-
at 40 dB AGC  
100 103  
[1] For the MOS-FET not in use: VG1-S(a) = 0 V; VDS(a) = 0 V.  
[2] Measured in Figure 34 test circuit.  
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Product data sheet  
Rev. 01 — 18 May 2004  
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BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
8.2.1 Graphs for amplifier b  
001aaa568  
001aaa569  
30  
32  
(1)  
(4)  
I
D
(2)  
(3)  
I
D
(1)  
(2)  
(mA)  
(mA)  
24  
(5)  
20  
(3)  
(4)  
(5)  
16  
8
(6)  
(7)  
10  
(6)  
(7)  
0
0
0
0.4  
0.8  
1.2  
1.6  
V
2
(V)  
0
2
4
6
V
(V)  
DS  
G1-S  
(1) VG2-S = 4 V.  
(2) VG2-S = 3.5 V.  
(3) VG2-S = 3 V.  
(4) VG2-S = 2.5 V.  
(5) VG2-S = 2 V.  
(6) VG2-S = 1.5 V.  
(7) VG2-S = 1 V.  
(1) VG1-S(b) = 1.6 V.  
(2) VG1-S(b) = 1.5 V.  
(3) VG1-S(b) = 1.4 V.  
(4) VG1-S(b) = 1.3 V.  
(5) VG1-S(b) = 1.2 V.  
(6) VG1-S(b) = 1.1 V.  
(7) VG1-S(b) = 1 V.  
VDS(b) = 5 V; VDS(a) = VG1-S(a) = 0 V; Tj = 25 °C.  
VG2-S = 4 V; VDS(a) = VG1-S(a) = 0 V; Tj = 25 °C.  
Fig 17. Transfer characteristics; typical values.  
Fig 18. Output characteristics; typical values.  
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Product data sheet  
Rev. 01 — 18 May 2004  
12 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa570  
001aaa571  
100  
40  
(1)  
(2)  
(1)  
(2)  
I
G1  
Y
fs  
(µA)  
(mS)  
(3)  
(3)  
80  
30  
(4)  
(4)  
(5)  
60  
40  
20  
0
20  
10  
0
(5)  
(6)  
(7)  
(6)  
(7)  
0
0.4  
0.8  
1.2  
1.6  
V
2
0
8
16  
24  
32  
(V)  
I (mA)  
D
G1-S  
(1) VG2-S = 4 V.  
(2) VG2-S = 3.5 V.  
(3) VG2-S = 3 V.  
(4) VG2-S = 2.5 V.  
(5) VG2-S = 2 V.  
(6) VG2-S = 1.5 V.  
(7) VG2-S = 1 V.  
(1) VG2-S = 4 V.  
(2) VG2-S = 3.5 V.  
(3) VG2-S = 3 V.  
(4) VG2-S = 2.5 V.  
(5) VG2-S = 2 V.  
(6) VG2-S = 1.5 V.  
(7) VG2-S = 1 V.  
VDS(b) = 5 V; VDS(a) = VG1-S(a) = 0 V; Tj = 25 °C.  
VDS(b) = 5 V; VDS(a) = VG1-S(a) = 0 V; Tj = 25 °C.  
Fig 19. Gate 1 current as a function of gate 1 voltage;  
typical values.  
Fig 20. Forward transfer admittance as a function of  
drain current; typical values.  
001aaa572  
001aaa573  
24  
16  
I
D
I
D
(mA)  
(mA)  
12  
16  
8
4
0
8
0
0
10  
20  
30  
40  
I
50  
(µA)  
0
1
2
3
4
5
V
(V)  
G1  
GG  
VDS(b) = 5 V; VG2-S = 4 V; VDS(a) = VG1-S(a) = 0 V;  
Tj = 25 °C.  
VDS(b) = 5 V; VG2-S = 4 V; VDS(a) = VG1-S(a) = 0 V;  
Tj = 25 °C; RG1(b) = 150 k(connected to VGG); see  
Figure 3.  
Fig 21. Drain current as a function of gate 1 current;  
typical values.  
Fig 22. Drain current as a function of gate 1 supply  
voltage (VGG); typical values.  
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Product data sheet  
Rev. 01 — 18 May 2004  
13 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa574  
001aaa575  
24  
16  
(1)  
(2)  
(3)  
I
D
(1)  
(2)  
I
D
(mA)  
(mA)  
12  
(4)  
(5)  
(3)  
(4)  
16  
(5)  
8
4
0
(6)  
(7)  
(8)  
8
0
0
2
4
6
0
2
4
6
V
= V  
(V)  
V
(V)  
G2-S  
GG  
DS  
(1) RG1(b) = 68 k.  
(2) RG1(b) = 82 k.  
(1) VGG = 5.0 V.  
(2) VGG = 4.5 V.  
(3) VGG = 4.0 V.  
(4) VGG = 3.5 V.  
(5) VGG = 3.0 V.  
(3) RG1(b) = 100 k.  
(4) RG1(b) = 120 k.  
(5) RG1(b) = 150 k.  
(6) RG1(b) = 180 k.  
(7) RG1(b) = 220 k.  
(8) RG1(b) = 270 k.  
VDS(b) = 5 V; VDS(a) = VG1-S(a) = 0 V; Tj = 25 °C;  
RG1(b) = 150 k(connected to VGG); see Figure 3.  
VG2-S = 4 V; VDS(a) = VG1-S(a) = 0 V; Tj = 25 °C;  
RG1(b) is connected to VGG; see Figure 3.  
Fig 23. Drain current as a function of gate 1 (VGG),  
drain supply voltage and value of RG1; typical  
values.  
Fig 24. Drain current as a function of gate 2 voltage;  
typical values.  
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Product data sheet  
Rev. 01 — 18 May 2004  
14 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa576  
001aaa577  
30  
120  
V
unw  
(1)  
(2)  
(3)  
(4)  
(5)  
I
G1  
(dBµV)  
(µA)  
110  
20  
100  
90  
10  
0
80  
0
2
4
6
0
20  
40  
60  
V
(V)  
gain reduction (dB)  
G2-S  
(1) VGG = 5.0 V.  
(2) VGG = 4.5 V.  
(3) VGG = 4.0 V.  
(4) VGG = 3.5 V.  
(5) VGG = 3.0 V.  
VDS(b) = 5 V; VGG = 5 V; VDS(a) = VG1-S(a) = 0 V;  
RG1(b) = 150 k(connected to VGG); fw = 50 MHz;  
funw = 60 MHz; Tamb = 25 °C; see Figure 34.  
VDS(b) = 5 V; VDS(a) = VG1-S(a) = 0 V; Tj = 25 °C;  
RG1(b) = 150 k(connected to VGG); see Figure 3.  
Fig 25. Gate 1 current as a function of gate 2 voltage;  
typical values.  
Fig 26. Unwanted voltage for 1% cross-modulation as a  
function of gain reduction; typical values.  
001aaa578  
001aaa579  
0
16  
gain  
reduction  
I
D
(dB)  
(mA)  
10  
12  
20  
30  
40  
50  
8
4
0
0
1
2
3
4
0
20  
40  
60  
V
(V)  
gain reduction (dB)  
AGC  
VDS(b) = 5 V; VGG = 5 V; VDS(a) = VG1-S(a) = 0 V;  
RG1(b) = 150 k(connected to VGG); f = 50 MHz;  
Tamb = 25 °C; see Figure 34.  
VDS(b) = 5 V; VGG = 5 V; VDS(a) = VG1-S(a) = 0 V;  
RG1(b) = 150 k(connected to VGG); f = 50 MHz;  
Tamb = 25 °C; see Figure 34.  
Fig 27. Typical gain reduction as a function of AGC  
voltage.  
Fig 28. Drain current as a function of gain reduction;  
typical values.  
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Product data sheet  
Rev. 01 — 18 May 2004  
15 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
001aaa581  
001aaa582  
2
2
2
10  
10  
10  
b , g  
is is  
(mS)  
y
fs  
y
−ϕ  
fs  
fs  
10  
(mS)  
(deg)  
b
g
is  
1
10  
10  
−ϕ  
fs  
is  
1  
10  
2  
1
3
10  
1
2
3
2
10  
10  
10  
10  
10  
10  
f (MHz)  
f (MHz)  
VDS(b) = 5 V; VG2-S = 4 V; VDS(a) = VG1-S(a) = 0 V;  
ID(b) = 13 mA.  
VDS(b) = 5 V; VG2-S = 4 V; VDS(a) = VG1-S(a) = 0 V;  
ID(b) = 13 mA.  
Fig 29. Input admittance as a function of frequency;  
typical values.  
Fig 30. Forward transfer admittance and phase as a  
function of frequency; typical values.  
001aaa583  
001aaa584  
3
3
10  
10  
10  
y
−ϕ  
b , g  
os os  
rs  
rs  
(µS)  
(deg)  
(mS)  
−ϕ  
2
2
rs  
b
g
os  
10  
10  
1
y
rs  
os  
1  
10  
10  
10  
2  
1
3
1
10  
2
2
3
10  
10  
10  
10  
10  
10  
f (MHz)  
f (MHz)  
VDS(b) = 5 V; VG2-S = 4 V; VDS(a) = VG1-S(a) = 0 V;  
ID(b) = 13 mA.  
VDS(b) = 5 V; VG2-S = 4 V; VDS(a) = VG1-S(a) = 0 V;  
ID(b) = 13 mA.  
Fig 31. Reverse transfer admittance and phase as a  
function of frequency; typical values.  
Fig 32. Output admittance as a function of frequency;  
typical values.  
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Product data sheet  
Rev. 01 — 18 May 2004  
16 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
8.2.2 Scattering parameters for amplifier b  
Table 12: Scattering parameters for amplifier b  
VDS(b) = 5 V; VG2-S = 4 V; ID(b) = 13 mA; VDS(a) = 0 V; VG1-S(a) = 0 V; Tamb = 25 °C.  
f
S11  
S21  
S12  
S22  
(MHz)  
Magnitude Angle Magnitude Angle Magnitude Angle Magnitude Angle  
ratio  
(deg) ratio  
3.66 3.26  
7.01 3.24  
13.71 3.22  
20.36 3.19  
27.04 3.15  
33.62 3.10  
40.16 3.05  
46.70 2.99  
52.07 2.92  
59.48 2.84  
65.86 2.77  
(deg)  
ratio  
(deg) ratio  
84.23 0.988  
84.91 0.988  
83.96 0.986  
82.86 0.984  
81.88 0.982  
80.92 0.978  
80.15 0.975  
79.68 0.972  
78.28 0.968  
78.28 0.965  
78.15 0.961  
(deg)  
50  
0.986  
0.982  
0.975  
0.966  
0.955  
0.943  
0.927  
0.909  
0.891  
0.868  
0.846  
175.93 0.0008  
172.04 0.0015  
164.24 0.0029  
156.53 0.0042  
148.86 0.0055  
141.24 0.0066  
133.70 0.0076  
126.13 0.0086  
118.64 0.0094  
111.09 0.0100  
103.58 0.0107  
1.65  
100  
200  
300  
400  
500  
600  
700  
800  
900  
1000  
3.27  
6.50  
9.69  
12.88  
16.07  
19.21  
22.35  
25.52  
28.65  
31.85  
8.2.3 Noise data for amplifier b  
Table 13: Noise data for amplifier b  
VDS(b) = 5 V; VG2-S = 4 V; ID(b) = 13 mA; VDS(a) = 0 V; VG1-S(a) = 0 V; Tamb = 25 °C.  
f
Fmin  
(dB)  
Γopt  
rn  
()  
(MHz)  
ratio  
0.695  
0.674  
(deg)  
13.11  
32.77  
400  
800  
1.3  
1.4  
0.694  
0.674  
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Product data sheet  
Rev. 01 — 18 May 2004  
17 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
9. Test information  
V
(a)  
DS  
5V  
V
AGC  
4.7 nF  
10 kΩ  
L1  
2.2 µH  
4.7 nF  
4.7 nF  
d (a)  
S
g1 (a)  
g2  
R
GEN  
50 Ω  
R
L
50 Ω  
4.7 nF  
4.7 nF  
50 Ω  
BF1205C  
V
i
g1 (b)  
d (b)  
L2  
2.2 µH  
50 Ω  
R
G1  
4.7 nF  
V
GG  
0V  
V
(b)  
DS  
5V  
001aaa563  
Fig 33. Cross-modulation test set-up for amplifier a.  
V
(a)  
5V  
V
DS  
AGC  
4.7 nF  
10 kΩ  
L1  
2.2 µH  
4.7 nF  
d (a)  
S
g1 (a)  
4.7 nF  
4.7 nF  
50 Ω  
g2  
BF1205C  
4.7 nF  
g1 (b)  
d (b)  
R
GEN  
50 Ω  
L2  
2.2 µH  
R
L
50 Ω  
50 Ω  
R
G1  
4.7 nF  
V
i
V
(b)  
DS  
5V  
V
GG  
5V  
001aaa580  
Fig 34. Cross-modulation test set-up for amplifier b.  
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Product data sheet  
Rev. 01 — 18 May 2004  
18 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
10. Package outline  
Plastic surface mounted package; 6 leads  
SOT363  
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1  
index  
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B  
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT363  
SC-88  
Fig 35. Package outline.  
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Product data sheet  
Rev. 01 — 18 May 2004  
19 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
11. Revision history  
Table 14: Revision history  
Document ID  
Release date Data sheet status  
20040518 Product data  
Change notice Order number  
9397 750 13005  
Supersedes  
BF1205C_1  
-
-
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Product data sheet  
Rev. 01 — 18 May 2004  
20 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
12. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
13. Definitions  
14. Disclaimers  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
15. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
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Product data sheet  
Rev. 01 — 18 May 2004  
21 of 22  
BF1205C  
Philips Semiconductors  
Dual N-channel dual gate MOS-FET  
16. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data. . . . . . . . . . . . . . . . . . . . . 2  
1.1  
1.2  
1.3  
1.4  
2
3
4
5
6
7
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 3  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4  
8
8.1  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics for amplifier a. . . . . . . 5  
Graphs for amplifier a . . . . . . . . . . . . . . . . . . . . 6  
Scattering parameters for amplifier a . . . . . . . 10  
Noise data for amplifier a . . . . . . . . . . . . . . . . 10  
Dynamic characteristics for amplifier b. . . . . . 11  
Graphs for amplifier b . . . . . . . . . . . . . . . . . . . 12  
Scattering parameters for amplifier b . . . . . . . 17  
Noise data for amplifier b . . . . . . . . . . . . . . . . 17  
8.1.1  
8.1.2  
8.1.3  
8.2  
8.2.1  
8.2.2  
8.2.3  
9
Test information. . . . . . . . . . . . . . . . . . . . . . . . 18  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 21  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
Contact information . . . . . . . . . . . . . . . . . . . . 21  
10  
11  
12  
13  
14  
15  
© Koninklijke Philips Electronics N.V. 2004  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 18 May 2004  
Document order number: 9397 750 13005  
Published in The Netherlands  

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